Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Organic-inorganic hybrid organosilicone electronic packaging glue and preparation method thereof

A technology of electronic appliances and organic silicon, which is applied in the field of organic-inorganic hybrid silicon materials, can solve the problems of insufficient solvent resistance and mechanical strength, poor adhesion of the coating film to the substrate, and high curing temperature, so as to achieve good product stability, Hard to phase separation, strong hydrophobic effect

Active Publication Date: 2013-03-13
GUANGZHOU GLORYSTAR CHEM +2
View PDF1 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the currently prepared silicone electronic packaging adhesives generally have defects such as poor film-forming properties, high curing temperature (generally 150-200 ° C), and poor adhesion of the coating film to the substrate, and its solvent resistance And the mechanical strength is also insufficient, so its application is limited

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Organic-inorganic hybrid organosilicone electronic packaging glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] An organic-inorganic hybrid organosilicon electronic appliance encapsulation adhesive is prepared by the following preparation steps:

[0023] (1) Take 60 parts by weight of a solvent composed of absolute ethanol and isopropanol with a mass ratio of 7:2, and 1 part by weight of 2-amino-2-methyl-1- The catalyzer that propanol and tetramethyl ammonium hydroxide form, the distilled water of 5 weight parts add in the flask, stir and heat up,

[0024] (2) When the temperature is raised to 45°C, slowly add 10 parts by weight of tetramethoxysilane (TMOS) thereinto, and keep warm for 0.5h after the addition;

[0025] (3) Add 1 part by weight of a catalyst composed of 2-amino-2-methyl-1-propanol and tetramethylammonium hydroxide in a mass ratio of 8:2, and keep warm for 1 hour;

[0026] (4) After raising the temperature to 65°C and continuing the reaction for 2 hours, add dodecafluoroheptyltrimethoxysilane dropwise under stirring, the weight part of which is 15% of tetramethoxy...

Embodiment 2

[0030] An organic-inorganic hybrid organosilicon electronic appliance encapsulation adhesive is prepared by the following preparation steps:

[0031] (1) Take 80 parts by weight of a solvent composed of absolute ethanol and isopropanol with a mass ratio of 7:4, and 3 parts by weight of 2-amino-2-methyl-1- The catalyzer that propanol and tetramethylammonium hydroxide form, the distilled water of 15 weight parts add in the flask, stir and heat up,

[0032] (2) When the temperature is raised to 50°C, slowly add 15 parts by weight of tetramethoxysilane (TMOS) thereinto, and keep warm for 0.5h after the addition;

[0033] (3) Add 2 parts by weight of a catalyst composed of 2-amino-2-methyl-1-propanol and tetramethylammonium hydroxide in a mass ratio of 8:3, and keep warm for 1 hour;

[0034] (4) After raising the temperature to 70°C and continuing the reaction for 2.5 hours, add dodecafluoroheptyltrimethoxysilane dropwise under stirring, the weight part of which is 25% of tetramet...

Embodiment 3

[0038] An organic-inorganic hybrid organosilicon encapsulating adhesive for electronic appliances is prepared by the following preparation steps:

[0039] (1) Take 90 parts by weight of a solvent composed of absolute ethanol and isopropanol with a mass ratio of 7:5, and 5 parts by weight of 2-amino-2-methyl-1- The catalyst that propanol and tetramethylammonium hydroxide form, the distilled water of 20 weight parts add in the flask, stir and heat up;

[0040] (2) When the temperature is raised to 55°C, slowly add 20 parts by weight of tetramethoxysilane (TMOS) thereinto, and keep warm for 1 hour after the addition;

[0041] (3) Add 3 parts by weight of a catalyst composed of 2-amino-2-methyl-1-propanol and tetramethylammonium hydroxide in a mass ratio of 8:5, and keep warm for 1 hour;

[0042] (4) After raising the temperature to 80°C and continuing the reaction for 3 hours, add dodecafluoroheptyltrimethoxysilane dropwise under stirring, the weight part of which is 30% of tetr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides organic-inorganic hybrid organosilicone electronic packaging glue and a preparation method thereof. A reaction system comprises tetramethoxysilane, a solvent consisting of absolute ethyl alcohol and isopropanol in a mass proportion of 7:(2-5), and a catalyst formed by mixing 2-amino-2-methyl-1-propanol with tetramethylammonium hydroxide, wherein the catalyst is added by two steps, and dodecafluoroheptyl trimethoxysilane is simultaneously introduced, and a film formed finally by the prepared organosilicone electronics packaging glue has the characteristics of strong hydrophobicity, soiling resistance, corrosion resistance, strong coated substrate adhesive force, and high refraction rate; and the preparation method is simple in preparation process and low in cost, and the process is easily controlled.

Description

technical field [0001] The invention relates to an organic-inorganic hybrid silicon material, in particular to a hydrophobic organic-inorganic hybrid organic silicon electronic appliance packaging glue. Background technique [0002] Silicone material has high insulation to avoid breakdown or short circuit between circuits; it has excellent electrical insulation, high and low temperature resistance, corona resistance, ozone resistance and other properties. Because of these high performance and advantages, it is widely used in automotive electronics The application in the field is particularly valued, and the application field in automotive electronics is becoming wider and wider, such as protection engine control module, ignition coil and ignition module, power system module, braking system module, exhaust emission control module, power system , lighting systems, various sensors, connectors, etc. However, the currently prepared silicone electronic packaging adhesives general...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08G77/24C08G77/08C09D183/08
Inventor 周意生曾美婵黄德裕赖观品何艺文
Owner GUANGZHOU GLORYSTAR CHEM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com