Solder wire for aluminum and aluminum alloy soldering and preparation method thereof

A technology of solder wire and aluminum alloy, applied in welding equipment, metal processing equipment, welding medium, etc., can solve the problems of poor corrosion resistance of brazing joints, poor wettability, poor wettability of flux, etc. The effect of improving overall activity, improving corrosion resistance, and large activity

Active Publication Date: 2013-07-10
深圳市镱豪金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] After comparison, the above-mentioned patent documents are quite different from the content of this patent application, which is mainly manifested in: when using the above-mentioned solder alloy to make brazed aluminum and aluminum alloy joints, due to the huge difference between the solder and the base metal electrode potential, It is easy to produce electrochemical corrosion, and the corrosion resistance of brazed joints is very poor, and the fluxes disclosed in the latter two patent documents contain a large number of carriers that have adverse effects on wettability, such as water-soluble resins and rosin, which make the fluxes wet poor wetness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A solder wire used for soldering of aluminum and aluminum alloys, which consists of two parts: a solder alloy in the outer layer and a flux in the inner core, wherein:

[0034] The raw material composition and weight of the outer brazing filler metal alloy are: tin 92Kg, zinc 8Kg;

[0035] The raw material components and weights of the inner core flux are: 1.8Kg zinc fluoride, 13.2Kg stannous fluoride, 85Kg hydrofluoride of polyhydroxyethylamine and polyhydroxymethylamine.

[0036] The preparation steps of the above-mentioned solder wire for aluminum and aluminum alloy soldering are:

[0037] (1) Preparation of solder alloy: weigh tin and zinc in proportion, melt to form a uniform solder alloy, and cast it into an ingot at 320~380°C to obtain a solder alloy for use;

[0038] (2) Preparation of hydrofluoric acid salts of polyhydroxyethylamine and polyhydroxymethylamine:

[0039]a. In this embodiment, the polyhydroxyethylamine is composed of triethanolamine and tetrahyd...

Embodiment 2

[0045] A kind of soldering tin wire that is used for aluminum and aluminum alloy soldering is identical with embodiment 1, is made up of solder alloy of outer layer and the flux flux of inner core likewise, wherein:

[0046] The raw material composition and weight of the outer brazing filler metal alloy are: tin 84Kg, zinc 13Kg, bismuth 3Kg;

[0047] The raw material components and weights of the inner core flux are: 0.6Kg of zinc fluoride, 3.9Kg of tin fluoride, 0.5Kg of copper fluoride, and 95Kg of trishydrofluoride.

[0048] The preparation steps of the above-mentioned solder wire for aluminum and aluminum alloy soldering are:

[0049] ⑴ Preparation of solder alloy: weigh tin, zinc and bismuth in proportion, melt to form a uniform solder alloy, and cast it into an ingot at 320~380°C;

[0050] ⑵Preparation of hydrofluoric acid salt of Tris:

[0051] a. Put tris in an evaporating pot with a corrosion-resistant coating, add water to dissolve, the weight ratio of tris to wate...

Embodiment 3

[0057] A kind of solder wire for aluminum and aluminum alloy soldering, same as embodiment 1 and 2, is made up of solder alloy of outer layer and flux of inner core two parts likewise, wherein:

[0058] The raw material components and weight percentages of the outer layer solder alloy are: tin 92Kg, zinc 7Kg, bismuth 1Kg;

[0059] The raw material components and weight percentages of the inner core flux are: 1.2Kg zinc fluoride, 7.2Kg stannous fluoride, 1.6Kg bismuth fluoride, and 90Kg hydrofluoride of polyhydroxyethylamine.

[0060] The preparation steps of the above-mentioned solder wire for aluminum and aluminum alloy soldering are:

[0061] ⑴ Preparation of solder alloy: weigh tin, zinc and bismuth in proportion, melt to form a uniform solder alloy, and cast it into an ingot at 320~380°C;

[0062] ⑵ Preparation of hydrofluoric acid salt of polyhydroxyethylamine:

[0063] a. In this example, the polyhydroxyethylamine is composed of diethanolamine and triisopropanolamine. ...

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PUM

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Abstract

The invention relates to a solder wire for aluminum and aluminum alloy soldering and a preparation method thereof. The solder wire is composed of an outer-layer solder alloy and a flux of an inner core. The flux can be poured into the solder wire as an inner core of the solder wire, and the outer-layer solder alloy comprises, by weight, 84-92% of tin, 7-13% of zinc and 0-3% of bismuth. According to the solder wire and the preparation method thereof, an aluminum-zinc alloy or an aluminum-zinc-bismuth alloy serves as soldering aluminum, during soldering, the zinc in the aluminum solder reacts with the aluminum in the soldering process, a layer of aluminum-zinc solid solution is formed at the position of the interface of the solder and the aluminum, the electrode potential difference between the aluminum and the solder is relieved, the corrosion resistance of soldering joints is improved, and the content of zinc in the solder is high, so that the corrosion resistance of soldering joints of zinc-containing alloys is better than that of soldering joints of copper-containing alloys.

Description

technical field [0001] The invention belongs to the field of metallurgy and chemical industry, and relates to soldering, in particular to a solder wire used for soldering of aluminum and aluminum alloys and a preparation method thereof. Background technique [0002] Brazing is a common method of connecting aluminum-aluminum and aluminum-copper in electronic technology. It is usually divided into two types: hard brazing and soft brazing: with the brazing temperature of 450°C as the boundary, the process higher than this temperature It is called brazing, and lower than this temperature is called soft soldering. Among them, brazing has great limitations in the connection process of some electronic and electrical products due to the high process temperature; soft soldering The brazing temperature is low, and the heat effect of the brazing process on the product is small. Soldering iron brazing in soft soldering is the most commonly used operation process due to its flexible and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/363B23K35/40
Inventor 张启云庄洪涛丁清峰
Owner 深圳市镱豪金属有限公司
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