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Raw material composition of high-temperature-resistant polyimide resin heat-insulating plate

A technology of polyimide resin and raw material composition, which is applied in the field of raw material composition of heat insulation boards, can solve the problems of large linear expansion coefficient, affecting the use of heat insulation boards, short service life, etc., and achieves low linear expansion coefficient, High melting point and boiling point, good adhesion effect

Inactive Publication Date: 2013-06-05
焦作市天益科技有限公司
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AI Technical Summary

Problems solved by technology

Although the addition of glass fibers and fillers can increase the heat-resistant temperature of the heat insulation board made of unsaturated polyester resin to a certain extent (up to 180 ° C), but due to the low temperature resistance of the unsaturated resin itself, it is made by its own The composite material made will release small molecule gas at high temperature, making it have a shorter service life at high temperature; in addition, due to its large linear expansion coefficient, it reaches (130~150)×10-6, and at room temperature The thermal conductivity is: 0.78W / M.K. It is easier to deform when used at high temperature, which further affects the use of this type of heat shield

Method used

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Embodiment Construction

[0012] In order to make the purpose, technical solutions and beneficial effects of the present invention more clear, the implementation manners of the present invention will be further described in detail below.

[0013] (1) Polyimide resin is made of N,N , - Resin prepolymer formed by prepolymerizing methylene diphenyl bismaleimide as the main active ingredient with other modified monomers under certain conditions. The obtained resin prepolymer has the following characteristics: the prepolymer is stable, easy to dissolve, good adhesion, the cured product is cheap, heat-resistant, heat-resistant, and has good electrical and mechanical properties, suitable for coatings, molds, etc. It is used in plastics and adhesives, and is favored as a matrix resin for advanced composite materials. The resin glass transition temperature of this system is 288°C, it does not produce small molecule gas at high temperature, has good high temperature resistance and extremely low linear expansion...

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Abstract

The invention discloses a raw material composition of a high-temperature-resistant polyimide resin heat-insulating plate. The raw material composition comprises polyimide, zirconium oxide, cenospheres and silane coupling agents, wherein the weight ratio of the polyimide, the zirconium oxide, the cenospheres and the silane coupling agents KH550 is 10: 1: 3: 1.5. Compared with an existing heat-insulating plate, the heat-insulating plate made of the raw material composition is more stable and resistant to a high temperature, the linear dilatation coefficient and the heat conductivity coefficient at the high temperature are substantially lowered, the purpose that the heat-insulating plate can be used at the high temperature is achieved, pollution cannot be caused to a working environment, and the heat-insulating plate is not prone to deformation.

Description

technical field [0001] The invention relates to a raw material composition of a heat insulating board, in particular to a new raw material composition of a high temperature resistant polyimide resin heat insulating board which is superior to the traditional method. Background technique [0002] The heat insulation boards currently on the market are mainly made of unsaturated polyester, glass felt fibers and hollow microsphere fillers. Widely used in plastic molds, injection molds and other industries, to a certain extent, it reduces the loss of heat transfer, reduces energy consumption, saves resources, and improves production efficiency. However, with the development of production technology, the production process of injection mold and other industries has been continuously improved, and the injection temperature has also been continuously increased, which has exceeded the temperature resistance limit of unsaturated polyester resin, making the use of heat shield more a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/22C08K7/28C08K5/544
Inventor 冯星起
Owner 焦作市天益科技有限公司
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