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Curable epoxy resin composition

A technology for curing epoxy resins and compositions, which is applied in the directions of electrical solid devices, semiconductor/solid device parts, electrical components, etc., can solve the problem that it is difficult to increase the amount of inorganic fillers and the fluidity of curable epoxy resin compositions. and other problems, to achieve the effect of improving flame retardancy, improving reliability, and reducing the possibility of damage

Active Publication Date: 2013-10-23
DOW CORNING TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to increase the fluidity of a curable epoxy resin composition during molding using conventional organopolysiloxane resins, and thus it is also difficult to increase the amount of inorganic filler mixed in the composition

Method used

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  • Curable epoxy resin composition
  • Curable epoxy resin composition
  • Curable epoxy resin composition

Examples

Experimental program
Comparison scheme
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preparation example Construction

[0091] The preparation method of the curable epoxy resin composition of the present invention is not particularly limited, but the curable epoxy resin composition is prepared by uniformly mixing component (I) and component (II) and other optional components. In the case of using component (III), when component (II) is mixed into a composition in which component (I) and component (III) have been mixed in advance, the dispersibility of component (II) can be improved. In addition, another example is a method in which ingredient (I) and ingredient (IV) are mixed first, and then ingredient (II) and other optional ingredients are uniformly mixed. Other examples of this situation also include a method in which a coupling agent is added to ingredient (I) and ingredient (IV) to prepare an integrated blend, and a method in which In this, the component (IV) is surface-treated with a coupling agent in advance, and then it is mixed with the component (I). In addition, examples of the appar...

example

[0095] The present invention is described in detail below based on examples, but the present invention is not limited to the following examples. In the examples, Ph represents a phenyl group, Me represents a methyl group, and Ep represents a 3-glycidoxypropyl group.

[0096] (Viscosity)

[0097] The measurement was performed at 25°C using a Vismetron VG-A1 single-cylinder rotary viscometer (produced by Shibaura System).

[0098] (Weight average molecular weight)

[0099] This value is obtained by standard polystyrene conversion using gel permeation chromatography.

[0100] (Glass transition temperature (Tg))

[0101] A differential calorimeter (DSC: SSC5200 produced by Seiko Instruments Inc. (SII)) was used for measurement.

[0102] (Structural analysis)

[0103] The structure of organopolysiloxane passes 29 Confirmed by Si-NMR spectroscopy (JNM-ECA500 produced by NEC).

[0104] (Epoxy resin equivalent)

[0105] The measurement is performed by the titration method based on JIS K-7236.

[010...

preparation example 1

[0119] The 155.5g of phenyltrichlorosilane hydrolysis / condensation product prepared above, 80.5g of 3-glycidoxypropylmethyldimethoxysilane, 264g of 2,4,6,8-tetramethyl-2,4,6 , 8-tetraphenylcyclotetrasiloxane, 500g toluene and 0.15g cesium hydroxide were put into a 1,000mL flask equipped with a thermometer, Dean-Stark tube and reflux cooling tube. An additional 10.0g of water is added. Then the water and methanol generated when the system was heated were distilled out, and the system was heated and refluxed for another 6 hours. After cooling, 0.08 g of acetic acid was put into the system for neutralization. The generated salt was then filtered, and the filtrate was heated in vacuum to distill off toluene and obtain 475 g of a colorless transparent liquid. The colorless transparent liquid has a weight average molecular weight of 2,500, a glass transition temperature of -40°C and an epoxy equivalent of 1,300. 29 Si-NMR spectrum analysis confirmed that it was a 3-glycidoxypropyl-...

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Abstract

To provide a curable epoxy resin composition that exhibits excellent fluidity during molding without having adverse effects on the physical properties of the cured material. A curable epoxy resin composition, containing (I) a curable epoxy resin, and (II) an epoxy functional group- and aromatic hydrocarbon group-containing organopolysiloxane having an epoxy equivalent weight of 3,000 or lower, a content of aromatic hydrocarbon groups of 45 to 80% by weight (mass), and a glass transition point of less than 0°C.

Description

Technical field [0001] The present invention relates to a curable epoxy resin composition having good fluidity during molding. [0002] This patent application claims the priority of Japanese Patent Application No. 2010-289723 filed on December 27, 2010, the content of which is incorporated herein by reference. Background technique [0003] Nowadays, flame-retardant curable epoxy resin compositions free of halogens, phosphorus compounds and heavy metals are widely used in electrical and electronic components. For example, flame-retardant curable epoxy resin compositions mixed with silica or other inorganic fillers have been used in semiconductor encapsulants. [0004] If the fluidity of the curable epoxy resin composition decreases during molding, there is a possibility that it may cause damage to semiconductors or other electronic components during the sealing of electronic components, or may not be able to fill the mold during molding Therefore, it may be difficult to function as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20C08K3/36C08K7/18C08L63/00H01L23/29H01L23/31
CPCH01L23/296C08K5/5419C08G59/621H01L2924/0002C08G77/14C08G77/80C08L63/00C08L83/06H01L2924/00C08L83/04C08K3/36C08G59/20C08K7/18H01L23/29H01L23/31
Inventor 正富亨吉泽武森田好次佐佐木基
Owner DOW CORNING TORAY CO LTD
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