Lead wire frame and production method thereof

A technology of lead frame and production method, which is applied in the field of electronic packaging manufacturing, can solve the problem of not meeting the requirements of electrical conductivity and thermal conductivity of terminal electronic products, mechanical properties (low tensile strength, elongation and hardness, failure to reach To technical requirements and other issues, to achieve the effect of enhancing market competitiveness, not easy to deform and break, and low cost

Active Publication Date: 2013-03-20
XIAMEN YONGHONG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The material used for the original lead frame, especially the micro SOT series lead frame is FeNi42 alloy. The conductivity coefficient of FeNi42 alloy is 2.7%IACS, and the thermal conductivity is 10W/M.K, which can no longer meet the electrical conductivity of terminal electronic products. and thermal conductivity requirements
Another Cu-Fe-P series alloy produc

Method used

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Embodiment Construction

[0016] The present invention will be further described in conjunction with specific embodiments.

[0017] A method for producing a lead frame according to an embodiment, comprising: A) stamping, B) electroplating and C) forming steps; wherein,

[0018] A) Stamping steps:

[0019] Take the copper alloy sheet, punch it with the help of the convex and concave dies of the punching die through a high-speed punching machine, and form a semi-finished lead frame (also known as a "white board" in the industry). The chemical composition and mass ratio of the copper alloy sheet The numbers are: 1.8-2.1% nickel, 0.4-0.68% silicon, 0-0.2% iron, 0-0.1% manganese, 0-0.2% zinc, 0-0.005% cadmium, 0-0.02% lead, of which iron, manganese, zinc, cadmium and lead are impurity components, and 0-0.3% of the remaining impurities, and the balance is copper; the tensile strength Rm of the copper alloy sheet is ≥600MPa, and the elongation after fracture is A11 .3≥8%, Vickers hardness HV≥180 (Vickers ha...

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Abstract

The invention relates to the field of electronic packaging manufacturing, in particular to a lead wire frame for packaging a chip. Particularly, the lead wire frame is mainly applied to an SOT (Small-outline Transistor) series. A production method of the lead wire frame comprises the steps of A) stamping, B) electroplating and C) forming, wherein in Step A), a copper alloy sheet is taken for stamping through a male die and a female die of a cutting die to form a semi-finished lead wire frame; the tensile strength Rm of the copper alloy sheet is greater than or equal to 600MPa; the elongation after rupture A11.3 is greater than or equal to 8%; the vickers hardness HV is greater than or equal to 180; the electrical conductivity is greater than or equal to 46% IACS (International Annealed Copper Standard); and the thermal conductivity is greater than or equal to 190w/m*k; in Step B), the semi-finished lead wire frame is subjected to the following treatment sequentially: namely preelectrosilvering, electrosilvering and silver drawing; and in Step C), the electroplated semi-finished lead wire frame is subjected to cutting forming. The lead wire frame has a better mechanical property and a better thermoelectrical property.

Description

technical field [0001] The invention relates to the field of electronic packaging and manufacturing, in particular to a lead frame used for packaging chips, especially mainly applied to SOT (Small Outline Transistor) series lead frames. Background technique [0002] With the development of terminal electronic products in the direction of light weight and multi-functionality, it is required to have high electrical and thermal conductivity for the lead frame that carries the chip and transmits the heat and electrical signals generated by the chip. The material used for the original lead frame, especially the micro SOT series lead frame is FeNi42 alloy. The conductivity coefficient of FeNi42 alloy is 2.7%IACS, and the thermal conductivity is 10W / M.K, which can no longer meet the electrical conductivity of terminal electronic products. and thermal conductivity requirements. Another Cu-Fe-P series alloy product (C19400, C19210) has a tensile strength of 420-500MPa, which cannot ...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/495
CPCH01L2924/0002
Inventor 汪洋林桂贤丘文雄彭淑合丛艳丽林阮彬
Owner XIAMEN YONGHONG TECH
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