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Aluminum low-temperature soft solder and manufacturing method thereof

A soldering material and low temperature technology, which is applied in the field of low temperature soldering material for aluminum and its preparation, can solve problems such as complicated processes, and achieve the effects of simple process, narrow melting interval and uniform melting of soldering material.

Inactive Publication Date: 2015-02-25
TAIYUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of a low-temperature solder for aluminum and its preparation method of the present invention is to: aim at the deficiencies and problems in the above-mentioned prior art, in order to solve the problem of complicated process in the above-mentioned prior art, thereby provide a kind of using steel mold slow cooling Prepare Sn~Pb~Zn solder, and use it for wetting or connecting aluminum and aluminum alloys, to ensure good brazing process and joint mechanical properties, simple and practical low-temperature solder for aluminum and technical scheme of its preparation method

Method used

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  • Aluminum low-temperature soft solder and manufacturing method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0016] Component formula: The components and content of the solder are as follows: SnPb eutectic 92%, AgCu eutectic 1.5%, Zn6%, Bi0.5%.

[0017] Preparation:

[0018] Prepare the raw materials according to the above ratio, first put the SnPb eutectic solder into the quartz container to melt, then add AgCu eutectic and heat up to 800°C, then add Zn, Bi, Sb wrapped in tin foil, and melt it , then slowly cooled to 180°C, and the steel mold was heated to 180°C to ensure the fluidity of the cast solder, and the cast solder was cooled to room temperature to obtain aluminum solder. figure 1 Metallographic diagram of the solder. The melting temperature range of the prepared solder is 180°C, and the brazing temperature is 230°C. Brazing in a flux furnace is used, and the shear strength of the brazed 6061 aluminum alloy joint is 20Mpa.

Embodiment approach 2

[0020] Component formula: SnPb eutectic 93%, AgCu eutectic 1.5%, Zn6%, Bi0.5%.

[0021] Preparation method: Prepare the raw materials according to the above ratio, first put the SnPb eutectic solder into the quartz container to melt, then add the AgCu eutectic and heat up to 950°C, then add Zn, Bi, Sb wrapped in tin foil, Melt it, then slowly cool it down to 950°C, heat the steel mold to 190°C to ensure the fluidity of the cast solder, and cool the cast solder to room temperature to obtain aluminum solder. The melting temperature of the prepared brazing material is 195°C, and the brazing temperature is 300°C, and the aluminum alloy is wetted in a flux furnace, and the wetting angle is at least 20 degrees, and the wettability is very good.

Embodiment approach 3

[0023] Component formula: SnPb eutectic 90%, AgCu eutectic 2%, Zn7%, Bi1%

[0024] Preparation method: Prepare the raw materials according to the above ratio, put the SnPb eutectic solder into the quartz container and melt it, then add AgCu eutectic and heat up to 1000°C, then add Zn, Bi, Sb wrapped in tin foil, Melt it, then slowly cool it down to 200°C; heat the steel mold to 200°C to ensure the fluidity of the cast solder; cool the cast solder to room temperature to obtain aluminum solder. The melting temperature of the prepared brazing material is 190°C, and the brazing temperature is 280°C, and the aluminum alloy is wetted in the flux furnace, and the wetting angle is at least 17 degrees, and the wettability is very good.

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Abstract

The invention discloses an aluminum low-temperature soft solder and a manufacturing method thereof and belongs to the technical field of welding. The aluminum low-temperature soft solder is characterized by comprising the following components in percentage by mass: 90 to 92 percent of SnPb eutectic alloy, 1.5 to 2 percent of AgCu, 6 to 10 percent of Zn and 0.5 to 1 percent of Bi. The Sn-Pb-Zn solder is manufactured through steel die slow cooling and is used for wetting or connecting aluminum and aluminum alloy, and high brazing manufacturability and joint mechanical property are guaranteed. The maximum joint strength is 20MPa and is higher than that of the aluminum alloy joint manufactured by the conventional method, the process is simple, and an intermediate layer is not required. By adoption of AgCu eutectic and Zn and Bi elements, a liquidus of the solder is basically invariable, a melting range of a solder manufactured by a steel die rapid cooling process is narrow, the solder is uniformly melted, and the alloying element has high diffusion capability, so that the solder manufactured by a steel die has high wettability.

Description

technical field [0001] The invention relates to a low-temperature solder for aluminum and a preparation method thereof, which belong to the technical field of welding, and specifically relate to a technical scheme of a low-temperature solder for aluminum and a preparation method thereof. Background technique [0002] Aluminum alloy has the characteristics of light weight, good corrosion resistance and good thermal and electrical conductivity. It is more and more widely used in military and civilian industries such as aviation, aerospace, electronics, automobiles, and building materials. However, since the aluminum alloy surface is easy to form a dense oxide layer, it is difficult for the solder to wet the aluminum alloy surface, so the brazing of aluminum alloys is still limited to individual grades such as pure aluminum and 6063, and a large number of aluminum alloys with higher strength levels cannot be used. Perform brazing. On the other hand, due to the demand for ligh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26C22C13/00B22D27/04
Inventor 丁敏章敏张培磊胡连海李黎忱程伟丽阙仲萍
Owner TAIYUAN UNIV OF TECH