A kind of pcb through-hole blind hole electroplating copper solution and its preparation method and electroplating method

A technology of electroplating copper and solution, which is applied in the direction of electrical connection formation of printed components

Inactive Publication Date: 2016-06-22
东莞市富默克化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The electroplating solution in the prior art can only electroplate one of PCB through holes or PCB blind holes. At present, there is no common solution for electroplating PCB through holes and PCB blind holes on the market.

Method used

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  • A kind of pcb through-hole blind hole electroplating copper solution and its preparation method and electroplating method
  • A kind of pcb through-hole blind hole electroplating copper solution and its preparation method and electroplating method
  • A kind of pcb through-hole blind hole electroplating copper solution and its preparation method and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] A copper electroplating solution for through-hole blind holes of PCB, each component and content thereof of the copper electroplating solution are:

[0092] Copper sulfate pentahydrate: 100g / L

[0093] Sulfuric acid: 100g / L

[0094] Chloride ion: 30ppm

[0095] Brightener: 5g / L

[0096] Carrier: 3g / L

[0097] Leveling agent: 2g / L

[0098] The balance of deionized water;

[0099] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1:1.

[0100] The brightener is a mixture of sodium 3-mercapto-1-propanesulfonate and ethylene thiourea with a weight ratio of 1.5:1; the carrier is made of polyethylene glycol with a molecular weight of 5000 and A mixture of polypropylene glycol in a weight ratio of 1.8:1.

[0101] The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.2:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Vinyl-N'-bu...

Embodiment 2

[0120] A copper electroplating solution for through-hole blind holes of PCB, each component and content thereof of the copper electroplating solution are:

[0121] Copper sulfate pentahydrate: 140g / L

[0122] Sulfuric acid: 120g / L

[0123] Chloride ion: 45ppm

[0124] Brightener: 15g / L

[0125] Carrier: 10g / L

[0126] Leveling agent: 5g / L

[0127] The balance of deionized water;

[0128] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.17:1.

[0129] The brightener is a mixture of sodium 3-mercapto-1-propanesulfonate and ethylene thiourea in a weight ratio of 2:1; the carrier is made of polyethylene glycol with a molecular weight of 8000 and A mixture of polypropylene glycol in a weight ratio of 2:1.

[0130] The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.5:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Vinyl-N'-but...

Embodiment 3

[0149] A copper electroplating solution for through-hole blind holes of PCB, each component and content thereof of the copper electroplating solution are:

[0150] Copper sulfate pentahydrate: 220g / L

[0151] Sulfuric acid: 180g / L

[0152] Chloride ion: 80ppm

[0153] Brightener: 35g / L

[0154] Carrier: 20g / L

[0155] Leveling agent: 15g / L

[0156] The balance of deionized water;

[0157] And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1.22:1.

[0158] The brightener is a mixture of sodium 3-mercapto-1-propanesulfonate and ethylene thiourea with a weight ratio of 2.5:1; the carrier is made of polyethylene glycol with a molecular weight of 10000 and A mixture of polypropylene glycol in a weight ratio of 2.2:1.

[0159] The leveling agent is a mixture of leveling agent A and leveling agent B with a weight ratio of 1.8:1; wherein, the leveling agent A is a polyvinylimidazolium quaternary ammonium compound, and the leveling agent B is N- Viny...

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PUM

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Abstract

The present invention relates to the technical field of PCB electroplating, in particular to a copper electroplating solution for PCB through-hole blind holes and its preparation method and electroplating method. L. Sulfuric acid: 100~200g / L, Chloride ion: 30~100ppm, Brightener: 5~50g / L, Carrier: 3~30g / L, Leveling agent: 2~20g / L, Deionized water balance ; And the concentration ratio of copper sulfate pentahydrate to sulfuric acid is 1~1.25:1. The electroplating method of the present invention is as follows: putting the PCB board with the through hole and the blind hole into the electroplating tank equipped with the electroplating copper solution and performing electroplating under air stirring to obtain the copper plating layer. The depth capability of the copper plating layer by this method is good, reaching more than 92%, and the hole filling rate is high, reaching more than 96%. The copper plating layer is dense and smooth, has good ductility, good gloss, high toughness, and low internal stress.

Description

technical field [0001] The invention relates to the technical field of PCB electroplating, in particular to a copper electroplating solution for PCB through-hole blind holes, a preparation method thereof, and an electroplating method. Background technique [0002] During the production process of printed circuit board (PCB), through holes and blind holes will be made. Through holes are drilled with mechanical drills and drill pins. Blind holes are ablated by laser drilling machines. Through holes It is used to realize the conduction interconnection between any layers in the multilayer board, and the blind hole is used to realize the conduction interconnection between the outer layer and the sublayer in the multilayer board. [0003] In the follow-up copper sulfate electroplating technology of printed circuit board (PCB), the requirements for electroplating for through holes and blind holes on the circuit board are different. , in order to improve the deep plating ability (t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D7/00H05K3/42
Inventor 王维仁伊洪坤
Owner 东莞市富默克化工有限公司
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