High-purity Cu bonding wire

A high-purity, lead-in technology, used in electrical components, circuits, electrical solid devices, etc., can solve problems such as excellent hardness, inability to draw circuits, and IC chip cracks

Inactive Publication Date: 2013-01-02
TANAKA DENSHI KOGYO KK
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  • Summary
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  • Claims
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Problems solved by technology

However, when there is oxygen in the ball bonding atmosphere, even the high-purity copper alloy lead, the initial solder ball (FAB) will not form a spherical shape, or the initial solder ball (FAB) will become too hard, causing the IC chip of the semiconductor to crack The pro

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[0043] Example 1

[0044] [Method of manufacturing copper lead wire for ball bonding]

[0045] The manufacturing method of the copper alloy lead wire for ball bonding concerning this invention is demonstrated. Use 99.9999 mass% or more of high purity copper (Cu) metal (as Cu raw material metal [A]) and 99.999 mass% or more of high purity copper (Cu) metal (as Cu raw material metal [B]) as raw materials, ready to be added A sample of the copper alloy lead composition shown in Table 1 containing the prescribed amount of phosphorus (P). The samples of these compositions were processed into welding leads in the same way as the manufacturing method of high-purity gold leads. First, a predetermined amount of raw material is melted in a vacuum melting furnace and then cast into an ingot. After the ingot groove is rolled and rolled, it is subjected to withdrawal treatment and anti-rust treatment, etc., to produce a high-purity copper alloy lead with a diameter of 25 μm.

[0046] [Confirm...

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Abstract

Provided is a ball bonding wire of a high-purity copper alloy, the wire having a high recrystallization temperature and being easily produced through wiredrawing with a die at room temperature. The ball bonding wire has a low initial ball hardness and causes no breakage of IC chips. Phosphorus (P) is added in an amount as slight as 0.5-15 mass ppm to high-purity copper having a purity of 99.9985 mass% or higher to thereby produce a copper alloy which has a higher recrystallization temperature than high-purity copper having a purity of 99.9999 mass% or higher and which has a lowered initial ball hardness in ball bonding. Those characteristics are thus achieved. Alternatively, phosphorus (P) is added in an amount as slight as 0.5-15 mass ppm to high-purity copper having a purity of 99.9985 mass% or higher, and the total amount of any other impurities contained in the copper is reduced to a value lower than the phosphorus (P) content. Those characteristics are thereby achieved.

Description

technical field [0001] The present invention relates to a copper alloy lead for connecting substrates such as IC chip electrodes and wires by a ball bonding method using a wire bonding machine, and more particularly to a bonding lead having a soft starting ball (FAB) room temperature hardness. Background technique [0002] Conventionally, as a method of connecting the electrodes of the IC chip and the wires on the substrate, a method of wiring by ball bonding using a high-purity copper alloy lead instead of the gold lead is known. [0003] In the method of wiring by the ball bonding method, the following method is generally adopted: the high-purity copper alloy lead wire protruding from the winding machine is introduced into the welding tube as the welding tool, and then, through the micro-discharge between the electrode welding gun, The tip of the copper alloy lead introduced to the exit side of the tool is melted in an inert atmosphere or a reducing atmosphere to form a st...

Claims

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Application Information

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IPC IPC(8): H01L21/60C22C9/00
CPCH01L2924/01051H01L2924/00014H01L2924/01015H01L2924/01032H01L2924/01025H01L2924/01052H01L2924/01047H01L2924/01046H01L2924/01004H01L24/45H01L2924/01078H01L2924/01072H01L2924/01028C22C9/00H01L2224/45147H01L2924/01073H01L2924/01079H01L2924/01074H01L2924/01014H01L2924/10253H01L2924/01041H01L2224/45015H01L2924/01083H01L2924/01005H01L2924/01082H01L2224/43H01L2924/01013H01L2224/45144H01L2224/85207H01L2924/20752H01L2924/01023H01L2924/01006H01L2924/01029H01L24/43H01L2924/01012H01L2924/01033H01L2924/0102H01L2224/05624H01L2224/43848H01L2224/48511H01L2924/00011H01L2924/14H01L2924/01204H01L2924/01026H01L2924/01206H01L2924/00H01L2924/00015H01L2924/013H01L2224/48H01L2924/00013H01L2924/01022H01L2924/01034H01L2924/01048H01L2924/01049H01L2924/01205
Inventor 山下勉桑原岳冈崎纯一
Owner TANAKA DENSHI KOGYO KK
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