LED packaging material, its preparation method and application
A technology of LED packaging and ultraviolet light, which is applied in the direction of epoxy resin glue, adhesive type, film/sheet adhesive, etc., can solve the manufacturing and application limitations of LED packaging materials, and the LED packaging film is prone to problems , increase cost and other issues, achieve the effect of improving anti-yellowing property and light transmittance, expanding ultraviolet absorption wavelength and absorption intensity, and reducing dosage
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[0028] Example 1
[0029]
[0030] The above weight fraction of crosslinking agent (methylhexahydrophthalic anhydride), crosslinking agent accelerator (tetraethylammonium bromide), antioxidant (tris(2,4-di-tert-butylphenyl) phosphite) ), ultraviolet light stabilizer (bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate), ultraviolet light absorber UV327 (2-(2-hydroxy-3,5- Dibutyl tert-phenyl)-5-chlorobenzotriazole) was added to the flask together, heated to 80 ℃ under magnetic stirring, after the mixture was completely dissolved, cooled to room temperature; then add the above weight fraction of bisphenol A type Stir the epoxy resin evenly to obtain the epoxy composition; place it in a vacuum deaerator at room temperature for 2 hours to remove the bubbles, then pour it into a mold equipped with LEDs, and cure at 130°C for 2 hours. Take it out after natural cooling, and heat it again to 130°C for 2 hours to remove residual stress and volatile components, and then a packaged light emitt...
Example Embodiment
[0031] Example 2
[0032]
[0033] The above weight fraction of crosslinking agent (methylhexahydrophthalic anhydride), crosslinking agent accelerator (tetraethylammonium bromide), antioxidant (tris(2,4-di-tert-butylphenyl) phosphite) ), ultraviolet light stabilizer (bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate), ultraviolet light absorber (5,5`-disulfide-bis-[2 -(2`-hydroxy-3`,5`-di-tert-butylphenyl)-2H-benzotriazole]) was added to the flask together, heated to 80°C under magnetic stirring, until the mixture was completely dissolved, Cool to room temperature; then add the above-mentioned weight fraction of bisphenol A epoxy resin and stir evenly to obtain an epoxy composition; place it in a vacuum deaerator at room temperature for 2 hours to remove air bubbles. Then it is injected into a mold equipped with LEDs, cured at 130°C for 2 hours, cooled naturally, and taken out, and heated to 130°C for 2 hours to remove residual stress and volatile components, and then packaged lig...
Example Embodiment
[0034] Example 3
[0035]
[0036] The above weight fraction of crosslinking agent (methylhexahydrophthalic anhydride), crosslinking agent accelerator (tetraethylammonium bromide), antioxidant (tris(2,4-di-tert-butylphenyl) phosphite) ), ultraviolet light stabilizer (bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate), ultraviolet light absorber (5,5`-disulfide-bis-[2 -(2`-hydroxy-3`,5`-di-tert-butylphenyl)-2H-benzotriazole]) was added to the flask together, heated to 80°C under magnetic stirring, until the mixture was completely dissolved, Cool to room temperature; then add the above-mentioned weight fraction of bisphenol A epoxy resin and stir evenly to obtain an epoxy composition; place it in a vacuum deaerator at room temperature for 2 hours to remove air bubbles. Then it is injected into a mold equipped with LEDs, cured at 130°C for 2 hours, cooled naturally, and taken out, and heated to 130°C for 2 hours to remove residual stress and volatile components, and then packaged lig...
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