Nanostructure composite LED (Light Emitting Diode) ceramic substrate and manufacturing method thereof

A nanostructure composite, ceramic substrate technology, applied in the direction of printed circuit manufacturing, electrical components, printed circuit components, etc., can solve the problems of poor adaptability, low yield, poor antistatic performance, etc., to reduce costs and product quality. Good results with low purity requirements

Inactive Publication Date: 2012-12-12
佛山市煜丰机械有限公司 +1
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Problems solved by technology

The performance and quality of ceramic substrates depends on the preparation process of alumina ceramics. The preparation method of conventional ceramic substrates has poor adaptability, low yield, insufficient insulation performance and poor antistatic performance, and no anti-interference ability. The purity requirements of the main material alumina powder are high, generally reaching more than 99.5%

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  • Nanostructure composite LED (Light Emitting Diode) ceramic substrate and manufacturing method thereof

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Embodiment Construction

[0037] As a preferred embodiment, the technical process see figure 1 ,right figure 1 A method for manufacturing a nanostructure composite LED ceramic substrate according to the steps shown, is characterized in that it comprises the following steps:

[0038] a. Mixing powder, according to the weight percentage of the powder, 80% of alumina with a purity of >95%, 15% of zinc oxide and magnesium oxide, 5% of rare earth elements and nano-inorganic polymers, among which nano-inorganic polymers are one-dimensional Any value <100nm, the particle size of the rest of the powder is 1~2μm, the ambient temperature is maintained between 15°C~25°C, the temperature is 65%, and the circulating wind speed is less than 0.5m / s;

[0039] b. Mixing, mix the prepared powder and pure water in a ratio of 1:2 to form a slurry, and add an appropriate amount of chemical abrasive to the code name CM5, the resistance value of pure water is >5MΩ, and the pure water is allowed to stand It should not excee...

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Abstract

The invention discloses a nanostructure composite LED (Light Emitting Diode) ceramic substrate and a manufacturing method thereof. The key steps of the manufacturing method are as follows: aluminum oxide with the purity of over 95% is taken as a primary ingredient, zinc oxide and magnesium oxide, which form semiconducting electronic ceramics of a particle boundary layer, are taken as secondary ingredients, and additionally, rare-earth elements and nano inorganic polymers, which can be used for improving the conductivity, electron mobility, intercalation and doping of the composite ceramic particle boundary layer, are taken as microscale ingredients; during manufacturing, pure water is taken as proportioning water; and the nanostructure composite LED ceramic substrate manufactured through a series of procedures and specific processes has the characteristics of nonconducting performance, antistatic performance, electromagnetic interference resistance, 0% of water immersion, longitudinal heat conductivity higher than transverse heat conductivity, two excellent heat dissipating modes, i.e., heat conduction and infrared radiation, and the like, has no any toxic components, and is environmentally-friendly, safe and especially suitable for being used as a high-power LED substrate.

Description

technical field [0001] The invention relates to a ceramic plate, in particular to a nanostructure composite LED ceramic plate used for LED substrates and a manufacturing method thereof. Background technique [0002] Alumina ceramic substrates are widely used in fields such as machinery, instrumentation, and electronics because of their extremely high mechanical strength and good heat dissipation performance. In the field of electronics, especially in the field of LED lighting, because LED lights have the characteristics of high luminous efficiency, long practical life, less failures, fast start-up speed, small size, light weight, various color effects, and dynamic color effects, etc. With the advancement of technology, the demand for LED lamps is increasing, and the power of LED lamps is also increasing, and its heat dissipation technology is constantly updated. Gradually replace expensive materials such as metal composite aluminum. However, electronic products have higher...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02
Inventor 吴建朋刘明炎
Owner 佛山市煜丰机械有限公司
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