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Disk ceramic dielectric capacitor with vacuum sputtered multilayer metal electrode, and preparation method thereof

A multi-layer metal, vacuum sputtering technology, used in capacitors, fixed capacitors, fixed capacitor electrodes, etc., can solve problems such as affecting product reliability, damage to ceramic-intermediate structures, and complex processes

Active Publication Date: 2012-11-28
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Disadvantages: 1) Silver is a precious metal, and the material cost is high;
[0006] 2) There are many processes;
[0007] 3) The component is prone to silver ion migration during long-term application, which reduces the reliability of the component
The application uses the chemical deposition method to prepare the electrode, which has defects such as complex process, easy to cause damage to the ceramic structure, and affect product reliability.

Method used

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  • Disk ceramic dielectric capacitor with vacuum sputtered multilayer metal electrode, and preparation method thereof
  • Disk ceramic dielectric capacitor with vacuum sputtered multilayer metal electrode, and preparation method thereof
  • Disk ceramic dielectric capacitor with vacuum sputtered multilayer metal electrode, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The production process of the present invention is as image 3 shown.

[0037] Firstly, the ceramic substrate 3 is prepared: the green body is formed, the sheets are arranged and placed in a bowl, and sintered. Clean the sintered tiles, select the appearance, and discharge them into a special mold for coating to prepare the ceramic substrate 3 . The structural design of the capacitor first designs the thickness of the ceramic substrate according to the withstand voltage level of the capacitor, then designs the diameter of the copper electrode and the diameter of the ceramic substrate according to the capacitance, and the capacitor chip size can be determined by the thickness and diameter of the ceramic substrate 3; finally Then design the corresponding lead shape and product size according to the needs of the circuit.

[0038] Again, clean and dry the ceramic substrate 3, and then use the vacuum sputtering method for coating, the metal inner layer coating metal target...

Embodiment 2

[0045] Embodiment 2 adopts the same technological process as Embodiment 1, except that the ratio of the metal inner coating metal target used is W25%-Al75% alloy metal target, and the sputtering thickness is 0.07 μm. The copper metal outer layer coating adopts Cr2%-Cu98% metal target, and the sputtering thickness is 2.5μm.

[0046] Through the above formula and steps, each group of ceramic capacitor products was prepared, and the electrical properties of the manufactured Y5V, Y5U, and Y5P products were tested respectively. The results are shown in Table 2:

[0047] Table 2

[0048] category

[0049] The result is qualified.

Embodiment 3

[0051] Embodiment 3 adopts the same process flow as Embodiment 1, except that the metal inner coating metal target used is an Al metal target, and the sputtering thickness is 0.09 μm. Copper metal outer layer coating adopts copper metal target, sputtering thickness is 3.5μm

[0052] Through the above formula and steps, each group of ceramic capacitor products was prepared, and the electrical performance of the manufactured Y5V, Y5U, and Y5P products were tested respectively. The results are shown in Table 3:

[0053] table 3

[0054] category

[0055] The result is qualified.

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Abstract

The invention discloses a preparation method for a disk ceramic dielectric capacitor with a vacuum sputtered multilayer metal electrode. The preparation method comprises the following steps: (1) preparing a ceramic substrate; (2) performing surface cleaning and drying on the ceramic substrate; (3) using a vacuum sputtering method to sputter a metal inner layer coating film and a copper metal outer layer in turn on a surface of the ceramic substrate; (4) and welding an external lead, performing insulation sealing and testing. The preparation method uses a vacuum multilayer metal plating technology to produce the disk ceramic dielectric capacitor with multilayer electrode which is mainly made of base metal copper, and a process is simplified without destroying a ceramic dielectric structure. In particular, the used multilayer filming makes a product have good adhesion and soldering resistance, and ensures electrical property is qualified.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to the technical field of disc ceramic capacitors. Background technique [0002] Disc ceramic capacitors are an important basic electronic component, widely used in home appliances, communications, power supply, industrial equipment and other fields. [0003] At present, this type of component is manufactured by printing silver electrode paste on the ceramic substrate, and after drying, the silver electrode is reduced to form a silver electrode on the ceramic substrate, and then welded and encapsulated in the subsequent process to produce a disc ceramic capacitor. . [0004] The advantage of the existing silver electrode technology is that the technology is mature and suitable for mass production. [0005] Disadvantages: 1) Silver is a precious metal, and the material cost is high; [0006] 2) There are many processes; [0007] 3) The component is prone to silver ion migratio...

Claims

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Application Information

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IPC IPC(8): H01G4/00H01G4/008
Inventor 李庆强付振晓王维白清新欧建伟沓世我
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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