Konjak gulcomannan printing thin film and preparation method thereof

Abstract

The invention relates to a konjak gulcomannan printing thin film and a preparation method thereof. The preparation method of the konjak gulcomannan printing thin film comprises the following steps of: preparing an impregnation solution, degassing, soaking a sticky material, drying and demoulding. The invention provides the konjak gulcomannan printing thin film for a printed circuit board. Konjak gulcomannan is taken as a carrier, and other auxiliaries are supplemented, so that the konjak gulcomannan printing thin film has excellent film-forming property and can maintain length and width to be constant when ambient temperature and relative humidity are changed; borax, CaCl2 and konjak gulcomannan esterification modified products have a synergistic effect, and a coordinate bond is formed, so that obtained gel is thermally stable gel; and paraffin is added, so that moisture resistance is improved and tensile strength is also enhanced. The konjak gulcomannan printing thin film is resistant to high temperature, high in transparency and applicable to a heat transfer printing method and a sensitization transcription method and has the advantages of low production cost and less environmental pollution.

Description

technical field [0001] The invention relates to a printing film for a printed circuit board and a preparation method thereof, in particular to a konjac glucomannan printing film and a preparation method thereof. Background technique [0002] In the prior art, most of the circuits developed and used in small batches are produced by universal circuit boards or entrusted to professional printed circuit board (Printed Circuit Board, PCB) manufacturers. It takes a long time and high cost to entrust professional manufacturers to produce small batches of printed circuit boards in the development stage, which leads to long development cycle and high cost. Therefore, developers of many small and medium-sized circuits turn their attention to thermal transfer printing. For example, the invention patent with the application number 200810066424.2 "a PCB panel manufacturing method" introduces a thermal transfer printing method. The printed circuit drawing is pasted on the metal plate and...

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Problems solved by technology

[0004] The invention patent "non-silicon release paper" with application number 201210144564.3 (application date: 2012.05.10), even if the non-silicon release agent transfers to the colloid and the circuit board itself when the non-silicon release paper of this patent is used, it will not affect the For the electrical performance of the circuit board, the glossy and matte surfaces are coated on both sides, which is easy for users to identify. However, due to the different materials on both sides of the paper, the inconsistent expansion and contraction rate under dry and high temperature will cause warpage on one side, which is not easy to print. ; Opaque, not suitable for photosensitive transcription method, and non-biodegradable, polluting the environment

[0005] The application number is 201020569674.0, a utility model patent "a film for printed circuit boards". The film paper used in the photosensitive transcription method skillfully avoids the possibility of tin spraying or thermal shock caused by the blackening of the wet template, and improves the reliability of the circuit board. Quality, but the material is PET, easy to pollute the environment, and only suitable for photosensitive transcription method

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