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Cyanide-free electrosilvering solution applicable to high-speed electroplating and electroplating process

A high-speed electroplating and electroplating process technology, which is applied in the field of electroplating silver, can solve problems such as narrow temperature window, low coating performance, and harsh process conditions, and achieve high stability.

Inactive Publication Date: 2013-11-20
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cyanide-free silver plating system currently used generally has problems such as poor stability of the plating solution, easy failure when exposed to light, poor resistance to cold and heat exchange, low coating performance, harsh process conditions allowed, narrow temperature window, and narrow current density range.

Method used

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  • Cyanide-free electrosilvering solution applicable to high-speed electroplating and electroplating process
  • Cyanide-free electrosilvering solution applicable to high-speed electroplating and electroplating process
  • Cyanide-free electrosilvering solution applicable to high-speed electroplating and electroplating process

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Experimental program
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specific Embodiment approach 1

[0022] Specific embodiment one: The cyanide-free electroplating solution that can be used for high-speed electroplating in this embodiment uses hydantoin derivatives as the main complexing agent, and weighs potassium hydroxide 35 ~ 325g / L and hydantoin derivatives 50 ~450 g / L, auxiliary complexing agent 10~300 g / L mixed to completely dissolve the mixed complexing agent to obtain a solution of complex complexing agent, add potassium carbonate 35~300g / L to make conductive salt, and use potassium hydroxide Adjust the pH value between 9~14, weigh 5~105g / L of silver nitrate, dissolve the silver nitrate and mix it with the previously prepared complexing agent solution to form the basic solution for electroplating silver. The resistivity of the prepared plating solution is Prepared with 18MΩ / cm ultrapure water.

[0023] The main purpose of the silver plating solution made by this system is to be used for high-speed electroplating. In order to solve the problem of poor bonding between...

specific Embodiment approach 2

[0031] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the electroplating process of the pre-silvering is: constant current electroplating method, and the current density is 0.5A / dm 2 , the distance between the cathode and the anode is 5cm, the temperature is 55°C, and the plating time is 1.5min. Quick electroplating silver bath composition: 1,3-dimethylol-5,5-dimethylhydantoin 180g / L, uracil 65g / L, 2-hydroxypyridine 10g / L, silver nitrate 45g / L , potassium carbonate 90g / L, potassium hydroxide 80g / L, adjust the pH to 10, the distance between the cathode and anode during the electroplating process is 5cm, the bath temperature is 50°C, and the current density is 2.0A / dm 2 , stirring properly; in the two-step silver plating operation, the soluble silver plate is used as the anode. Rapid electroplating Silver plating takes 5 minutes to obtain a silver plating layer that is smooth and bright macroscopically, dense in microscopic cryst...

specific Embodiment approach 3

[0032] Specific embodiment three: the difference between this embodiment and specific embodiment two is that the rapid electroplating silver plating solution consists of: 1,3-dibromo-5,5-dimethylhydantoin 95g / L, butanedi Imide 115g / L, Niacinamide 15g / L, Pyrophosphate 55g / L, Silver Nitrate 38g / L, Potassium Carbonate 100g / L, Potassium Hydroxide 75g / L, adjust the pH to 11, the copper sheet is electrolytically degreased , 1:1 HCl aqueous solution pickling and water washing as the cathode, the soluble silver plate as the anode, the distance between the cathode and the anode is 6cm, the bath temperature is 55°C, and the current density is 3.5A / dm 2 , stirred properly, and the electroplating time was 15 minutes, to obtain a silver-plated silver layer that is macroscopically smooth and bright, microscopically dense in SEM observation, good in leveling ability in AFM observation, pure in coating composition and free of impurities in XPS observation.

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Abstract

The invention discloses a cyanide-free electrosilvering solution applicable to high-speed electroplating and an electroplating process, which belong to the technical field of electrosilvering. The electrosilvering solution is prepared from hydantoin derivatives, an auxiliary complexing agent, potassium hydroxide, potassium carbonate, silver nitrate and ultrapure water. The electrosilvering process comprises the following steps of: firstly, pre-plating an intermediate silver-plating layer and performing quick silver-plating; secondly, after the electroplating, taking a sample out of the electroplating solution, cleaning the surface of the sample through distilled water, and performing cold air drying. The obtained electroplating solution of an electrosilvering system does not contain extremely toxic substances and is extremely high in stability; the phenomena of precipitation, color changing and the like of a newly-prepared plating solution and a plating solution subjected to repeated constant-current plating, which are placed for over two months, are avoided; the plating effect of all plating solutions, which are placed for a long time or work for a long time, is the same as that of a newly prepared plating solution; a silver-plating layer with good appearance can be obtained in a wide temperature range and a wide current density range.

Description

technical field [0001] The invention belongs to the technical field of electroplating silver, and relates to a cyanide-free electroplating silver plating solution and an electroplating process that can be used for high-speed electroplating. Background technique [0002] For a long time, metallic silver has been widely used in various industries due to its excellent appearance, chemical stability, good electrical conductivity, thermal conductivity and brazing performance. However, due to limited resources, the cost of using metallic silver is relatively high. Therefore, in general, a layer of metallic silver is plated on the surface of the workpiece to be treated by methods such as electroplating, chemical plating, physical vapor deposition, and chemical vapor deposition. , which not only makes it have the excellent characteristics of silver, but also can significantly reduce the cost, among which electroplating is an efficient, simple and low-cost method of surface silver pl...

Claims

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Application Information

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IPC IPC(8): C25D3/46C25D5/10
Inventor 安茂忠刘安敏任雪峰张锦秋杨培霞
Owner HARBIN INST OF TECH
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