Silicon carbide particle reinforced aluminum matrix composite and preparation method thereof

A technology of silicon carbide particles and composite materials, which is applied in the field of silicon carbide particle reinforced aluminum-based composite materials and its preparation, can solve the problems of easy precipitation of coarse grains, reduced mechanical properties and thermal conductivity of composite materials, and extremely high atmosphere requirements. The effect of improving mechanical properties and thermal conductivity, improving metallographic structure and improving mechanical properties

Active Publication Date: 2012-12-05
BYD CO LTD
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Problems solved by technology

However, there are still several shortcomings: first, due to the high content of silicon used, it is easy to precipitate coarse grains during the cooling process, and it is also easy to form shrinkage holes inside due to large shrinkage, which reduces the mechanical properties of the composite material. and thermal conductivity; second, due to the characteristics of liquid aluminum that is easy to absorb hydrogen and oxidize, it has extremely high requirements on the atmosphere, and it is difficult to avoid the formation of pores and defects inside the composite material, which will also seriously affect the final performance of the product

Method used

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  • Silicon carbide particle reinforced aluminum matrix composite and preparation method thereof

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[0016] The present invention also provides a method for preparing a silicon carbide particle-reinforced aluminum-based composite material, the method comprising the following steps:

[0017] S1 mixes silicon carbide micropowder and paraffin-based binder, and adopts hot die-casting to form a SiC skeleton prepared after debinding and sintering;

[0018] S2 Accurately weigh aluminum, magnesium, silicon, and rare earth, and prepare aluminum alloy blocks of appropriate shape and size by vacuum induction melting, gravity casting or rolling;

[0019] S3 put the aluminum alloy block on the silicon carbide skeleton and put them together into the atmosphere furnace for pressureless impregnation, pass through nitrogen protection, heat up to 850-950°C, take it out after keeping it for 1-4h, and cool it to room temperature with nitrogen to obtain composite material.

[0020] The paraffin-based binder is a mixture formed by dissolving the binder in paraffin.

[0021] The more specific ste...

Embodiment 1

[0028] (1) Weigh silicon carbide micropowder and paraffin-based binder, pour the two into a blender and mix for 2 hours at 130°C;

[0029] (2) Pour the uniformly mixed slurry into a hot die-casting machine for hot die-casting at a hot die-casting temperature of 150°C, then water-cool the mold and demould to obtain a green body of SiC and paraffin;

[0030] (3) Place the demoulded SiC and paraffin body on a porous alumina plate, and carry out debinding and sintering in the debinding furnace. Specifically, the furnace temperature is first raised to 200°C, and the paraffin is removed by keeping the temperature for 1 hour, and then Raise the furnace temperature to 600°C, keep the temperature for 1 hour to remove the adhesive, and finally raise the temperature to 1200°C, keep the temperature for 1 hour for sintering. Finally, after cooling with the furnace, the required SiC skeleton is obtained;

[0031] (4) Weigh aluminum: 88.5 parts by weight, silicon: 8.0 parts by weight, magne...

Embodiment 2

[0034] (1) Weigh silicon carbide micropowder and paraffin-based binder, pour the two into a blender and mix for 2 hours at 130°C;

[0035](2) Pour the uniformly mixed slurry into a hot die-casting machine for hot die-casting at a hot die-casting temperature of 150°C, then water-cool the mold and demould to obtain a green body of SiC and paraffin;

[0036] (3) Place the demoulded SiC and paraffin body on a porous alumina plate, and carry out debinding and sintering in the debinding furnace. Specifically, the furnace temperature is first raised to 200°C, and the paraffin is removed by keeping the temperature for 1 hour, and then Raise the furnace temperature to 600°C, keep the temperature for 1 hour to remove the adhesive, and finally raise the temperature to 1200°C, keep the temperature for 1 hour for sintering. Finally, after cooling with the furnace, the required SiC skeleton is obtained;

[0037] (4) Weighing aluminum: 88.5 parts by weight, silicon: 8.0 parts by weight, mag...

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Abstract

The invention provides silicon carbide particle reinforced aluminum matrix composite which comprises, based on the total volume of the composite, 60-70vol% of silicon carbide and 25-40vol% of aluminum alloy. The aluminum alloy comprises, based on the total weight of the aluminum alloy, 74-90.9wt% of aluminum, 8.0-15.0wt% of silicone, 1.0-10.0wt% of magnesium, and 0.1-2wt% of rare earth. The invention further provides a preparation method of the silicon carbide particle reinforced aluminum matrix composite. The silicon carbide particle reinforced aluminum matrix composite is small in crystalline grain size, low in amount of shrinkage hole, air holes and impurities, and fine in mechanical properties and thermal conductivity.

Description

technical field [0001] The invention relates to a silicon carbide particle reinforced aluminum-based composite material and a preparation method thereof. Background technique [0002] Particle-reinforced aluminum matrix composites are the most studied and widely used composite materials in the field of composite materials. High volume fraction (>60vol%) SiC / Al composites have excellent physical and mechanical properties, such as 2-3 times the specific strength of titanium alloys, high dimensional stability superior to beryllium materials, and compatibility with steel and titanium The low linear expansion coefficient matched with alloys and even ceramic substrates, the thermal conductivity equivalent to the strength of beryllium materials and silicon carbide ceramics, the yield strength much higher than that of aluminum alloys, and the fracture toughness equivalent to cast aluminum alloys have become the most ideal. One of the electronic packaging materials. At the same ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22D19/02C22C32/00
Inventor 张旭林勇钊徐述荣林信平
Owner BYD CO LTD
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