Non-balanced closed field magnetron sputtering ion plating equipment

A technology of magnetron sputtering and closed field, which is applied in the direction of sputtering plating, ion implantation plating, vacuum evaporation plating, etc., to achieve the effects of easy observation, guaranteed density and adhesion, and convenient opening

Active Publication Date: 2012-09-19
SHENZHEN KINGMAG PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, after experimental analysis, the gas flow controller was manually adjusted, and it was not possible to fully and accurately adjust the pressure after the gas was introduced to an optimal state.

Method used

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  • Non-balanced closed field magnetron sputtering ion plating equipment
  • Non-balanced closed field magnetron sputtering ion plating equipment
  • Non-balanced closed field magnetron sputtering ion plating equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1 of the present invention: as figure 1 , figure 2 As shown, an unbalanced closed-field magnetron sputtering ion plating equipment includes a vacuum chamber 1 and a control cabinet 3, a vacuum control cabinet 2 is provided below the vacuum chamber 1, a manual operation interface 4 and a fully automatic An operation interface 5, a side-opening furnace door 23 is provided on the vacuum chamber 1, an argon gas cylinder 8 and a nitrogen gas cylinder 9 are provided behind the vacuum control cabinet 2, a gas pressure gauge 10 is provided behind the vacuum control cabinet 2, and a gas The flow feedback system 16 is connected with the gas pressure gauge 10 . The vacuum control cabinet 2 includes a diffusion pump, a Roots pump and a mechanical pump; the vacuum control cabinet 2 is provided with an inert gas flowmeter 11 and a monochromator 6 ; and a vacuum gauge 7 is provided above the vacuum chamber 1 . The vacuum degree in the vacuum chamber 1 is 10-1Pa.

[0029...

Embodiment 2

[0035] Embodiment 2 of the present invention: as figure 1 , figure 2 As shown, an unbalanced closed-field magnetron sputtering ion plating equipment includes a vacuum chamber 1 and a control cabinet 3, a vacuum control cabinet 2 is provided below the vacuum chamber 1, a manual operation interface 4 and a fully automatic An operation interface 5, a side-opening furnace door 23 is provided on the vacuum chamber 1, an argon gas cylinder 8 and a nitrogen gas cylinder 9 are provided behind the vacuum control cabinet 2, a gas pressure gauge 10 is provided behind the vacuum control cabinet 2, and a gas The flow feedback system 16 is connected with the gas pressure gauge 10 . The vacuum control cabinet 2 includes a diffusion pump, a Roots pump and a mechanical pump; the vacuum control cabinet 2 is provided with an inert gas flowmeter 11 and a monochromator 6 ; and a vacuum gauge 7 is provided above the vacuum chamber 1 . The vacuum degree in the vacuum chamber 1 is 10-1Pa.

[0036...

Embodiment 3

[0042] Embodiment 3 of the present invention: as figure 1 , figure 2 As shown, an unbalanced closed-field magnetron sputtering ion plating equipment includes a vacuum chamber 1 and a control cabinet 3, a vacuum control cabinet 2 is provided below the vacuum chamber 1, a manual operation interface 4 and a fully automatic An operation interface 5, a side-opening furnace door 23 is provided on the vacuum chamber 1, an argon gas cylinder 8 and a nitrogen gas cylinder 9 are provided behind the vacuum control cabinet 2, a gas pressure gauge 10 is provided behind the vacuum control cabinet 2, and a gas The flow feedback system 16 is connected with the gas pressure gauge 10 . The vacuum control cabinet 2 includes a diffusion pump, a Roots pump and a mechanical pump; the vacuum control cabinet 2 is provided with an inert gas flowmeter 11 and a monochromator 6 ; and a vacuum gauge 7 is provided above the vacuum chamber 1 . The vacuum degree in the vacuum chamber 1 is 10-2Pa.

[0043...

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Abstract

The invention discloses non-balanced closed field magnetron sputtering ion plating equipment comprising a vacuum cavity (1) and a control cabinet (3), wherein a vacuum control cabinet (2) is arranged below the vacuum cavity (1), a manual operation interface (4) and a full-automatic operation interface (5) are arranged on the control cabinet (3), a side-open furnace door (18) is arranged on the vacuum cavity (1), an argon cylinder (8) and a nitrogen cylinder (9) are arranged behind the vacuum control cabinet (2), a gas pressure gauge (10) is arranged on the back surface of the vacuum control cabinet (2), and the equipment is also provided with a gas flow rate feedback system (16) to be connected with the gas pressure gauge (10). The non-balanced closed field magnetron sputtering ion plating equipment disclosed by the invention is provided with the gas flow rate feedback system to determine the concentration of the reaction gas through a glow discharge spectral signal, analyze and judge the regulation range of the gas flow rate and accurately regulate a gas flow rate controller to keep the pressure of the filled gas at the optimal state so as to guarantee the density and adhesiveness of a thin film.

Description

technical field [0001] The invention relates to an unbalanced closed-field magnetron sputtering ion plating equipment, which belongs to the technical field of unbalanced magnetron sputtering deposition. Background technique [0002] Now many materials need to be coated before use. Now almost any material can be coated on the surface of other materials by vacuum coating technology, which opens up a broader prospect for the application of vacuum coating technology in various industrial fields. On the material surface, plugging a layer of film can make the material have many new physical and chemical properties. The film is prepared under vacuum, the environment is clean, the film is not easy to be polluted, and the coating with good density, high purity and uniform film thickness can be obtained. The energy of the particles sputtered by magnetron sputtering vacuum coating is tens of electron volts, and the energy of the particles is large, so the film and the substrate are w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/54C23C14/52
Inventor 文晓斌栾亚
Owner SHENZHEN KINGMAG PRECISION TECH
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