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Halogen-free high frequency resin composition

A resin composition and high-frequency technology, which is applied in the direction of synthetic resin layered products, layered products, chemical instruments and methods, etc., can solve the problems of heat resistance limiting the development of HDI, substrate explosion, and low bond energy. Achieve the effects of improving processing stability and reliability, low dielectric constant, and low water absorption

Active Publication Date: 2014-02-05
ITEQ DONGGUAN
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Problems solved by technology

[0004] On the other hand, due to the traditional lead-free high-frequency printed circuit boards, bromine is generally used for flame retardancy. However, due to the existence of the carbon-bromine bond (C-Br), the carbon-bromine bond (C-Br) itself can Low, easy to break under high temperature conditions, causing the base material to burst
Therefore, in the process of circuit board processing, the lack of heat resistance has become more and more obvious, especially the current HDI (High Density Circuit) process has higher and higher requirements, and the lack of heat resistance greatly limits the development of HDI technology , especially high frequency HDI

Method used

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Embodiment Construction

[0027] For the above-mentioned relevant properties, it can be illustrated and described according to the following examples and comparative examples, including the following examples 1-7 and comparative examples 1-3.

[0028] The proportion of related substances is based on 100 parts by weight of organic substances such as A1, A2, A3, B1, B2, C1, C2, and D in the components, and the proportion of other components is the proportion of the total weight of the organic substances.

[0029] (A1) Styrene-maleic anhydride copolymer SMA-EF30(m:n=3:1)

[0030] (A2) Phenolphthalein-type benzoxazine

[0031] (A3) Bisphenol A benzoxazine

[0032] (B1) Dicyclopentadiene type (DCPD modified) epoxy resin

[0033] (B2) Trifunctional epoxy resin

[0034] (C1) Phosphorus-containing phenolic resin

[0035] (C2) Phosphate

[0036] (D) Fused Silica Powder

[0037] The structural formula of this trifunctional epoxy resin is as follows:

[0038]

[0039] The laminate base material of...

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Abstract

The invention discloses a halogen-free high frequency resin composition. The halogen-free high frequency resin composition comprises, by weight, 20-50 parts of a dicyclopentadiene type epoxy resin, 10-40 parts of a styrene-maleic anhydride copolymer, 10-30 parts of a benzooxazine resin, 5-20 parts of a multifunctional epoxy resin and 20-40 parts of at least one phosphorus-containing fire retardant. A copper-clad plate made by using the halogen-free high frequency resin composition has the characteristics of low dielectric constant, low dielectric loss, high heat resistance, low hygroscopic coefficient, low expansion coefficient, good PCB processability and the like.

Description

technical field [0001] The invention relates to a halogen-free high-frequency resin composition. Background technique [0002] In February 2003, the European Union promulgated two directives, RoHs and WEE. The former is a directive on the restriction and prohibition of the use of certain toxic and hazardous substances and elements in electrical and electronic equipment, and the latter is a directive on the recycling of waste electrical and electronic equipment. The WEEE directive came into effect in August 2005, and the RoHs directive came into effect in July 2006. In order to pass this new standard, the use of traditional halogen-based flame retardant materials must be gradually reduced or even eliminated. In addition, when halogen-containing flame retardants or resins are burned, a large amount of smoke and toxic and corrosive gases are generated, which are harmful to human body and The surrounding environment is very harmful. In particular, the European Union has introd...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L35/06C08L79/04C08K5/521C08K3/36B32B27/04
Inventor 李海林涂发全翁宗烈蒋勇新唐锋朱全胜
Owner ITEQ DONGGUAN
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