Brightening strong moving cyanide-free alkaline copper solution
An alkali copper and bright technology, applied in the field of cyanide-free copper plating solution, can solve the problems of large changes in the brightness of the coating layer, large environmental pollution, unstable copper plating process, etc. The effect of high, coating positioning ability
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Embodiment 1
[0016] In 150g / L HEDP (hydroxyethylidene diphosphonic acid) solution, add 25g / L copper pyrophosphate, heat to 40-50℃ to dissolve, and stir evenly, slowly add 20% sodium hydroxide solution or carbonic acid Sodium solution, adjust the pH to 9-10. And electrolyze for more than 10h at a current density of 0.5-2A / square decimeter. Then 20 ppm of BMP (monopropoxybutynediol ether) and 10 ppm of polyethylene glycol 6000 were added. Electroplate the test piece in the Hull cell, the operating conditions are: 1A current, and the electroplating time is 2 minutes. Both the high current area and the low current area of the test piece are completely covered with a uniform red copper plating layer. The surface of the plating layer is uniform and bright, and the positioning ability is very good. Under this condition, three pieces were electroplated continuously, and the appearance of the coating remained basically unchanged. In addition, the pilot test was carried out in a 50L large tank....
Embodiment 2
[0018] Add 70g / L potassium pyrophosphate and 20g / L copper sulfate to 100g / L HEDP solution, stir to dissolve completely, and adjust the pH to 9-10 with sodium carbonate solution. And electrolyze for more than 10h at a current density of 0.5-2A / square decimeter. Then 20 ppm of MPS (sodium thiopropanesulfonate) and 5 ppm of ZPS (sodium 3-(benzothiazole-2-mercapto)-propanesulfonate) were added. Electroplate the test piece in the Hull cell, the operating conditions are: 1A current, and the electroplating time is 2 minutes. Both the high current area and the low current area of the test piece are completely covered with a uniform red copper plating layer. The surface of the plating layer is uniform and bright, and the positioning ability is very good. Under this condition, 3 pieces were continuously electroplated, and the appearance of the coating did not change significantly. In addition, the pilot test was carried out in a 50L large tank. Under the current density of 0.5-1A / dm...
Embodiment 3
[0020] In the 100g / L HEDP solution, add 50g / L potassium pyrophosphate and 15g / L copper carbonate, stir to dissolve completely, and adjust the pH to 9-10 with sodium hydroxide or sodium carbonate solution. And electrolyze for more than 10h at a current density of 0.5-2A / square decimeter. Then 20 ppm of BMP (monopropoxybutynediol ether), 10 ppm of simethicone and 10 ppm of polyethylene glycol 6000 were added. Electroplate the test piece in the Hull cell, the operating conditions are: 1A current, and the electroplating time is 2 minutes. Both the high-current area and the low-current area of the test piece are completely covered with uniform red copper plating. The surface of the plating is bright and uniform, and the positioning ability is very good. Under this condition, three pieces were electroplated continuously, and the appearance of the coating remained basically unchanged. In addition, the pilot test was carried out in a 50L large tank. Under the current density of 0....
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