SMT printing steel plate and manufacturing technology thereof
A production process, steel plate technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve the problems of unclear shape of solder paste, low surface insulation resistance, poor roughness, etc., to improve surface hardness and Effects of surface tension, improved tin repellency, and reduced contamination
Inactive Publication Date: 2013-12-11
卢世闵
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Problems solved by technology
[0007] The roughness of the inner wall of the steel plate hole is not good, it is easy to cause solder paste powder residue, the shape of the printed solder paste is not clear, and it will also produce low surface insulation resistance
Method used
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Experimental program
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Embodiment Construction
[0021] The present invention is described further below:
[0022] The present invention explains the following technical terms:
[0023] SMT solder- surface mount technology reflow- reflow soldering
[0024] CFC-Chlorofluorocarbons HCFC-Hydrochlorofluorocarbons
[0025] PCB-printed circuit board undercut-undercut (break difference, small undercut)
[0026] PVD is the abbreviation of Physical Vapor Deposition (Physical Vapor Deposition), which refers to the use of low-voltage, high-current arc discharge technology under vacuum conditions to use gas discharge to evaporate the target and ionize the evaporated material and gas. Using the acceleration of the electric field, the evaporated substance and its reaction product are deposited on the workpiece.
[0027] An SMT printed steel plate, the surface of the printed steel plate and the inner and outer layers of the holes of the steel plate are provided with a nanometer coating.
[0028] The nano-coating adopts alkoxysilane mat...
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The invention relates to an SMT printing steel plate and a manufacturing technology of the SMT printing steel plate. Nanometer coatings are arranged on the surface of the printing steel plate and the outer layer of the inner wall of each steel plate hole; the nanometer coatings are made from alkoxy silane materials. The manufacturing technology of the printing steel plate is that a PVD vacuum splattering process is adopted for the printing steel plate, the nanometer coatings are formed on the surface of the printing steel plate and the outer layer of the inner wall of each steel plate hole, wherein the nanometer coatings are made from the alkoxy silane materials. According to the SMT printing steel plate and the manufacturing technology of the SMT printing steel plate, the uneven positions of the wall of each hole of the printing steel plate can be filled flat, and surface hardness and surface tension are improved. Therefore, solder paste is not prone to being left over beside the wall of each hole when being applied. The printing steel plate with the vacuum sputtering nanometer coatings has the advantages that the quality of solder paste applying is improved, the frequency of solder paste applying is increased, the frequency of cleaning is decreased, cleaning is performed free of solvent, productivity is enhanced, the yield is improved, pollution is reduced, energy is saved, and carbon emissions are reduced.
Description
technical field [0001] The invention relates to the field of surface mount technology (SMT), and specifically refers to an SMT printed steel plate and a production process. Background technique [0002] PCB assembly process is mainly divided into two types, surface mount technology (SMT solder) and traditional wave soldering (wave solder). In the past, both surface mount technology (SMT solder) and traditional wave soldering (wave solder) all used chlorofluorocarbon (CFC) as a solvent to wash off the flux. Since January 1, 1996, the production of fluorine-chlorine After carbon (CFC), the wave soldering process has been changed from chlorofluorocarbon (CFC) to hydrochlorofluorocarbon (HCFC), water washing and no-cleaning; but in surface adhesion technology (SMT solder) On the other hand, more than 70% of the industry has changed to a no-clean process. [0003] The main process of SMT technology is to print the solder paste on the solder pad of the PCB, put the SMT parts on ...
Claims
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IPC IPC(8): H05K1/02H05K3/00
Inventor 苏雍杰卢世闵
Owner 卢世闵