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LED packaging material, its preparation method and application

A technology of LED packaging and ultraviolet light, which is applied in the direction of epoxy resin glue, adhesive type, film/sheet adhesive, etc., can solve the manufacturing and application limitations of LED packaging materials, and the LED packaging film is prone to problems , increase cost and other issues, achieve the effect of improving anti-yellowing property and light transmittance, expanding ultraviolet absorption wavelength and absorption intensity, and reducing dosage

Inactive Publication Date: 2013-09-11
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ultraviolet absorption spectrum range and intensity of this kind of ultraviolet light absorber have certain limitations, and the large dosage will easily cause yellowing, which will increase the cost. In addition, there are restrictions on chlorine-containing materials in various regions of the world. Synthetic LED packaging film is prone to problems, which limits the manufacture and application of LED packaging materials

Method used

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  • LED packaging material, its preparation method and application
  • LED packaging material, its preparation method and application
  • LED packaging material, its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029]

[0030]The cross-linking agent (methyl hexahydrophthalic anhydride), cross-linking agent accelerator (tetraethylammonium bromide), antioxidant (tri(2,4-di-tert-butylphenyl) phosphite ), UV stabilizer (bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate), UV absorber UV327 (2-(2-hydroxy-3,5- Dibutyl tert-ylphenyl)-5-chlorobenzotriazole) were added into the flask together, heated to 80°C under magnetic stirring, until the mixture was completely dissolved, cooled to room temperature; then added the above weight fraction of bisphenol A type Stir the epoxy resin evenly to obtain an epoxy composition; place it in a vacuum defoamer for 2 hours at room temperature to remove air bubbles, then inject it into a mold with LEDs, and cure it at 130°C for 2 hours. Take it out after natural cooling, and heat it again to 130° C. for 2 hours to remove residual stress and volatile components, and then a packaged light-emitting diode can be obtained. The ultraviolet aging test was carried...

Embodiment 2

[0032]

[0033] The cross-linking agent (methyl hexahydrophthalic anhydride), cross-linking agent accelerator (tetraethylammonium bromide), antioxidant (tri(2,4-di-tert-butylphenyl) phosphite ), UV stabilizer (bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate), UV absorber (5,5`-dithio-bis-[2 -(2`-Hydroxy-3`,5`-di-tert-butylphenyl)-2H-benzotriazole]) were added into the flask together, heated to 80°C under magnetic stirring, until the mixture was completely dissolved, Cool to room temperature; Add the bisphenol A type epoxy resin of above-mentioned weight fraction again, stir, namely obtain epoxy composition; At room temperature, it is placed in vacuum degassing machine to process 2 hours, to remove the bubble wherein, Then pour into the mold with LED, solidify at 130°C for 2 hours, take it out after natural cooling, and heat it again to 130°C for 2 hours to remove residual stress and volatile components, and you can get a packaged light-emitting diode. The ultraviolet aging...

Embodiment 3

[0035]

[0036] The cross-linking agent (methyl hexahydrophthalic anhydride), cross-linking agent accelerator (tetraethylammonium bromide), antioxidant (tri(2,4-di-tert-butylphenyl) phosphite ), UV stabilizer (bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate), UV absorber (5,5`-dithio-bis-[2 -(2`-Hydroxy-3`,5`-di-tert-butylphenyl)-2H-benzotriazole]) were added into the flask together, heated to 80°C under magnetic stirring, until the mixture was completely dissolved, Cool to room temperature; Add the bisphenol A type epoxy resin of above-mentioned weight fraction again, stir, namely obtain epoxy composition; At room temperature, it is placed in vacuum degassing machine to process 2 hours, to remove the bubble wherein, Then pour into the mold with LED, solidify at 130°C for 2 hours, take it out after natural cooling, and heat it again to 130°C for 2 hours to remove residual stress and volatile components, and you can get a packaged light-emitting diode. The ultraviolet aging...

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Abstract

Belonging to the field of packaging materials, the invention relates to an LED packaging material, its preparation method and application. The material is composed of the following components by weight: 100 parts of epoxy resin, 60 parts of a crosslinking agent, 2 parts of a crosslinking accelerant, 0.1-5 parts of an antioxidant, 0.05-0.25 part of an ultraviolet stabilizer, and 0.05-0.50 part of an ultraviolet absorber. In the invention, a sulfur-containing benzotriazole compound is adopted as the ultraviolet absorber, which has excellent performance and can reach a good synergistic effect with the antioxidant and the ultraviolet stabilizer, and can be used as the ultraviolet absorber of the LED packaging material. Compared with original ultraviolet absorbers, the ultraviolet absorber effectively enlarges the ultraviolet absorption wavelength and the absorption strength, thereby reducing the dosage of the ultraviolet absorber, lowering the cost, and improving the yellowing resistance of an adhesive film. The prepared LED adhesive film product has good stability, and has wide application prospects in industrial production.

Description

technical field [0001] The invention belongs to the field of encapsulation materials, and in particular relates to an LED encapsulation material and a preparation method and application thereof. Background technique [0002] In today's world, energy shortage has always been the most concerned issue. In the field of lighting technology, traditional lighting sources have gradually faded out of people's field of vision due to their high energy consumption and low photoelectric conversion efficiency. As a new type of lighting source, light-emitting diode (LED) has the potential to replace traditional lighting sources in terms of energy saving and pollution reduction, and is one of the ways to solve the current energy crisis in our country. The power consumption of LED lighting is only 1 / 10 of that of traditional light sources, the luminous efficiency is increased by 100 times, and the cost is reduced by 10 times. It has the characteristics of environmental friendliness, small s...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08G59/42C08K5/526C08K5/3435C08K5/378C09J7/00C09J163/02C09J11/06H01L33/56
Inventor 陈鸣才许凯杨坤方燕许正敏
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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