High Purity Copper Soldering Leads

A high-purity, lead-wire technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as hard, cracked IC chips, and inability to draw circuits.

Inactive Publication Date: 2016-12-14
TANAKA DENSHI KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when there is oxygen in the ball bonding atmosphere, even the high-purity copper alloy lead, the initial solder ball (FAB) will not form a spherical shape, or the initial solder ball (FAB) will become too hard, causing the IC chip of the semiconductor to crack The problem
For this reason, it is impossible to perform high-strength, satisfactory thermocompression bonding using the initial ball (FAB), or to draw a satisfactory circuit. So far, the use of high-purity copper alloy leads has not been able to achieve the experience. practical level

Method used

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  • High Purity Copper Soldering Leads
  • High Purity Copper Soldering Leads
  • High Purity Copper Soldering Leads

Examples

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Embodiment 1

[0044] [Manufacturing method of copper lead wire for ball bonding]

[0045] A method of manufacturing the copper alloy lead for ball bonding according to the present invention will be described. Prepare to add high-purity copper (Cu) metal of 99.9999 mass% or more (as Cu raw material metal [A]) and 99.999 mass% or more of high-purity copper (Cu) metal (as Cu raw material metal [B]) Specimens having copper alloy lead compositions shown in Table 1 containing a predetermined amount of phosphorus (P) were used. Samples with these compositions were processed into soldered leads in the same manner as the method for producing high-purity gold leads. First, a predetermined amount of raw material is melted in a vacuum melting furnace and cast into an ingot. This ingot was rolled with a groove roll and subjected to debonding treatment, antirust treatment, etc., to produce a high-purity copper alloy lead wire with a diameter of 25 μm.

[0046] [Confirmation of aging softening effect] ...

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Abstract

Provided is a high-purity copper alloy ball welding lead, which has a high recrystallization temperature, is easy to wire drawing at room temperature, and has low hardness of the initial solder ball, and does not cause IC chip cracks. By adding a small amount of phosphorus (P) to high-purity copper with a purity of 99.9985% by mass or higher, the recrystallization temperature is higher than that of high-purity copper with a purity of 99.9999% by mass or higher, and the initial The hardness of the solder ball decreases. The above characteristics are achieved by adding 0.5 to 15 mass ppm of phosphorus (P) to high-purity copper having a purity of 99.9985% by mass or higher and keeping the total content of other impurities contained below the above-mentioned content of phosphorus (P).

Description

technical field [0001] The present invention relates to a copper alloy lead for connecting substrates such as IC chip electrodes and wires by a ball bonding method using a wire bonding machine, and more particularly to a bonding lead having a soft starting ball (FAB) room temperature hardness. Background technique [0002] Conventionally, as a method of connecting the electrodes of the IC chip and the wires on the substrate, a method of wiring by ball bonding using a high-purity copper alloy lead instead of the gold lead is known. [0003] In the method of wiring by the ball bonding method, the following method is generally adopted: the high-purity copper alloy lead wire protruding from the winding machine is introduced into the welding tube as the welding tool, and then, through the micro-discharge between the electrode welding gun, The tip of the copper alloy lead introduced to the exit side of the tool is melted in an inert atmosphere or a reducing atmosphere to form a st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60C22C9/00
Inventor 山下勉桑原岳冈崎纯一
Owner TANAKA DENSHI KOGYO KK
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