Manufacture process of carbon type superconductive heat radiator
A manufacturing process and heat sink technology, applied in the field of heat sink manufacturing process, can solve problems such as restricting the application range of graphite materials and molding difficulties, and achieve the effects of promoting the development of miniaturization, compact structure, and good heat dissipation performance
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Embodiment 1
[0021] plan B:
[0022] The manufacturing process of a carbon-type superconducting heat sink provided by the present invention adopts mixing and injection molding to form a carbon heat sink, and includes the following steps: first, put two-dimensional carbon molecular raw materials and catalytic accelerators into a ball mill or a mixer to uniformly Blend and grind, then fill the powder that has been uniformly blended and ground into the extrusion molding machine, extrude and granulate at a constant temperature of 60-100 degrees, put the granulated material into the injection molding machine for model injection molding, and The embryo body after injection molding is subjected to surface smoothing treatment and surface carbonization crystallization treatment. During the production process, the function of the catalyst is to temporarily bond the carbon molecular raw materials, so that the compatibility of the mixture is greatly improved, which is beneficial to the pressure inject...
Embodiment 2
[0025] According to the manufacturing process provided by the present invention, the resulting carbon heat sink is a brand-new heat-conducting and heat-dissipating material, which has a unique grain orientation, conducts heat evenly in two directions, and has a lamellar structure that can well adapt to any surface for uniform heat dissipation . The carbon radiator has ultra-high thermal conductivity in the range of 150-1500 W / m-K in each blade plane.
[0026] The resulting product has the following properties:
[0027] 1. Product features: the surface can be combined with metal, plastic, stickers and other materials to meet more design functions and needs.
[0028] 2. Low thermal resistance: thermal resistance is 40% lower than aluminum and 20% lower than copper
[0029] 3. Light weight: 25% lighter than aluminum and 75% lighter than copper
[0030] 4. High thermal conductivity: 100-1500 W / mK.
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