Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Single tube IGBT encapsulation full-bridge module and encapsulation method thereof

A single-tube and pin-based technology, applied in the field of single-tube IGBT package modules, can solve the problems of small thermal conductivity of insulating and thermally conductive silicone sheets, affecting work efficiency, and small heat dissipation area of ​​the module, so as to improve work efficiency and service life, optimize external structure, the effect of reducing production costs

Active Publication Date: 2013-09-11
SHANGHAI HUTONG ENTERPRISE GROUP
View PDF7 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]1. Two half-bridge IGBT modules form a full bridge and a dedicated full-bridge package IGBT: the traditional IGBT module used by inverter welding machines needs two half-bridges The modules form a full bridge to work, and the increase in the number of modules used increases the production cost of the product accordingly. The bottom area of ​​the wafer of the traditional IGBT module determines the small heat dissipation area of ​​the module itself, so that it cannot dissipate heat well
When using a traditional IGBT module, since there is no anti-static protection measure at both ends of the module wiring, it is easy to break down and damage the module when welding the drive line. Do a good job of anti-static measures to protect the module from breakdown
[0005]2. IGBT single-tube insulating heat-conducting film plus PCB board assembly group: the IGBT single-tube insulating heat-conducting film plus PCB board assembly group currently used in the welding machine field, During use, it is necessary to add a layer of insulating and thermally conductive silicone sheet at the bottom of the IGBT tube. Due to the small thermal conductivity of the insulating and thermally conductive silicone sheet, it is only 0.8w / m*k--4.5w / m*k, resulting in the IGBT tube being used There are certain heat conduction defects in the process, which affect the heat dissipation effect of the IGBT tube during the working process, and then affect its working efficiency
At the same time, the thermal paste applied on the insulating and thermally conductive silicone sheet will dry out after a certain period of use, which will affect the normal heat dissipation of the IGBT tube.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Single tube IGBT encapsulation full-bridge module and encapsulation method thereof
  • Single tube IGBT encapsulation full-bridge module and encapsulation method thereof
  • Single tube IGBT encapsulation full-bridge module and encapsulation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Step 1, evenly print solder paste with a thickness of 0.3 mm on the oxygen-free copper heat-conducting substrate 1 .

[0051] Step 2, fix the tooling tool on the oxygen-free copper heat-conducting substrate 1, and place the heat-conducting ceramic sheet at a fixed position through the position of the tooling tool.

[0052] Step 3, evenly apply 0.3mm thick solder paste on the thermally conductive ceramic sheet, and place 4 single-tube IGBT2 on the thermally conductive ceramic sheet. The single-tube IGBT2 can adopt the single-tube IGBT of the models IKW40N120, FGL60N100D, and FGL40N120.

[0053] Step 4: Fix the oxygen-free copper heat-conducting substrate 1, the heat-conducting ceramic sheet, and the four single-tube IGBTs 2 together with a fixing fixture and put them into a vacuum furnace.

[0054] Step 5: Evacuate the vacuum furnace to a vacuum state, gradually increase the temperature in the vacuum furnace to 170°C within 7 minutes, maintain for 3 minutes to fully mix...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a single tube IGBT encapsulation full-bridge module which comprises an oxygen-free copper heat-conducting substrate, a heat-conducting ceramic wafer and a plurality of single tube IGBTs. The heat-conducting ceramic wafer is fixedly arranged on the oxygen-free copper heat-conducting substrate through soldering paste which is evenly spread. The single tube IGBTs are respectively fixed on the heat-conducting ceramic wafer through soldering paste which is evenly spread. Due to the arrangement of the heat-conducting ceramic wafer, a heat dissipation condition that the IGBT module works can be improved, the problem that temperature rising is excessively large when the IGBT module works with high power is effectively solved, the working efficiency of the IGBT module is improved, and the service life of the IGBT module is prolonged. Due to the arrangement of a dust-proof cover, dust and liquid drops can be effectively prevented from entering the IGBT module in the process of using, electric leakage accidents can be effectively prevented from occurring, meanwhile, the external structure of the module is optimized, and the appearance of the module is more concise and elegant. According to the single tube IGBT encapsulation full-bridge module, the production cost of the whole IGBT module can be reduced, and a fault rate of the IGBT module in the process of using is reduced.

Description

technical field [0001] The invention relates to a single-tube IGBT package module, in particular to a single-tube IGBT package full-bridge module and a package method thereof. Background technique [0002] Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor, referred to as IGBT. [0003] The IGBT full-bridge circuit forms currently used in the field of inverter welding machines can be divided into the following types: 1. Two half-bridge IGBT modules form a full-bridge; 2. A dedicated full-bridge package IGBT; 3. IGBT single-tube insulation and heat conduction Film plus PCB board set. [0004] 1. Two half-bridge IGBT modules form a full bridge and a dedicated full-bridge package IGBT: the traditional IGBT module used in inverter welding machines requires two half-bridge modules to form a full bridge to work, and the increase in the number of modules used increases accordingly The production cost of the product is reduced. The bottom area of ​​th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L23/373
Inventor 郭少朋张通淼
Owner SHANGHAI HUTONG ENTERPRISE GROUP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products