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Heat dissipating device for integrated water-cooling straight seal high-power electronic components and manufacturing method thereof

A technology for electronic components and cooling devices, which is applied in the field of integrated water-cooled direct-seal high-power electronic component cooling devices, can solve the problems of low thermal conductivity and achieve the effect of avoiding heat dissipation bottlenecks and good heat dissipation effects

Active Publication Date: 2013-10-02
HUIZHOU LEADAO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The limitation of this kind of heat dissipation is that the connection between the ceramic and the heat sink must use thermally conductive glue, and the thermal conductivity is very low (<5W / mK)

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] A method for manufacturing an integrated water-cooled directly-sealed heat sink for high-power electronic components, comprising the following steps:

[0058] Form an 80μm aluminum oxide insulating layer on one side of the aluminum heat sink by anodic oxidation, and then magnetron sputtering a buffer layer: tungsten and titanium alloy 300?, and then magnetron sputtering metal silver 750?, To achieve its electrical conductivity, 50 μm of copper is electroplated, and the conductive layer is thickened. The thermal conductivity of the test is 28W / m·K. Then stick a film on the surface of the metal copper plating, etch to obtain the required circuit; finally electroless nickel plating / immersion gold 10μm, the heat sink can be obtained.

Embodiment 2

[0060] A method for manufacturing an integrated water-cooled directly-sealed heat sink for high-power electronic components, comprising the following steps:

[0061]Form an 80μm aluminum oxide insulating layer on one side of the aluminum radiator by anodic oxidation, and then magnetron sputtering a layer of buffer layer: tungsten and titanium alloy 550?, and then magnetron sputtering metal silver 800?, to achieve It is conductive, then electroplated copper 60μm, thicken the conductive layer, and the thermal conductivity of the test is 25W / m·K. Then stick a film on the surface of the metal copper plating, etch to obtain the required circuit; finally electroless nickel plating / immersion gold 10μm, the heat sink can be obtained.

Embodiment 3

[0063] A method for manufacturing an integrated water-cooled directly-sealed heat sink for high-power electronic components, comprising the following steps:

[0064] A layer of 60μm aluminum oxide insulating layer is formed on one side of the aluminum heat sink by anodic oxidation method, and then a layer of 400 ? Then electroplate copper 100μm, thicken the conductive layer, and test the thermal conductivity to be 23W / m·K. Then stick a film on the surface of the metal copper plating, etch to obtain the required circuit; finally electroless tin plating of 15 μm, the heat sink can be obtained.

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Abstract

The invention discloses a heat dissipating device for integrated water-cooling straight seal high-power electronic components. An aluminum oxide insulating layer, a buffer layer, a primary conducting layer, a secondary conducting layer and a weldable layer are arranged on the surface of a radiator in sequence; or the aluminum oxide insulating layer, a tantalum nitride layer, the buffer layer, the primary conducting layer, the secondary conducting layer and the weldable layer are arranged on the surface of the radiator in sequence. The manufacturing method of the heat dissipating device comprises the following steps: 1) forming the aluminum oxide insulating layer on the surface of the radiator; 2) forming the buffer layer; 3) forming the primary conducting layer; 4) forming the secondary conducting layer; 5) plating weldable layer metal; or the manufacturing method comprises the following steps: 1) forming the aluminum oxide insulating layer on the surface of the radiator; 2) forming the tantalum nitride layer; 3) forming the buffer layer; 4) forming the primary conducting layer; 5) forming the secondary conducting layer; 6) plating weldable layer metal. The heat dissipating device is good in heat dissipation effect.

Description

technical field [0001] The invention relates to an integrated water-cooled directly sealed high-power electronic component radiator and a manufacturing method thereof. Background technique [0002] In order to effectively solve the heat dissipation problem of a large amount of heat released by high-power devices in the process of photoelectric conversion. Taking LED as an example, the conventional method is to use a ceramic circuit board with high thermal conductivity, and the ceramic circuit board itself is insulated. Electronic circuits are processed on top of ceramics. Subsequently, the LED lamp beads are packaged (soldered, gold wire bonded) on the ceramic substrate. Then paste the ceramic substrate (the back plate is ceramic) on the surface of the heat sink (aluminum or copper) using thermally conductive adhesive. Carry out water cooling or air cooling for heat dissipation. The limitation of this heat dissipation is that the connection between the ceramic and the he...

Claims

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Application Information

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IPC IPC(8): H01L33/64
Inventor 崔国峰范玥赵杰
Owner HUIZHOU LEADAO ELECTRONICS MATERIAL
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