Thermosetting resin composition as well as prepreg and laminate prepared from same

A technology of resin composition and prepreg, which is applied in the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and electronic materials, can solve the problems of increasing filler content, increasing the difficulty of drilling, and shortening the service life of drill bits, etc. The effect of reducing water absorption, excellent dielectric properties, and low thermal expansion coefficient

Active Publication Date: 2013-10-09
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the high-frequency and high-speed field, there are also the following problems in high-filling copper-clad laminates: (1) The dielectric constant of the filler is high. After the filling amount increases, the dielectric constant

Method used

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  • Thermosetting resin composition as well as prepreg and laminate prepared from same
  • Thermosetting resin composition as well as prepreg and laminate prepared from same
  • Thermosetting resin composition as well as prepreg and laminate prepared from same

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Embodiment Construction

[0059] The present invention will be further described below in conjunction with embodiment:

[0060] A thermosetting resin composition, by solid weight, comprises the following components, as shown in the table below:

[0061]

[0062] Note: In the above table, A component means allyl modified bismaleimide resin, B component means cyanate ester compound, C component means active ester compound, D component means epoxy resin compound, E Represents flame retardant, F represents curing accelerator, and G represents inorganic filler.

[0063] Synthesis of allyl-modified bismaleimide prepolymer: react 100 parts of bismaleimide resin with 50 parts of allyl compound at 135°C for 80 minutes, then cool to room temperature, that is Obtain required allyl modified bismaleimide resin prepolymer A1;

[0064] React 100 parts of bismaleimide resin with 100 parts of allyl compound at 155°C for 50 minutes, then cool to room temperature to obtain the desired allyl-modified bismaleimide res...

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Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises the following solid components in parts by weight: 10-60 parts of an allyl-modified bismaleimide resin prepolymer, 10-50 parts of a cyanate ester resin, 10-30 parts of an active ester, 5-25 parts of epoxy resin and 0-35 parts of an inorganic filler. The novel thermosetting resin composition disclosed by the invention contains less inorganic filler, but the novel thermosetting resin composition has low thermal expansion coefficient, can maintain high rigidity and can not be affected in excellent dielectric electrical properties. The novel thermosetting resin composition can be well applied to the field of high-density interconnected integrated-circuit packaging and the high-speed high-frequency high-performance printed circuit boards.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition, a prepreg and a laminate made by using the thermosetting resin composition, which can be applied to the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like. Background technique [0002] Since 2005, at the World Summit on the Information Society held in Tunisia, the International Telecommunication Union (ITU) put forward the concept of "Internet of Things". The Internet is connected to realize intelligent identification, management and operation; this will be another wave of reform and development of the information industry after computers, the Internet and mobile communication networks.” One of the main characteristics of the Internet of Things is the large amount of information, so Therefore, the carrier device with "high frequency and high speed" information processing ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L79/04C08L63/00C08L63/02C08K13/02C08K5/12C08J5/24B32B27/04B32B15/092
Inventor 崔春梅戴善凯肖升高黄荣辉谌香秀季立富
Owner SHENGYI TECH SUZHOU
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