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Single-bus temperature acquisition system integrated chip

A technology of temperature acquisition system and integrated chip, applied in thermometers, thermometers using electric/magnetic elements directly sensitive to heat, and electric devices, etc., can solve the problem of not being able to simultaneously realize the measurement and output of multiple groups of physical quantities, and the physical quantity of a single temperature sensor Information, low integration of multiple chip systems, etc., to achieve the effect of low power consumption, small overall size, and low price

Inactive Publication Date: 2014-01-22
黄正宇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current temperature sensor chip can only realize the output of the physical quantity information of a certain temperature sensor alone, and cannot simultaneously realize the measurement and output of multiple sets of physical quantities that can simultaneously measure multiple temperature sensors.
At present, a small number of schools and scientific research institutions have experimentally developed measurable multi-parameter sensing systems, but they are all in the research and development stage. Due to the use of multiple chips in the research and development process, the system integration is low, the stability is poor, and the transmission data error is large.
At present, there is no one that can measure the physical quantity information of multiple different temperature sensors at the same time, perform rough measurement or precise measurement calculation on multiple physical quantity information, and transmit the data information according to different customer needs; at the same time, it has a high degree of integration. , high stability, accurate transmission data, low price, and can effectively save space, reduce costs, simple wiring, long-distance communication, extremely low power consumption, small overall chip size, suitable for electric power, chemical industry, thermal power , Petroleum, petrochemical, transportation and other industrial fields, integrated chips that can monitor equipment and instruments in real time and remotely

Method used

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  • Single-bus temperature acquisition system integrated chip
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  • Single-bus temperature acquisition system integrated chip

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Example 1, figure 1 It shows the overall module schematic diagram of the multi-parameter sensing system integrated chip of the present invention;

[0037] Such as figure 1Shown: a single-bus temperature acquisition system integrated chip is composed of a substrate, the chip is welded on the substrate, and 20 pins are arranged on the chip, and it is characterized in that: part of the pins of the chip communicate with the substrate pins 3 temperature sensors are connected; the chip is equipped with a constant current drive module, a power module, a channel switching module, an analog-to-digital conversion module, a judgment output module, an output indication module, a rough measurement output module, a fine measurement output module, a single data bus, The adjustable clock module and the control mode module are connected with each other through electrical connection.

[0038] A single-bus temperature acquisition system integrated chip, wherein the connection relationsh...

Embodiment 2

[0068] Example 2, figure 1 It shows the overall module schematic diagram of the multi-parameter sensing system integrated chip of the present invention;

[0069] Such as figure 1 Shown: a single-bus temperature acquisition system integrated chip is composed of a substrate, the chip is welded on the substrate, and 16 pins are arranged on the chip, and it is characterized in that: part of the pins of the chip connect with the substrate pins 2 temperature sensors are connected; the chip is equipped with a constant current drive module, a power module, a channel switching module, an analog-to-digital conversion module, a judgment output module, an output indication module, a rough measurement output module, a fine measurement output module, a single data bus, The adjustable clock module and the control mode module are connected with each other through electrical connection.

[0070] A single-bus temperature acquisition system integrated chip, wherein the connection relationship ...

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PUM

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Abstract

The invention discloses a single-bus temperature acquisition system integrated chip, and relates to a semiconductor integrated circuit. The single-bus temperature acquisition system integrated chip is composed of a substrate on which a chip is welded. The chip is provided with a plurality of pins. The single-bus temperature acquisition system integrated chip is characterized in that: partial pins of the chip are connected with more than one temperature sensor through a substrate pin; the chip is provided with a constant-current driving module, a power module, a channel switching module, an analog-to-digital conversion module, a decision output module, an output indicating module, a rough measurement output module, an accurate measurement output module, a single data bus, an adjustable clock module and a control mode module; and the functional modules are connected in an electrical connecting manner. Physical quantity information of a plurality of different temperature sensors can be measured simultaneously. After performing rough measurement calculation or accurate measurement calculation on a plurality of pieces of physical quantity information, the data information is transmitted according to different client requirements. The single-bus temperature acquisition system integrated chip has the following functions: cost reduction, simple wiring, capability of realizing long-distance communication, and ultralow power consumption.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit, specifically a single-bus temperature acquisition system integrated chip capable of simultaneously collecting, processing and transmitting data of different temperature physical parameters through a system integrated chip. Background technique [0002] Traditional temperature sensors have many limitations, and can only provide analog signal output, and in most applications, the output terminal needs to be equipped with a comparator, digital-to-analog converter, or amplifier. Therefore, it is also restricted by the packaging volume and accuracy, which limits its application in miniaturized high-end electronic products. With the development of integrated technology, the semiconductor integrated temperature sensor integrates the components in the auxiliary circuit on a chip, which has the advantages of low price, simple design, accurate measurement, high integration, etc., and has been widely us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/16
Inventor 黄正宇
Owner 黄正宇
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