Novel transparent deep curing electronic pouring sealant and preparation method thereof

Abstract

The present invention provides a new type of transparent deep-curing electronic potting glue, the potting glue consists of two components A and B mixed in a weight ratio of 1:1, wherein: component A is composed of rubber material and crosslinking agent by weight Ratio 100: 0.2~10 mixed; component B is composed of rubber and platinum complex in a weight ratio of 100:0.01~0.5, the platinum complex is alkenyl-terminated main chain composed of polyorganosiloxane Coordinated platinum complex formed, wherein relative to the total weight of the two components A and B, the amount of platinum is 500~2000ppm; Ratio of 100:15~50 is obtained by high-speed shear dispersion mixing, and vacuum desolvation at 60~100°C for 1~5h; the silicone resin solution is a mixed solution of ethanol and toluene containing MQ silicone resin. The encapsulant has the advantages of high transparency, low amount of catalyst, wide range of curing depth, etc. After use, the mechanical properties of the encapsulant and the light efficiency of electronic devices are significantly improved.

Description

technical field [0001] The invention relates to the technical field of potting materials, in particular to a novel transparent deep-layer curing electronic potting glue and a preparation method thereof. Background technique [0002] Simply put, potting is the operation process of reasonably arranging, assembling, bonding, connecting and isolating and protecting the various parts of the electronic components according to the requirements. At present, there are many kinds of potting materials, and the commonly used ones are: epoxy resin, polyurethane and silicone. Epoxy resin potting materials are characterized by small shrinkage, no by-products, and excellent electrical insulation properties, but limited by the molecular structure itself, the heat resistance is not high, and it is generally only used for potting electronic components at room temperature. Seal, its use environment has no special requirements on mechanical properties. Polyurethane potting materials are common...

AI Technical Summary

Problems solved by technology

The existing technology in China has a low light extraction efficiency, which can only reach 92% in general, and no more than 95% if it is slightly better. %

Moreover, according to the traditional technical process, the amount of catalyst is relatively high, and the curing depth of the product is not enough, which makes the production cost higher, which is unfavorable for industrial production

For example, the platinum catalyst used in a silicone electronic potting material suitable for LED electronic products disclosed in Chinese patent CN101016446 is easy to poison, has low light transmittance, and the glue is not easy to cure and the surface is sticky. The product needs to be stored at 150 °C high temperature curing

Another example is that the Chinese patent application number 201110246082.4 discloses a two-component high-strength, high-transparency, room-temperature-curing silicone encapsulant. The prepared encapsulant has insufficient tensile strength and light transmittance, and the amount of catalyst is relatively large. Especially for high-power LED products, there are relatively large defects in the production cost and product performance.