Thermosetting resin composition as well as prepreg and laminate prepared from same

Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises the following solid components in parts by weight: 10-60 parts of an allyl-modified bismaleimide resin prepolymer, 10-50 parts of a cyanate ester resin, 10-30 parts of an active ester, 5-25 parts of epoxy resin and 0-35 parts of an inorganic filler. The novel thermosetting resin composition disclosed by the invention contains less inorganic filler, but the novel thermosetting resin composition has low thermal expansion coefficient, can maintain high rigidity and can not be affected in excellent dielectric electrical properties. The novel thermosetting resin composition can be well applied to the field of high-density interconnected integrated-circuit packaging and the high-speed high-frequency high-performance printed circuit boards.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition, a prepreg and a laminate made by using the thermosetting resin composition, which can be applied to the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like. Background technique [0002] Since 2005, at the World Summit on the Information Society held in Tunisia, the International Telecommunication Union (ITU) put forward the concept of "Internet of Things". The Internet is connected to realize intelligent identification, management and operation; this will be another wave of reform and development of the information industry after computers, the Internet and mobile communication networks.” One of the main characteristics of the Internet of Things is the large amount of information, so Therefore, the carrier device with "high frequency and high speed" information processing ...

AI Technical Summary

Problems solved by technology

However, in the high-frequency and high-speed field, there are also the following problems in high-filling copper-clad laminates: (1) The dielectric constant of the filler is high. After the filling amount increases, the dielectric constant of the system will increase accordingly. (2) The increase of the filler content will increase the difficulty of drilling in the process of PCB processing, and the hard silica filler will seriously shorten the service life of the drill bit.

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