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A kind of conductive silver glue and preparation method thereof

A technology of conductive silver glue and silver powder, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of short curing time, long curing time, high shrinkage rate, etc., and achieve good fluidity, high product quality, The effect of low shrinkage

Active Publication Date: 2015-07-29
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of the existing conductive silver glue such as long curing time and high shrinkage rate, the purpose of the present invention is to provide a conductive silver glue with short curing time and low shrinkage rate.

Method used

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  • A kind of conductive silver glue and preparation method thereof
  • A kind of conductive silver glue and preparation method thereof
  • A kind of conductive silver glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Component formula (parts by weight):

[0038] 52 parts of spherical silver powder, 15 parts of bisphenol A epoxy resin, 18 parts of cyclohexanone, 4 parts of dicyandiamide, 1 part of imidazole, 9 parts of moisture curing polyurethane and 1 part of polyethylene glycol ether.

[0039] Preparation Process:

[0040] After mixing the above-mentioned components, stirring and defoaming are performed until the components are uniformly dispersed to obtain the finished conductive silver paste.

[0041] The curing temperature of the above-mentioned conductive silver glue is about 70°C, the curing time is about 15 minutes, the longitudinal shrinkage rate after curing is about 15%, the transverse shrinkage rate is less than 5%, and the resistivity is less than 1.2×10 -4 Ω·cm. Appearance after curing see Figure 5 .

Embodiment 2

[0043] Component formula (parts by weight):

[0044] 50 parts spherical silver powder, 10 parts bisphenol A epoxy resin, 4 parts aliphatic epoxy resin, 21 parts isopropyl alcohol, 4 parts adipic dihydrazide, 9 parts moisture curing polyurethane and 2 parts polyethylene glycol ether.

[0045] The preparation process is the same as in Example 1.

[0046] The curing temperature of the above-mentioned conductive silver glue is about 70°C, the curing time is about 16 minutes, the longitudinal shrinkage rate after curing is about 17%, the transverse shrinkage rate is less than 5%, and the resistivity is less than 1.2×10 -4 Ω·cm.

Embodiment 3

[0048] Component formula (parts by weight):

[0049] 56 parts of spherical silver powder, 10 parts of bisphenol A epoxy resin, 2 parts of aliphatic epoxy resin, 16 parts of acetone, 2 parts of adipic acid dihydrazide, 2 parts of dicyandiamide, 1 part of imidazole, 9.5 parts of moisture curing polyurethane and 1.5 parts polyethylene glycol ether.

[0050] The preparation process is the same as in Example 1.

[0051]The curing temperature of the above-mentioned conductive silver glue is about 70°C, the curing time is about 14 minutes, the longitudinal shrinkage rate after curing is about 14%, the transverse shrinkage rate is less than 5%, and the resistivity is less than 1.2×10 -4 Ω·cm.

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Abstract

A conductive silver paste comprises silver powder. The silver powder is spherical silver powder. Also disclosed is a method for preparing the conductive paste. The conductive silver paste has higher and more uniform heating-curing efficiency, the curing time is obviously shortened, and the production capacity is improved.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to a conductive silver glue and a preparation method thereof. Background technique [0002] In order to conduct static electricity, in-plane switching (IPS, In-Plane Switching) and fringe field switching (FFS, Fringe Field Switching) liquid crystal display products need to dispense silver glue on the back ITO of the color filter substrate and the grounding resistance area of ​​the array substrate. Traditional epoxy conductive silver glue is usually made of flaky or dendritic silver powder, mixed with a certain proportion of epoxy resin, curing agent, dispersant, etc. The curing temperature is high and the curing time is long, usually heated at about 70 ° C for 2 hours , affecting the production capacity of chips on glass substrates (COG, Chip On Glass). In order to speed up the turnover, more ovens had to be installed on the production line, which not only increased the investme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J163/02C09J163/00C09J163/04C09J11/08
CPCC08K2003/0806C09J163/04C08K3/08C09J163/00C09J9/02C08K7/18C09J11/04C08L75/04
Inventor 石博
Owner BOE TECH GRP CO LTD
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