Thermosetting resin composition and prepreg and laminate made using it
A resin composition and prepreg technology, applied in the fields of electronic materials, integrated circuit packaging, high frequency, high speed and high density interconnection, can solve the problems of increasing filler content, increasing the difficulty of drilling, shortening the service life of drill bits, etc. The effect of reducing water absorption, excellent dielectric properties, and low thermal expansion coefficient
Active Publication Date: 2015-11-18
SHENGYI TECH SUZHOU
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, in the high-frequency and high-speed field, there are also the following problems in high-filling copper-clad laminates: (1) The dielectric constant of the filler is high. After the filling amount increases, the dielectric constant of the system will increase accordingly. (2) The increase of the filler content will increase the difficulty of drilling in the process of PCB processing, and the hard silica filler will seriously shorten the service life of the drill bit.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0059] The present invention will be further described below in conjunction with embodiment:
[0060] A thermosetting resin composition, by solid weight, comprises the following components, as shown in the table below:
[0061]
[0062] Note: In the above table, A component means allyl modified bismaleimide resin, B component means cyanate ester compound, C component means active ester compound, D component means epoxy resin compound, E Represents flame retardant, F represents curing accelerator, and G represents inorganic filler.
[0063] Synthesis of allyl-modified bismaleimide prepolymer: react 100 parts of bismaleimide resin with 50 parts of allyl compound at 135°C for 80 minutes, then cool to room temperature, that is Obtain required allyl modified bismaleimide resin prepolymer A1;
[0064] React 100 parts of bismaleimide resin with 100 parts of allyl compound at 155°C for 50 minutes, then cool to room temperature to obtain the desired allyl-modified bismaleimide res...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises the following solid components in parts by weight: 10-60 parts of an allyl-modified bismaleimide resin prepolymer, 10-50 parts of a cyanate ester resin, 10-30 parts of an active ester, 5-25 parts of epoxy resin and 0-35 parts of an inorganic filler. The novel thermosetting resin composition disclosed by the invention contains less inorganic filler, but the novel thermosetting resin composition has low thermal expansion coefficient, can maintain high rigidity and can not be affected in excellent dielectric electrical properties. The novel thermosetting resin composition can be well applied to the field of high-density interconnected integrated-circuit packaging and the high-speed high-frequency high-performance printed circuit boards.
Description
technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition, a prepreg and a laminate made by using the thermosetting resin composition, which can be applied to the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like. Background technique [0002] Since 2005, at the World Summit on the Information Society held in Tunisia, the International Telecommunication Union (ITU) put forward the concept of "Internet of Things". The Internet is connected to realize intelligent identification, management and operation; this will be another wave of reform and development of the information industry after computers, the Internet and mobile communication networks.” One of the main characteristics of the Internet of Things is the large amount of information, so Therefore, the carrier device with "high frequency and high speed" information processing ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L79/04C08L63/00C08L63/02C08K13/02C08K5/12C08J5/24B32B27/04B32B15/092
Inventor 崔春梅戴善凯肖升高黄荣辉谌香秀季立富
Owner SHENGYI TECH SUZHOU