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Release film for printed circuit board molding, and making method thereof

A technology of printed circuit board and release film, applied in the field of plastic film, can solve the problems of affecting welding performance, insufficient softness, high price, etc., and achieve the effect of ensuring deformation followability, reducing cost and low cost

Active Publication Date: 2013-12-11
胡宇翔
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these films have their limitations. Teflon films and polyprene films are not only expensive, but also not soft enough, and circuit boards with large unevenness are likely to cause poor bonding when they are pressed.
However, silicon-coated release film and release paper are prone to migration of silicone components to printed circuit boards during use, affecting soldering performance and reducing their quality.
Recently, there is also an attempt to make a release film by combining TPX film and soft resin, but if the core layer resin is not well selected, it will easily overflow, causing contamination of the printed circuit board, and it cannot solve the problem of high price

Method used

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  • Release film for printed circuit board molding, and making method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1, sample film preparation

[0033] The No.1-9 films listed in Table 1 were prepared by a three-layer co-extrusion method, and the thicknesses were all 120 microns.

[0034] A film with a thickness of 80 microns and containing 70% PETG and 30% nylon 6 was prepared by single-layer extrusion, and a 20 micron PET film was laminated on both sides to make sample 10.

[0035] A high temperature resistant PP film (sample A) and a TPX film (sample B) with a thickness of 120 microns were prepared by a single-layer extrusion method for comparison of release properties.

[0036] Table 1 Sample number and composition list

[0037] Sample serial number 1 2 3 Core composition PETG70: PP30 PETG85: PP25 PET75: Nylon 6 25 Surface composition PET PET PET

[0038] Sample serial number 4 5 6 Core composition PETG75: PP25 PET75: PP25 PET75: PP25 Surface composition PET PBT PTT

[0039] Samp...

Embodiment 2

[0040] Embodiment 2, release effect comparison

[0041] Attach the above samples to both sides of the circuit board, conduct a hot pressing test, and use the release property and shape followability to determine whether it can be used as a release film.

[0042] Table 2 Comparison table of release effect of each sample

[0043] sample Release shape following Comprehensive judgment 1 qualified qualified qualified 2 qualified qualified qualified 3 qualified qualified qualified 4 qualified qualified qualified 5 qualified qualified qualified 6 qualified qualified qualified 7 qualified qualified qualified 8 qualified qualified qualified 9 qualified qualified qualified 10 qualified qualified qualified A very poor qualified unqualified B qualified unqualified unqualified

[0044]Release and shape followability are two major indicators for evaluat...

Embodiment 3

[0045] Embodiment 3, pollution comparison

[0046] The circuit board samples that passed the above pressing test and the circuit boards laminated with release paper containing silicon release layer were analyzed by fluorescent X-ray for the silicon element on the solder joints. The solder joints of the pressed circuit board contain silicon element, which will cause virtual soldering and desoldering; while the above solder joints of the circuit board pressed with the release film of the present invention do not contain silicon element, and the pollution test is qualified.

[0047] In the present invention, the film structure of the core layer is replaced by the film structure of the surface layer of polyester resin with high melting point and high crystallization and the blend of low melting point resin as the main component, which not only ensures the release of the integrated circuit board after stamping at high temperature It also guarantees the deformation followability of ...

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Abstract

The invention provides a release film for printed circuit board molding. The release film for printed circuit board molding comprises at least two surface layers and one core layer; each of the surface layers is composed of a high-crystallization polyester resin having a melting point of above 200DEG C, or the high-crystallization polyester resin and low-melting-point olefin, or a polyformaldehyde high-crystallization resin; and the core layer is composed of a low-crystallization or non-crystalline polyester resin and the low-melting-point olefin or polar-group-containing flexible resin blend. The release film guarantees the release of a stamped integrated circuit board at a high temperature, also guarantees the deformation tracing ability of the film during processing, has a good stitching property, does not pollute the environment during waste because of the zero content of halogen elements, and has the advantages of excellent quality, low cost and environmental protection.

Description

technical field [0001] The invention relates to the field of plastic films, in particular to a release film for forming printed circuit boards and a manufacturing process thereof. Background technique [0002] In the manufacturing process of printed circuit boards, flexible printed circuit boards, and multilayer printed circuit boards, when performing thermal compression lamination processing of copper plates or copper foils and resin substrates or heat-resistant films, and for flexible printed circuits that have formed circuits When the surface protection film is attached to the board with a thermosetting adhesive, a processing method that widely uses a release film to separate the parts and the hot-pressed film tool is used. This is to prevent the bonding between the processed products and between the processed products and the mold. At the same time, if it is necessary to prevent the interlayer adhesive from overflowing to the edge of the wiring during hot pressing, the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/08B32B27/36B32B27/42B32B37/10B32B37/12
Inventor 胡宇翔孟晖
Owner 胡宇翔
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