A kind of brazing layer pre-deposition method

Abstract

The invention provides a brazed layer predeposition method, which comprises the following steps: A: vacuum sputtering coating a seed layer, and B: depositing each layer through a manner of sequentially alternating a gold layer and a tin layer. Through the scheme, the brazed layer predeposition method not only solves the problems existed in the prior art, and has the obvious advantages that aiming at a hybrid integrated circuit adopting braze, a process method by adopting soldering paste or soldering flux pieces in traditional soldering is improved, a layer of soldering flux layer with each component weight ratio being equivalent to components of the soldering flux pieces is deposited on a circuit soldering face (generally refers to a back face), the circuit can be directly placed on a soldering position when soldering is carried out, and soldering is realized through heating. Due to the technology, the processing workload for forming the soldering flux pieces can be reduced, and wastes caused by position offset among soldering positions, the soldering flux pieces, and the circuit to be soldered when soldering is carried out can be reduced.

Description

technical field

[0001] The invention relates to the field of brazing assembly of hybrid integrated circuits, in particular to a method for pre-depositing a brazing layer. Background technique

[0002] At present, hybrid integrated circuits are widely used in high reliability, high thermal conductivity and high electrical conductivity. The brazing assembly technology of hybrid integrated circuits is also receiving more and more attention. The quality of soldered chips of hybrid integrated circuits directly affects the circuit Whether it has high reliability, high thermal conductivity and high electrical conductivity.

[0003] The brazing process of hybrid integrated circuits, one method is to apply solder paste to the welding position, then place the hybrid integrated circuit on the solder paste with a placement machine, melt the solder paste by heating, and realize the brazing connection after cooling; Another method is to use solder sheet, cut the solder sheet to be the sa...

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