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Method and device for controlling etching waste liquid with low copper content by using algae

A technology of copper etching and algae, which is applied in the field of algae treatment of low-copper-containing etching waste liquid, can solve problems such as uneven contact, complicated process, and difference in algal powder adsorption, and achieves convenient use and operation, simple device structure, and water protection. resource effect

Active Publication Date: 2013-04-24
CHANGSHA UNIVERSITY +1
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Problems solved by technology

However, the reported literature is an experimental study on the adsorption of copper-containing solution by algae powder. When this method is used for the treatment of copper-containing wastewater, it will have the following disadvantages: (1) The batch treatment method is adopted, and the experimental algae powder is used for the cultivation of algae. It is prepared by a process of centrifugation, constant temperature drying, etc. The process is complicated, and it is not suitable for the treatment of a large amount of copper-containing waste liquid.
(2) Adopting the column continuous adsorption method, the copper-containing solution flows into the reaction column at a slower speed, and contacts with the algae powder in the reaction column, and absorbs copper ions in the solution, but the algae powder of the same height in the reaction column contacts the copper-containing solution and does not Inhomogeneous, there is a difference in the amount of algae powder adsorption at the same height, which reduces the adsorption efficiency of algae powder in the reaction column; in addition, it is difficult to control the temperature and acidity in the adsorption conditions
(3) Use algae powder to adsorb copper-containing solution, and analyze the adsorption conditions and adsorption capacity of algae powder from the laboratory level. In order to consider the up-to-standard discharge of copper-containing solution after adsorption, this method cannot be used for engineering treatment of copper-containing waste liquid , it is necessary to find a suitable technology for algae treatment of copper-containing waste liquid

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  • Method and device for controlling etching waste liquid with low copper content by using algae

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Embodiment Construction

[0026] The present invention will be further described below in conjunction with drawings and embodiments.

[0027] Such as figure 1 , 2 , 3 and 4, the present invention is composed of algae powder adsorption-analysis chamber and algae cultivation chamber connected by liquid pipeline 7, algae powder adsorption-analysis chamber and algae cultivation chamber respectively have N sub-chambers, and N is a natural number greater than or equal to 1 , when N is a natural number greater than 1, the sub-chambers are connected in series through liquid pipes.

[0028] Figure 5 Shown is a schematic diagram of the structure of the algae powder adsorption-analysis sub-chamber, a bracket 3 is installed on the top of the bracket, a medium-speed impeller agitator 12 is installed on the upper part of the bracket, an etching waste liquid inlet 9 is installed on the lower part of the bracket, and the first temperature control regulator 13 is installed on the lower part of the liquid level line...

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Abstract

A method and a device for controlling etching waste liquid with low copper content by using algae. A combined control method by using algae growth and culture adsorption and algae powder adsorption. When concentration of a copper-containing etching waste liquid is higher than a copper concentration 50mg / L required by algae culture adsorption, first the copper-containing etching waste liquid is subjected to algae powder adsorption; the copper-containing etching waste liquid is treated by N algae powder adsorption and desorption chambers to lower the concentration to the copper concentration required by algae cultivation adsorption; and then the copper-containing etching waste liquid is subjected to algae culture growth and metabolism adsorption treatment, so that the copper concentration is lowered to less than 1.0mg / L to reach discharge requirements of copper-containing waste liquid. The invention can effectively treat copper-containing waste liquid with low concentration; and copper ions adsorbed in the algae can be desorbed, and copper in the waste liquid can be recovered to protect water environment.

Description

technical field [0001] The invention belongs to a water environment protection and treatment method and device, in particular to a method and device for treating algae with low-copper-containing etching waste liquid, which is suitable for the treatment of low-copper-containing etching waste liquid in PCB enterprises. Background technique [0002] With the development of industrial production, the discharge of heavy metal pollutants in water is increasing day by day, which damages the water ecological environment and leads to water pollution. In view of the harm of heavy metal pollutants to the water ecological environment, it is very necessary to protect the water environment, prevent and control water pollution, and effectively control heavy metal pollution in water. [0003] At present, the treatment technology of heavy metal wastewater is mainly physical and chemical treatment method. In the use of this technology, it faces the shortcomings of incomplete treatment, easy ...

Claims

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Application Information

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IPC IPC(8): C02F3/32C02F103/16
Inventor 廖兴盛罗晓
Owner CHANGSHA UNIVERSITY
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