Method for preparing crystalline silicon battery back electrode by laser sintering
A crystalline silicon battery and laser sintering technology, which is applied to circuits, electrical components, semiconductor devices, etc., can solve the problems of material waste and high production costs, and achieve the effects of saving electrode materials, simplifying the sintering process, and improving yield
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Embodiment 1
[0019] In this embodiment, a 125×125 crystalline silicon wafer is selected, and goes through various processes such as texturing, passivation, and doping to the back electrode manufacturing process. Send the clean crystalline silicon wafer into the aluminum evaporation equipment, and use the crucible electron gun to evaporate the aluminum wire to evaporate the aluminum on its back surface. The thickness of the evaporated aluminum is about 1.5μ. Then take out the crystalline silicon wafer and send it to the platform of the laser heating equipment that can be vacuumed. superior. Preheat the silicon wafer at 350°C while vacuuming, when the vacuum reaches 5.0×10 -3 Pa, after the substrate reaches the preheating temperature for 10 minutes, turn on the continuous solid-state laser to heat the substrate, so that the surface temperature of the substrate reaches 1000°C and maintain it for about 30 seconds. At this time, the electric field of the back electrode of the silicon wafer is f...
Embodiment 2
[0022] In this embodiment, a 156×156 crystalline silicon wafer is selected. After going through various processes such as texturing, passivation, and doping to the back electrode manufacturing process, the crystalline silicon wafer is sent into a sputtering-type aluminum-coated vacuum chamber, and the crystalline silicon wafer is While coating the back surface of the solar cell with an aluminum film, a background temperature of 200°C is applied to the silicon wafer to control the coating thickness to about 1 μ. Then take out the crystalline silicon wafer and send it to the platform of the vacuumable laser heating equipment. Preheat the silicon wafer at 400°C while vacuuming, when the vacuum reaches 5.0×10 -3 Pa, after the substrate reaches the preheating temperature for 10 minutes, turn on the continuous solid-state laser to heat the substrate, so that the surface temperature of the substrate reaches 1000°C and maintain it for about 20 seconds. At this time, the electric field...
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