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Weakly alkaline tin-base lead-free solder composite plating solution and application thereof

A technology of composite plating solution and lead-free solder, which is applied in the direction of electrolytic coating, coating, etc., can solve the problems of failure of plating solution and failure to obtain tin composite coating, and achieve the effects of low corrosion, low cost and simple process

Active Publication Date: 2013-06-05
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even if the added metal particles are copper and silver, due to the strong oxidation of sulfuric acid, copper and silver particles can react with sulfuric acid when the temperature of the plating solution rises, resulting in the failure of the plating solution and the tin composite coating containing metal particles cannot be obtained

Method used

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  • Weakly alkaline tin-base lead-free solder composite plating solution and application thereof
  • Weakly alkaline tin-base lead-free solder composite plating solution and application thereof
  • Weakly alkaline tin-base lead-free solder composite plating solution and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0036]

[0037]

[0038] Solution movement mode Magnetic stirring

[0039] According to this electroplating process, a 99.3wt%Sn-0.7wt%Cu composite coating is obtained, the coating is dense, the copper particles are evenly distributed, and the porosity of the coating is 0.58 / cm 2 , the measured melting point of the coating is 230.8°C, which is slightly higher than the melting point of 99.3wt%Sn-0.7wt%Cu bulk solder, and is welded to the nickel substrate after electroplating a 50μm thick 99.3wt%Sn-0.7wt%Cu composite coating on the copper substrate , Good adhesion after welding.

Embodiment 2

[0041]

[0042] Solution Movement Mode Ultrasonic Vibration

[0043] According to this electroplating process, a 99wt%Sn-0.3wt%Ag-0.7wt%Cu composite coating is obtained, the coating is dense, the silver and copper particles are evenly distributed, and the porosity of the coating is 1.28 / cm 2 , the melting point of the measured coating is 228.6 ° C, slightly lower than the melting point of 99wt%Sn-0.3wt%Ag-0.7wt%Cu bulk solder, and 99wt%Sn-0.3wt%Ag-0.7wt%Cu is electroplated on a copper substrate with a thickness of 50 μm After the composite coating is welded with the nickel substrate, the bonding force is good after welding.

Embodiment 3

[0045]

[0046] Solution Movement Mode Ultrasonic Vibration

[0047] According to this electroplating process, a 95wt%Sn-4wt%Zn-0.5wt%Al-0.5wt%Ag composite coating is obtained, the coating is dense, the metal particles are evenly distributed, and the porosity of the coating is 0.87 / cm 2 , the melting point of the coating was measured to be 209.8°C, and the composite coating of 95wt%Sn-4wt%Zn-0.5wt%Al-0.5wt%Ag was electroplated on the copper substrate with a thickness of 50 μm and then welded to the aluminum substrate, and the bonding was good after welding.

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Abstract

The invention relates to a weakly alkaline tin-base lead-free solder composite plating solution and a technique for preparing an alloy plating by using the composite plating solution, belonging to the technical field of electroplating. The composite plating solution is composed of a tin-base plating solution and a metal particle dispersion solution, wherein the tin-base plating solution is composed of stannous pyrophosphate, potassium citrate, potassium pyrophosphate, phloroglucinol, dipotassium hydrogen phosphate and cobaltous sulfate; and the metal particle dispersion solution is composed of metal particles and a surfactant. The composite plating solution is weakly alkaline; and at the plating temperature of 35-65 DEG C, a direct current or pulse current can be charged to perform electroplating to obtain the tin-base lead-free solder composite plating for different alloy systems. The composite plating solution provided by the invention has the advantages of environmental protection, no toxicity, high stability, low corrosivity, simple technique and low cost, can be used can be used for preparing tin-base lead-free weldable platings and tin-base lead-free salient points, and is applicable to the industries of micro-electronics and optoelectronics, such as connection and packaging of chips, formation of electronic device surface pads or patterns, and the like.

Description

technical field [0001] The invention relates to a weakly alkaline tin-based lead-free solder composite plating solution and a process for preparing an alloy coating by using the composite plating solution, belonging to the technical field of electroplating. Background technique [0002] The commonly used brazing material in the electronic packaging industry in the past was tin-lead (Sn-37Pb) solder. Considering cost, electricity, mechanics, physical and chemical properties, etc., the performance of Sn-Pb solder alloy is very excellent. However, lead is a heavy metal element with great toxicity. It can circulate through groundwater and food chains in nature, causing serious harm to human health and the environment. One of the most harmful chemicals. The United States, the European Union, China and Japan have also introduced their own legislation to restrict the use of lead and lead-containing substances. [0003] In the early 1990s, research on lead-free solders began at ho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/60C25D15/00
Inventor 黄明亮潘剑灵赵宁张同心赵杰马海涛
Owner DALIAN UNIV OF TECH
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