Chemical copper-plating activating process of ceramic material

Abstract

The invention discloses a chemical copper-plating activating process of a ceramic material. The chemical copper-plating activating process comprises the following steps of: firstly immersing a ceramic base body subjected to surface treatment into an activate fluid for soaking; then carrying out heat reduction treatment on the immersed ceramic base body to obtain an activated ceramic material, wherein the activate fluid comprises copper sulfate, nickel sulphate, sodium hypophosphite and water, the concentration sum of the copper sulfate and the nickel sulphate is 0.1-0.5 mol / L, and the ratio of the concentration sum of the copper sulfate and the nickel sulphate and the concentration of the sodium hypophosphite is 1:4. The chemical copper-plating activating process disclosed by the invention reduces the economic cost to a great degree, effectively saves the noble metal resources and reduces the resource waste by taking Cu and Ni as non-noble metals, reduces the pollution of noble metals on a plating layer by activating Cu and Ni, enhances the binding force and coverage rate of the plating layer by increasing the adhesive quantity of activated metals positioned on a ceramic surface by adopting the heat reduction treatment and has the advantages of activate fluid stability, simple process, less environment pollution and easiness for large-scale production.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of electroless copper plating, and relates to an electroless copper plating process, in particular to an activation process of electroless copper plating of ceramic materials. Background technique [0002] Electroless copper plating occupies a very important position in surface treatment technology. Compared with electroplating, it can not only obtain a uniform thickness of plating for complex geometric shapes, but also directly coat various metals, non-metals, semiconductors, etc. plating on the substrate. When implementing non-metallic electroless plating, activation treatment must be carried out. As the pretreatment of electroless plating, the traditional activation process is divided into two steps: sensitization and activation. Generally, SnCl 3 As a sensitizer and PdCl 2 as an activator. Although this process has an excellent activation effect, its operation is complicated, the ...

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Problems solved by technology

Although this process has an excellent activation effect, its operation is complicated, the activation solution is unstable, the economic cost is high, and it is easy to cause waste of resources.

Although a new process of colloidal palladium activation was proposed in the later period, which combined the sensitization and activation processes into one and simplified the activation process, precious metals such as Pd were still used as activators, which could not avoid high economic costs and contamination of the plating solution by precious metals.

[0003] In recent years, although someone proposed to use a new non-precious metal activation process, Gao Deshu et al. (Research on non-precious metal electroplating colloidal activation solution [J], Surface Technology, 1993, 2) easily impregnated the ABS plastic substrate with nickel and copper hydroxide colloids, with NaBH 4 Reducing divalent nickel and copper to a metallic state, and then electroless plating, has achieved certain results, but the preparation of the colloidal solution is more complicated, and the bonding force of the plating layer is relatively poor, and it is difficult to achieve complete coverage

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