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Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof

A technology of phenolic compounds and epoxy resins, applied in the field of epoxy resins, epoxy resin compositions, and new phenolic compounds, can solve the problem that the curing agent cannot be cured, the service life of the cured product is difficult to ensure, and the thermal conductivity of the cured product does not meet the market needs. and other problems, to achieve the effect of uniform cured product, excellent solvent solubility and excellent thermal conductivity

Active Publication Date: 2012-10-17
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these amine curing agents have a curing acceleration effect, so it is difficult to ensure the service life of the cured product, and cannot be called an ideal curing agent.
In Patent Document 4, as an example of using a phenolic compound as a curing agent, a catechol novolac resin is used, but the thermal conductivity of the cured product obtained by the method described in this document has not yet reached a level that meets market needs. Epoxy resin composition developed to provide cured product with higher thermal conductivity

Method used

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  • Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof
  • Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof
  • Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0132] 136 parts of 4'-hydroxyacetophenone, 152 parts of vanillin, and 200 parts of ethanol were put into a flask equipped with a stirrer, a reflux condenser, and a stirring device, and dissolved. After adding 20 parts of 97 mass % sulfuric acid to this, it heated up to 60 degreeC and was made to react at this temperature for 10 hours, Then, the reaction liquid was inject|poured into 1200 parts of water, and it crystallized. After the crystals were filtered out, washed twice with 600 parts of water, and then vacuum-dried, 256 parts of phenolic compound 1 as yellow crystals were obtained. The endothermic peak temperature of the resulting crystals measured by DSC was 233°C.

Embodiment 2

[0134] 166 parts of 4'-hydroxy-3'-methoxyacetophenone, 122 parts of 4-hydroxybenzaldehyde, and 200 parts of ethanol were put into a flask equipped with a stirrer, a reflux condenser, and a stirring device, and dissolved. After adding 20 parts of 97% sulfuric acid thereto, the temperature was raised to 50° C., and the reaction was carried out at this temperature for 10 hours. Then, the reaction liquid was poured into 1200 parts of water to crystallize. After the crystals were filtered out, washed twice with 600 parts of water, and then vacuum-dried to obtain 285 parts of phenolic compound 2 as dark brown crystals. The endothermic peak temperature of the obtained crystals measured by DSC was 193°C.

Embodiment 3

[0136] 56 parts of 4-methylcyclohexanone, 152 parts of vanillin, and 150 parts of ethanol were charged and dissolved in a flask equipped with a stirrer, a reflux condenser, and a stirring device. After adding 10 parts of 97 mass % sulfuric acid to this, it heated up to 50 degreeC and was made to react at this temperature for 10 hours, and then added 25 parts of sodium tripolyphosphates, and stirred for 30 minutes. Then, after adding 500 parts of methyl isobutyl ketone, water washing was performed twice with 200 parts of water, and the solvent was distilled off by an evaporator to obtain 304 parts of semi-solid phenol compound 3 .

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Abstract

Provided are a phenolic compound and an epoxy resin that have excellent solubility in solvents and that provide cured products exhibiting high thermal conductivity. The disclosed phenolic compound is prepared, for example, by the reaction of a compound represented by formula (1) with a compound represented by formula (6), the formulas being set forth in claim 1. The disclosed epoxy resin is prepared by reacting said phenolic compound with an epihalohydrin.

Description

technical field [0001] The present invention relates to novel phenolic compounds, epoxy resins and epoxy resin compositions. Moreover, this invention relates to the hardened|cured material, such as a prepreg which consists of this epoxy resin composition. Background technique [0002] Epoxy resin compositions generally form cured products with excellent mechanical properties, water resistance, chemical resistance, heat resistance, and electrical properties, and are used in a wide range of fields such as adhesives, coatings, laminates, molding materials, and injection molding materials. In recent years, the cured products of epoxy resins used in the above fields have begun to be highly purified, and further improvements in flame retardancy, heat resistance, moisture resistance, toughness, low linear expansion coefficient, and low dielectric constant characteristics have been required. characteristic. [0003] In particular, in the field of the electrical and electronic indu...

Claims

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Application Information

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IPC IPC(8): C08G59/20C07C49/753C07C49/84C08J5/24C08K3/00C08L63/00H01L23/29H01L23/31
CPCC07C49/753C07C49/84H01L23/296C07C45/68H01L23/295C08G59/08C08J2363/00C08J5/24C07C45/74C08J5/244C08J5/249H01L2924/0002H01L2924/00C08G59/063C08G59/20
Inventor 川井宏一押见克彦须永高男井上一真
Owner NIPPON KAYAKU CO LTD