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Rare bismuth semiconductor quantum well structure improved in heat stability and preparation method for rare bismuth semiconductor quantum well structure

A technology of thermal stability and quantum well, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of no improvement in the structure and method of the thermal stability of dilute bismuth semiconductor quantum wells, and the reduction of bismuth element content, so as to achieve easy control , Improve thermal stability, simple operation process

Inactive Publication Date: 2013-10-23
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Application Information

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Problems solved by technology

However, under the action of high temperature annealing, the bismuth atoms in the dilute bismuth semiconductor quantum well layer will diffuse to the barrier layer of the quantum well, resulting in a decrease in the bismuth element content in the quantum well layer. one of the major challenges of
[0004] Dilute bismuth semiconductor materials are a new research direction that has only emerged in recent years. The thermal stability of dilute bismuth semiconductor quantum wells has only recently been discovered and understood. At present, there is no structure and method to improve the thermal stability of dilute bismuth semiconductor quantum wells. learn from

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  • Rare bismuth semiconductor quantum well structure improved in heat stability and preparation method for rare bismuth semiconductor quantum well structure
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Embodiment 1

[0024] The following takes the preparation process of GaAsBi / AlGaAs double quantum well on GaAs substrate as an example to illustrate the structure and preparation steps of improving the thermal stability of the quantum well by adding bismuth element in the potential barrier. These structures and preparation steps can be directly extended to other types Dilute bismuth semiconductor quantum wells. Concrete structure and preparation steps are as follows:

[0025] (1) First grow a 100nm GaAs buffer layer on the GaAs substrate;

[0026] (2) Growth of 15nm AlGaAsBi barrier layer;

[0027] (3) Keep the shutters of the Ga, As and Bi beam source furnaces open, close the shutter of the Al beam source furnace, and grow a 10nm GaAsBi potential well layer;

[0028] (4) Continue to grow a 15nm AlGaAsBi barrier layer and a 10nm GaAsBi potential well layer;

[0029] (5) Finally, a 15nm AlGaAsBi barrier layer is grown to complete the growth of the dilute bismuth double quantum well structu...

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Abstract

The invention relates to a rare bismuth semiconductor quantum well structure improved in heat stability and a preparation method for the rare bismuth semiconductor quantum well structure. A barrier layer of the quantum well structure contains a bismuth element. By taking a gallium-arsenic-bismuth (GaAsBi) quantum well as an example, the preparation method for the quantum well structure comprises the following steps of: (1) growing a GaAs buffer layer on a GaAs substrate; (2) growing an aluminum-gallium-arsenic-bismuth (AlGaAsBi) barrier layer; (3) growing a GaAsBi potential well layer; (4) continuously and repeatedly growing the AlGaAsBi barrier layer and the GaAsBi potential well layer of N-1 periods, wherein N is not less than 1 but not greater than 5; and (5) finally, growing AlGaAsBi barrier layer. The rare bismuth semiconductor quantum well structure disclosed by the invention is good in heat stability, can be grown by using various methods of conventional molecular beam epitaxy, atomic layer deposition and the like, is simple in operation process and is easy to control.

Description

technical field [0001] The invention belongs to the field of semiconductor optoelectronic materials and its preparation, in particular to a dilute bismuth semiconductor quantum well structure with improved thermal stability and a preparation method thereof. Background technique [0002] In recent years, dilute bismuth semiconductor materials have attracted more and more international attention because of their unique and important properties. It is found that the temperature dependence of the band gap of GaAsBi materials is much smaller than that of GaAs or InGaAsP materials. For GaAsBi materials with a bismuth composition in the range of 0.019-0.05, the temperature coefficient of the band gap is about 0.1-0.4meV / K, which is lower than 0.56meV of GaAs. / K. Due to the large atomic mass of bismuth, it is expected that bismuth compounds have a large spin-orbit splitting energy, which can suppress Auger recombination and increase the characteristic temperature of lasers. At th...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/06H01L33/30H01L33/00
Inventor 王庶民顾溢宋禹忻叶虹
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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