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Halogen-free epoxy resin composition for IC packaging

A technology based on epoxy resin and epoxy resin, which is applied in the direction of electrical components, circuits, and electrical solid devices, can solve the problems of IC packaging development limitations, and achieve improved flame retardancy, good electrical properties, and high glass transition temperature Effect

Active Publication Date: 2014-02-05
ITEQ DONGGUAN
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary FR-4 epoxy system substrates are difficult to meet this demand due to their high expansion coefficient, and special resin systems such as bis-triazine resin (BT), polyphenylene ether (PPE) resin, polytetrafluoroethylene Although (PTFE) resin has an excellent expansion coefficient, its price is much higher than that of ordinary substrates and the special processing technology limits the further development of IC packaging. Therefore, the development of a low-cost IC packaging substrate has become a Urgent market demand

Method used

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  • Halogen-free epoxy resin composition for IC packaging
  • Halogen-free epoxy resin composition for IC packaging
  • Halogen-free epoxy resin composition for IC packaging

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Embodiment Construction

[0033] A halogen-free epoxy resin composition for IC packaging, comprising:

[0034] (A) epoxy resin

[0035] A1: Naphthalene ring epoxy resin

[0036] A2: Tetramethylbiphenyl epoxy resin

[0037] A3: Trifunctional epoxy resin

[0038] A4: BPA type epoxy resin

[0039] (B) Thermosetting resin mainly composed of a compound containing dihydrobenzoxazine

[0040] B1: Phenolphthalein type benzoxazine resin

[0041] B2: BPA type benzoxazine resin

[0042] (C) Phenolic resin

[0043] C1: Phosphorus-containing phenolic resin

[0044] C2: Novolac resin

[0045] (D) Accelerator

[0046] D: Diethyltetramethylimidazole

[0047] (E) Coupling agent

[0048] E: Silane coupling agent

[0049] (F) Inorganic filler

[0050] F1: fused silica

[0051] F2: spherical silica

[0052] Dissolve and mix the above resins according to the proportions in Table 1, then soak and coat on the reinforcing material glass fiber cloth, bake in an oven at 171°C for 3-5min to obtain a prepreg, and...

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Abstract

The invention discloses a halogen-free epoxy resin composition for IC packaging. The resin composition includes a multifunctional epoxy resin, a benzoxazine resin, a phosphorus-containing curing agent, an inorganic filler, a curing accelerator and a solvent. Resins having good rigidity and toughness and the inorganic filler, which are contained in the composition, endow the composition with a low expansion coefficient and an excellent heat resistance, so a plywood made by using the composition is suitable for an IC packaging substrate, is a halogen-free compound, and has a flame retardation level of UL94-V0 level.

Description

technical field [0001] The invention relates to a halogen-free epoxy resin composition for IC packaging. Background technique [0002] With the further development of the digital age, it has become a trend for electronic products to be thin, light, small, and high-speed. For PCBs, this means that the size of thin thin-line small holes is accurate, the performance is stable, and the cost is low. Guided by this trend Under the background, the IC packaging technology of PCB has also made great progress, from the through-hole insertion (PTH Insertion) before the 1980s, to the surface mount SMT method from 1980 to 1993, and then to the BGA, CSP and BGA. FC and LGA-based construction methods. However, with the development of packaging technology, the requirements for IC packaging substrates are getting higher and higher. [0003] In order to meet the technological development requirements of miniaturization, high density, and high frequency, the materials used for IC substrates ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/32C08G59/24C08G59/62C08G59/40C08G73/06C08L63/00H01L23/29
Inventor 唐锋朱全胜翁宗烈蒋勇新李海林涂发全
Owner ITEQ DONGGUAN
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