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Method for processing circuit board and electroplating waste water through microwave, micro-electrolysis and oxidation technologies

A technology for electroplating wastewater and technical treatment, which is applied in chemical instruments and methods, water/sewage multi-stage treatment, water/sludge/sewage treatment, etc. Quick and convenient installation, reasonable process design and strong operability

Inactive Publication Date: 2013-09-11
NANJING SANLE ELECTRONICS INFORMATION IND GRP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: the purpose of the present invention is to solve the problem of poor treatment effect of circuit board and electroplating wastewater in the prior art, and provide a kind of high operability, reasonable process design, high efficiency of comprehensive wastewater treatment of circuit board and electroplating, after treatment The effluent can meet the pollutant discharge standard of GB 18918-2002 urban sewage treatment plant, realize the discharge of sewage up to the standard, and the comprehensive technology of microwave, micro-electrolysis and oxidation technology, which is of great significance to environmental protection, is a method for treating circuit board and electroplating wastewater

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A method for treating circuit boards and electroplating wastewater by microwave, micro-electrolysis and oxidation technology, comprising the following steps:

[0033] (1) In the micro-electrolytic container, iron-carbon fillers are loaded to form an iron-carbon electrolytic bed, and a sulfuric acid solution with a volume concentration of 5% is loaded into the electrolytic container to activate for 25 minutes;

[0034] (2) After the activation is completed, discharge the sulfuric acid solution in the electrolytic container, rinse the iron-carbon electrolytic bed with tap water, and drain the residual sulfuric acid;

[0035] (3) Regulate the pH of the circuit board and the electroplating waste water at 2.0 with sulfuric acid, then put the circuit board and the electroplating waste water from the water inlet of the electrolysis container, and open the aeration device in the electrolysis container simultaneously, and carry out micro-electrolysis reaction 60min;

[0036] (4) ...

Embodiment 2

[0045] A method for treating circuit boards and electroplating wastewater by microwave, micro-electrolysis and oxidation technology, comprising the following steps:

[0046] (1) In the micro-electrolysis container, iron-carbon fillers are loaded to form an iron-carbon electrolysis bed, and the sulfuric acid solution that the volume concentration is loaded into the electrolysis container is 15% to activate for 5 minutes;

[0047] (2) After the activation is completed, discharge the sulfuric acid solution in the electrolytic container, rinse the iron-carbon electrolytic bed with tap water, and drain the residual sulfuric acid;

[0048] (3) Regulate the pH of the circuit board and the electroplating waste water with hydrochloric acid at 4.0, then put the circuit board and the electroplating waste water from the water inlet of the electrolytic container, and simultaneously open the aeration device in the electrolytic container, and carry out micro-electrolysis reaction for 20 minu...

Embodiment 3

[0058] A method for treating circuit boards and electroplating wastewater by microwave, micro-electrolysis and oxidation technology, comprising the following steps:

[0059] (1) Iron-carbon fillers are loaded into the micro-electrolysis container to form an iron-carbon electrolysis bed, and the sulfuric acid solution that the volume concentration is loaded into the electrolysis container is 10% to activate 10min;

[0060] (2) After the activation is completed, discharge the sulfuric acid solution in the electrolytic container, rinse the iron-carbon electrolytic bed with tap water, and drain the residual sulfuric acid;

[0061] (3) Regulate the pH of the circuit board and the electroplating wastewater with hydrochloric acid at 4.5, then put the circuit board and the electroplating wastewater from the water inlet of the electrolysis container, and simultaneously open the aeration device in the electrolysis container to carry out the micro-electrolysis reaction for 40 minutes;

...

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PUM

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Abstract

The invention discloses a method for processing a circuit board and electroplating waste water through microwave, micro-electrolysis and oxidation technologies. The method is used for treating the waste water by integrating the micro-electrolysis, microwave treatment and oxidation technologies. The maneuverability of the method is strong, the technical design is reasonable, the technical flow is short, heavy metal ions, organisms, fungus, algae and the like in the waste water can be high efficiently reduced, the water reaching the standard can be discharged, the application range is wide, and an important significance on the environmental protection can be realized.

Description

technical field [0001] The invention designs a method for treating circuit board and electroplating wastewater, in particular relates to a method for treating circuit board and electroplating wastewater by using microwave-micro-electrolysis-oxidation technology, and belongs to the technical field of sewage treatment. Background technique [0002] Circuit board wastewater is the wastewater produced during the production process of circuit boards. In the production process of printed circuit boards, the wastewater discharged from grinding, weak corrosion, and copper electroplating processes contains copper ions; The wastewater contains copper ions and complexing agent NH 4 OH, EDTA (tetrasodium ethylenediaminetetraacetic acid) and sodium potassium tartrate, etc.; the wastewater discharged from the nickel plating process contains nickel ions; the wastewater discharged from chemical cleaning, developing, stripping and other processes contains high molecular weight organic matter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/08
Inventor 吴浩张慧杨微解明魏浩胤
Owner NANJING SANLE ELECTRONICS INFORMATION IND GRP
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