Chip detector for digital electronic watches

An electronic watch and digital technology, applied in the field of digital electronic watch chip testers, can solve the problems of testers that do not provide digital electronic watch chips, etc., and achieve the effect of simple circuit structure

Active Publication Date: 2013-04-24
深圳米飞泰克科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a digital electronic watch chip tester, aiming to solve the problem that the prior art has not yet provided a tester for digital electronic watch chips

Method used

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  • Chip detector for digital electronic watches
  • Chip detector for digital electronic watches
  • Chip detector for digital electronic watches

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] refer to figure 1 , the circuit principle block diagram of the digital electronic watch chip tester provided by the embodiment of the present invention.

[0031] A digital electronic watch chip tester, comprising:

[0032] probe station 1;

[0033] Probe card 2;

[0034] Main control chip 3;

[0035] An OS parameter test circuit 41 for testing whether the protection diode on the pin of the wafer chip is intact, the test terminal of the OS parameter test circuit 41 is connected to the probe card 2, and the controlled terminal is connected to the OS parameter test control terminal...

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PUM

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Abstract

The invention relates to the chip detecting field and in particular to a chip detector for digital electronic watches. The chip detector for the digital electronic watches comprises a probe station, a probe card, a main control chip, a parameter testing circuit, an international direct dial (IDD) parameter testing circuit, a frequency parameter testing circuit and a logical function testing circuit. The parameter testing circuit can be used for testing whether a protection diode on a base pin of a wafer chip is sound. The IDD parameter testing circuit is used for testing the power consumption of the wafer chip which works under the conditions of being provided with a power-on and a clock. The frequency parameter testing circuit is used for testing the work frequency of the wafer chip. The logical function testing circuit is used for testing the logical function of the wafer chip. The control signal of the main control chip can be transmitted to a transistor-transistor logic (TTL) interface circuit of the probe station. The chip detector for digital electronic watches is simple in circuit structure and provided with testing functions which are essential for digital electronic watch chips of an operating system (OS) parameter test, an IDD parameter test, a frequency parameter test, logical function test and the like. At the same time of guaranteeing testing requests, the testing cost and the production cost of the digital electronic watch chips can be reduced.

Description

technical field [0001] The invention relates to the field of chip testing, in particular to a digital electronic watch chip tester. Background technique [0002] With the increasing application of digital integrated circuits (chips) and the country's support for the development of the semiconductor industry, domestic CMOS digital integrated circuit design capabilities have been greatly developed, and the industrial scale has also reached unprecedented prosperity. However, domestic enterprises engaged in the post-processing of integrated circuits are relatively backward in terms of scale and quantity, and most of the testers used are imported from outside. production cost. [0003] Today, with the continuous improvement of wafer tape-out process and technology, the area of ​​a single chip is getting smaller and smaller, the integration complexity is getting higher and higher, and the requirements for testers in the subsequent test process are also increasing. High, which fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/317G01R31/3177
Inventor 方盼
Owner 深圳米飞泰克科技股份有限公司
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