Silver conductive composition without screen printing and used for line manufacturing

A conductive composition and screen printing technology, applied in the field of electronics, can solve problems such as difficult printing, achieve the effects of improving conductivity, ensuring cross-sectional area, and improving production efficiency

Inactive Publication Date: 2014-05-07
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In recent years, with the improvement of screen printing technology, patterns with higher precision and higher resolution can be printed, but the use of screen technology is limited by the mesh itself, as well as by ink, viscosity, viscosity, and silver powder particle size. , the influence of additives, so that the printing accuracy is greatly challenged, it is difficult to print a circuit with high precision and good conductivity. In order to solve this problem, the traditional technology that requires screen can be abandoned, and such a turning point can be brought The new technology is the photopolymer material

Method used

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  • Silver conductive composition without screen printing and used for line manufacturing
  • Silver conductive composition without screen printing and used for line manufacturing
  • Silver conductive composition without screen printing and used for line manufacturing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A kind of silver conductive composition that does not need screen printing for circuit manufacturing, it comprises the component of following percentage by weight:

[0031]

[0032] The preparation method of the above-mentioned silver conductive composition without screen printing for circuit manufacturing: mix polyacrylic acid derivatives, polystyrene methyl methacrylate, 1173 photoinitiator, triphenylamine and silver in the formula amount, dissolve in In cyclohexanone, stir under dark conditions, and then grind until the particle size is below 5 μm.

[0033] The method for manufacturing the circuit from the above-mentioned silver conductive composition is as follows: the silver conductive composition used for circuit manufacturing that does not require screen printing is coated on the substrate by roll coating, spray coating, or spin coating, and after drying, it is dried The thickness of the paint film is controlled at 25-50 μm according to the needs of electrical...

Embodiment 2

[0036] A kind of silver conductive composition that does not need screen printing for circuit manufacturing, it comprises the component of following percentage by weight:

[0037]

[0038] The method for preparing the silver conductive composition without screen printing and the method for manufacturing the circuit are the same as in Example 1.

[0039] Effects of Examples: Under the conditions of 80°C and 300W ultraviolet light irradiation, the artificial accelerated aging test has an aging resistance time of 100d and a temperature resistance of 300°C. Resistance 4*10 -5 Ω.cm. The printed line width is 25 microns, the lines are clear, the edges are neat, and there is no adhesion. The light curing time is 15 seconds.

Embodiment 3

[0041] A kind of silver conductive composition that does not need screen printing for circuit manufacturing, it comprises the component of following percentage by weight:

[0042]

[0043] The method for preparing the silver conductive composition without screen printing and the method for manufacturing the circuit are the same as in Example 1.

[0044] Effects of Examples: Under the conditions of 80°C and 300W ultraviolet light irradiation, the artificial accelerated aging test has an aging resistance time of 95 days and a temperature resistance of 280°C. Resistance 1.9*10 -4 Ω.cm. The printed line width is 50 microns, the lines are clear, the edges are neat, and there is no adhesion. The light curing time is 30 seconds.

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Abstract

The invention discloses a silver conductive composition without screen printing and used for line manufacturing. The silver conductive composition comprises components with the following weight percentages: 15-20% of polyacrylic acid derivative, 10-20% of polystyrene methyl methacrylate, 1-10% cyclohexanone, 5% 1173photoinitiator, 1-10% triphenylamine, and 40-60% of silver. The invention also discloses a method for preparing the silver conductive composition without screen printing and used for line manufacturing, and application thereof in preparation of electronic circuits of color plasma flat-panel displays. With the method, electronic circuits lower than 20-50[mu]m can be produced. Height of the circuits can be adjusted, thereby ensuring sectional areas of the circuits, improving conductivity. Compared with screen printing, the method improves production efficiency.

Description

technical field [0001] The invention belongs to the field of electronics and relates to a silver conductive composition. Background technique [0002] In recent years, color plasma flat panel display (PDP) has received widespread attention due to its large screen and high image quality, and the fineness of PDP electrodes will directly affect the performance of the display. Photosensitive silver glue is mainly used to prepare the bus electrodes of the front substrate of PDP And the rear substrate site selection electrode, using photosensitive silver paste photolithography to make electrodes, can not only realize large-area, high-definition electrode patterns, but also reduce process and equipment costs, and solve the shortcomings of low precision that are difficult to overcome by screen printing, thereby Become the main method of making PDP electrodes. [0003] Different light-curing systems photosensitive silver affect the properties and time of curing materials, and direct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00H01J9/02
Inventor 高延敏
Owner JIANGSU UNIV OF SCI & TECH
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