Method for dipulse preplating non-cyanide alkaline copper on ferro matrix

A double-pulse, pre-plating copper technology, which is applied in the field of electroplating copper, can solve the problems of low peak current density, high porosity of the coating, and delamination, and achieve the advantages of reducing concentration polarization, good bonding force of the coating, and high conductivity Effect

Inactive Publication Date: 2013-05-08
SHANDONG JIANZHU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The industrialized method of citrate alkaline cyanide-free copper plating on the iron substrate proposed by CN102234825 is to adopt DC power supply for electroplating under the alkaline condition of citrate double complex system, and the peak current density allowed by DC electroplating method is small , the obtained coating has high porosity, serious delamination, and peeling phenomenon

Method used

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  • Method for dipulse preplating non-cyanide alkaline copper on ferro matrix
  • Method for dipulse preplating non-cyanide alkaline copper on ferro matrix
  • Method for dipulse preplating non-cyanide alkaline copper on ferro matrix

Examples

Experimental program
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Effect test

Embodiment 1

[0028] (1) Prepare alkaline cyanide-free copper plating solution: firstly weigh 40g copper sulfate pentahydrate, 60g sodium citrate, 30g sodium sulfate decahydrate, and 2g potassium thiocyanate, and then weigh the copper sulfate pentahydrate, Sodium citrate, sodium sulfate decahydrate, and potassium thiocyanate are respectively dissolved in a small amount of distilled water or deionized water, and then mixed and stirred to obtain a mixed solution. Measure 50ml of alcoholamine and add to the mixed solution, weigh 6g of sodium hydroxide and use a small amount Dissolve in distilled water or deionized water, add to the mixed solution, dilute the mixed solution to 1 liter, mix well and set aside;

[0029] (2) Iron matrix pretreatment: First, degrease the iron matrix with a certain amount of degreaser at a temperature of 70~80℃. The degreaser used is 8g sodium hydroxide and 38g sodium carbonate per liter. , Sodium phosphate 50g, after the degreasing is completed, clean with hot water a...

Embodiment 2

[0034] The pulse process conditions in the double-pulse alkaline non-cyanide pre-plating copper are: the average forward current density is 0.4A / dm 2 , Reverse average current density 0.13A / dm 2 , The forward pulse width is 600μs, the reverse pulse width is 100μs, the forward cycle is 1000μs, and the reverse cycle is 3000μs. The other steps are the same as in Example 1.

Embodiment 3

[0036] The pulse process conditions in the double-pulse alkaline non-cyanide pre-plating copper are: the average forward current density is 0.8A / dm 2 ,Reverse average current density 0.26A / dm 2 , The forward pulse width is 600μs, the reverse pulse width is 100μs, the forward cycle is 1000μs, and the reverse cycle is 3000μs. The other steps are the same as in Example 1.

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Abstract

The invention belongs to the technical field of electro-coppering and particularly relates to a method for dipulse preplating non-cyanide alkaline copper on a ferro matrix. The method includes the following steps: (1) preparing alkaline non-cyanide copper plating liquid; (2) pretreating the ferro matrix; (3) carrying out dipulse alkaline non-cyanide copper preplating operation; (4) recovering thewaste of the alkaline non-cyanide copper plating liquid after the step (3) is finished and scrubbing the preplated copper layer through water; and (5) carrying out the plating layer detection on the preplated copper layer subjected to water scrubbing and then obtained by the step (4). The method belongs to non-cyanide alkaline coppering, and a dipulse electroc-plating method is used to replace the direct current electro-plating to achieve a preplated copper layer with good bonding force on the matrix of steel. The method disclosed by the invention replaces the conventional toxic cyaniding copper preplating technique and thereby eliminates cyanide pollution.

Description

Technical field [0001] The invention belongs to the technical field of electroplating copper, and specifically relates to a method for double-pulse pre-plating non-cyanide alkali copper on an iron substrate. Background technique [0002] The main problem to be solved by cyanide-free copper pre-plating is to improve the bonding force between the substrate and the coating, especially using steel or zinc alloy die castings as the substrate material. For a long time, people have used various methods and approaches to overcome this problem, among which the commonly used method is to form a new complex plating solution by selecting a complexing agent with strong complexing ability or to use a prepreg method. [0003] At present, copper electroplating technology mostly uses DC power supply. Among them, cyanide copper plating can also use a periodic reversing power supply, and pyrophosphate copper plating should use a one-way full-wave or one-way half-wave DC power supply. The industriali...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/18C25D3/38
Inventor 郭晓斐王玥冯立明王景张华平杨红梅
Owner SHANDONG JIANZHU UNIV
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