Unlock instant, AI-driven research and patent intelligence for your innovation.

Surface treatment method for binary pseudo-alloy electronic packaging material

An electronic packaging material and surface treatment technology, applied in metal material coating process, ion implantation plating, liquid chemical plating, etc. The effect of high rate and simple process

Inactive Publication Date: 2013-05-01
JIANGSU DINGQI SCI & TECH
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since there is no eutectic between two metals or metals and non-metals, there are still two different substances under the microstructure, and the surface of the parts is uneven, so a galvanic battery is formed between the plating solution and the coating, resulting in low bonding between the coating and the substrate. , resulting in blistering, macular and other phenomena

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Example 1, Nickel Plating on Aluminum Silicon Carbide (Silicon Carbide Aluminum) Substrate

[0012] 1. Surface cleaning, degreasing and decontamination;

[0013] 2. Vacuum sputtering 0.1-2um aluminum on the surface of the aluminum silicon carbide substrate, annealing at 400-500 degrees, the aluminum layer on the surface is fused with the metal aluminum in the aluminum silicon carbide substrate to form a complete metal surface;

[0014] 3. Electro(chemical) nickel plating 2-5um, annealing at 850 degrees.

[0015] After the implementation of the above process, the qualified rate of nickel plating can reach more than 98%, and the surface will not be blistered or peeled.

Embodiment 2

[0016] Embodiment 2, nickel-plated tungsten-copper substrate

[0017] 1. Surface cleaning, degreasing and decontamination;

[0018] 2. Vacuum sputtering 2-4um copper on the surface of tungsten-copper substrate, annealing at 400-500 degrees, the copper layer on the surface is fused with the metal copper in the tungsten-copper substrate to form a complete metal surface;

[0019] 3. Electro(chemical) nickel plating 2-5um, annealed at 850 degrees.

[0020] After the implementation of the above process, the qualified rate of nickel plating can reach more than 98%, and the surface will not be blistered or peeled.

Embodiment 3

[0021] Embodiment 3, nickel-plated aluminum-silicon substrate

[0022] 1. Surface cleaning, degreasing and decontamination;

[0023] 2. Spray 0.5-2um aluminum on the surface of the aluminum-silicon substrate, anneal at 400-500 degrees, the aluminum layer on the surface will fuse with the metal aluminum in the aluminum-silicon substrate to form a complete metal surface;

[0024] 3. Electro(chemical) nickel plating 2-5um, annealed at 850 degrees.

[0025] After the implementation of the above process, the qualified rate of nickel plating can reach more than 98%, and the surface will not be blistered or peeled.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a surface treatment method for a binary pseudo-alloy electronic packaging material, and relates to the surface treatment method for the metal matrix binary pseudo-alloy electronic packaging material in microelectronic packaging. The method includes the steps of firstly sputtering or spraying a layer of metal with the low content in the alloy on alloy parts surface; then annealing to enable a surface metal layer to be melted with the metal and form a complete metal surface; and performing electroplating or chemical plating. According to the method, the surface metal layer is tightly connected with the metal inside the parts and the parts surface; the metal layer is strong in binding force; the technique is simple; and the electroplating qualified rate is high.

Description

technical field [0001] The invention relates to a surface treatment method for metal-based binary pseudo-alloy electronic packaging materials used in microelectronic packaging, including: surface treatment of heat sink materials such as tungsten copper, molybdenum copper, silicon carbide aluminum (aluminum silicon carbide), aluminum silicon, etc. method. Background technique [0002] Metal-based binary pseudo-alloy electronic packaging materials, because of their excellent thermal conductivity and adjustable thermal expansion coefficient, and can match with Be0 and Al203 ceramics, are currently the preferred electronic packaging materials for high-power electronic components. This material is made of two metals or a mixture of metal and non-metal. There is no eutectic between the two constituent elements metal and metal or metal and non-metal. It is still two different substances in microstructure, but they are only physically combined. . [0003] Binary pseudo-alloy elect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D5/34C23C18/18C23F17/00C21D1/26C23C14/34C23C14/16C23C4/06C23C30/00
Inventor 况秀猛张远朱德军
Owner JIANGSU DINGQI SCI & TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com