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Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board

A photosensitive composition and photosensitivity technology, which is applied in the fields of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the compromise of flame retardancy and folding resistance, and has not developed a combination of flame retardancy and folding resistance photosensitivity and other problems, to achieve the effect of excellent folding resistance and flame retardancy

Inactive Publication Date: 2012-10-17
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, although the photosensitive composition used for flexible circuit boards is required to have excellent flame retardancy and excellent folding resistance, the flame retardancy and folding resistance are in a trade-off relationship
Therefore, a photosensitive composition having excellent flame retardancy and excellent folding resistance, a photosensitive film using the photosensitive composition, a photosensitive laminate, a method for forming a permanent pattern, and a printed circuit board have not yet been developed.

Method used

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  • Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
  • Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
  • Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0345] -Synthesis of photosensitive polyurethane resin U1-

[0346] In a 500 mL three-neck round bottom flask equipped with a condenser and a stirrer, 10.22g (0.069mol) 2,2-bis(hydroxymethyl)butyric acid (DMBA), 12.97g (0.081mol) monomethacrylic acid Glycerides (GLM) and 4.80 g (0.004 mol) polypropylene glycol (molecular weight: 1,200) (PPG 1,200) were dissolved in 79 mL of propylene glycol monomethyl ether monoacetate. To this solution, 37.54g (0.15mol) 4,4-diphenylmethane diisocyanate (MDI), 0.1g 2,6-di-tert-butylhydroxytoluene and 0.2g NEOSTAN U-600 (from Nitto Kasei Co. Ltd.), and the mixture was stirred at 75°C for 5 hours. Thereafter, the solution was diluted with 9.61 mL of methanol and the resulting diluted solution was stirred for 30 minutes to obtain 145 g of a photosensitive polyurethane resin U1 solution (solid content: 45% by mass).

[0347] The obtained photosensitive polyurethane resin U1 had an acid value of 65 mgKOH / g, as measured by gel permeation chromatography...

Embodiment 2

[0352] -Synthesis of photosensitive polyurethane resin U2 (when the diisocyanate compound does not contain aromatic compounds)-

[0353] A photosensitive polyurethane resin U2 solution (solid content: 45% by mass) was prepared in the same manner as in Synthesis Example 1, except that 37.54 g (0.15 mol) of 4,4-diphenylmethane diisocyanate (MDI) Change to 30.03g (0.12mol) isophorone diisocyanate (IPDI).

Embodiment 3

[0355] -Synthesis of photosensitive polyurethane resin U3 (when the polymer polyol compound has a mass average molecular weight less than 400)-

[0356] A photosensitive polyurethane resin U3 solution (solid content: 45% by mass) was prepared in the same manner as in Synthesis Example 1, except that 4.80 g (0.004 mol) of polypropylene glycol (mass average molecular weight: 1,200) (PPG1200) was changed It is 1.20g (0.004mol) polypropylene glycol (mass average molecular weight: 300) (PPG300).

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PUM

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Abstract

Disclosed are: a photosensitive composition having excellent folding resistance and flame retardancy; a photosensitive film using the photosensitive composition; a photosensitive laminate; a method for forming a permanent pattern; and a printed board. Specifically disclosed is a photosensitive composition which contains at least a photosensitive polyurethane resin, a phosphorus-containing flame retardant, a polymerizable compound and a photopolymerization initiator. The photosensitive polyurethane resin contains an ethylenically unsaturated bonding group and a carboxyl group, while having a polyurethane skeleton that contains a polyol group as a repeating unit. It is preferable that the photosensitive polyurethane resin is obtained by reacting a polymer polyol compound, a diisocyanate compound, a (meth)acrylate compound having two hydroxy groups in each molecule and a carboxylic acid having two hydroxy groups in each molecule.

Description

Technical field [0001] The present invention relates to a photosensitive composition suitable as a solder resist material for a flexible circuit board, a photosensitive film using the photosensitive composition, and a photosensitive laminate for forming a permanent pattern Method and printed circuit board. Background technique [0002] Generally, in the formation of a permanent pattern such as a solder resist, a photosensitive film formed by applying a photosensitive composition on a support and drying the coating has been used to form a photosensitive layer. The method for forming a permanent pattern such as a solder resist includes, for example, a method including: laminating a photosensitive film on a substrate on which the permanent pattern is to be formed, such as a copper clad laminate, to form a laminate; The photosensitive layer in the body is exposed; after the exposure, the photosensitive layer is developed to form a pattern; then, the pattern is cured to form a perman...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004H05K3/28
CPCH05K2201/012H05K3/287G03F7/027G03F7/035G03F7/031C08F290/141G03F7/0045
Inventor 富泽秀树南一守有冈大辅
Owner FUJIFILM CORP