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Fiber laser device and cutting method for cutting sapphire glass

A technology of sapphire glass and fiber laser, applied in glass manufacturing equipment, laser welding equipment, welding equipment, etc., can solve the problems of high processing cost of sapphire glass, and achieve the effects of easy absorption, faster speed and high electrical performance

Inactive Publication Date: 2014-02-19
SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is: aiming at the problem of high processing cost of the current sapphire glass, starting from the refitting of fiber laser equipment, parameter debugging of equipment, special absorbent, etc., reducing the processing cost of sapphire glass and realizing sapphire glass wide application of

Method used

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  • Fiber laser device and cutting method for cutting sapphire glass
  • Fiber laser device and cutting method for cutting sapphire glass

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for fiber laser equipment cutting sapphire glass, comprising the following steps:

[0024] (1) Place the polished sapphire glass coated with diionized water, light blocking agent and tension reducing agent on the jig, and adjust the height of the cutting head according to the thickness of the sapphire glass;

[0025] (2) The pressure of debugging and cutting nitrogen is 0.8MPa;

[0026] (3) The focus height of the debugging equipment is 10000step, the speed is 2mm / s, the pulse width is 40us, and the power is 30W;

[0027] (4) Focus the laser beam with a wavelength range of 1065um, single-mode, and continuous pulses at high magnification, so that the diameter of the beam is concentrated to 0.015mm, and it is vertically incident on the surface of the sapphire glass sample to be processed;

[0028] (5) Move the processed sapphire glass so that the surface of the sapphire glass is first ablated to form a "V" groove with an overall thickness of 1 / 8 and then cut thr...

Embodiment 2

[0032] A method for fiber laser equipment cutting sapphire glass, comprising the following steps:

[0033] (1) Place the unpolished sapphire glass coated with single-ion water plus light blocking agent and tension reducing agent on the jig, and adjust the height of the cutting head according to the thickness of the sapphire glass;

[0034] (2) The pressure of the debugging cutting gas is 1.0MPa;

[0035] (3) The focus height of the debugging equipment is 10000-15000step, the speed is 3mm / s, the pulse width is 50us, and the power is 50W;

[0036] (4) Focus the single-mode, continuous-pulse laser beam with a wavelength range of 1070um at high magnification, so that the diameter of the beam is concentrated to 0.02mm, and the laser beam is vertically incident on the surface of the sapphire glass sample to be processed;

[0037] (5) Move the processed sapphire glass to make the sapphire glass penetrate and cut at one time.

[0038]

Embodiment 3

[0040] A method for fiber laser equipment cutting sapphire glass, comprising the following steps:

[0041] (1) Place the polished sapphire glass coated with diionized water, light blocking agent and tension reducing agent on the jig, and adjust the height of the cutting head according to the thickness of the sapphire glass;

[0042] (2) The pressure of the debugging cutting gas is 1.2MPa;

[0043] (3) The focus height of the debugging equipment is 15000step, the speed is 4mm / s, the pulse width is 60us, and the power is 80W;

[0044] (4) Focus the single-mode, continuous-pulse laser beam with a wavelength range of 1078um at high magnification, so that the diameter of the beam is concentrated to 0.03mm, and it is perpendicularly incident on the surface of the sapphire glass sample to be processed;

[0045] (5) Move the processed sapphire glass so that the surface of the sapphire glass is first ablated to form a "V" groove of 1 / 4 of its overall thickness and then penetrated and ...

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Abstract

The invention discloses a fiber laser device and a cutting method for cutting sapphire glass. According to the fiber laser device, a single-mode continuous pulse fiber laser for cutting a mouth is arranged at an emitting outlet of the laser device. The cutting method includes the following steps that firstly, the sapphire glass with the surface coated by absorbing agents is placed on a jig, and the height of a cutting head is debugged according to the thickness of the sapphire glass; secondly, the pressure of cutting gas is debugged; thirdly, the focusing height, the speed, the pulse width and the power of the device are debugged; fourthly, laser beams of a single-mode continuous pulse are focused in a high power mode and vertically emitted to the surface of a sapphire glass sample to be processed; fifthly, the sapphire glass is cut. With the cutting method flaws of processed products and the processing cost can be greatly reduced. Produced sapphires are high in electrical performance, wear-resistant and free of sticking of films and other coatings.

Description

technical field [0001] The invention belongs to the field of glass cutting by laser equipment, and more specifically relates to an optical fiber laser equipment and a cutting method for cutting sapphire glass. Background technique [0002] Sapphire glass is resistant to scratches, abrasions, and corrosion, and has long been installed on world-class brand-name watches. The advantages compared with other glasses have long been understood by many people, but due to the price of the material itself and the difficulty in processing, it has not been widely used. At present, the material cost of sapphire glass has dropped from 30 times that of ordinary glass to less than 10 times. If the difficulty of processing and production can be made a breakthrough, the processing cost can be greatly reduced. The days when sapphire glass is widely used will be Not far away. [0003] In recent years, laser technology has made great progress, and breakthroughs have been made in conventional pr...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/14B23K26/064B23K26/18
CPCB23K26/14B23K26/18B23K26/38C03B33/0222
Inventor 惠国庆王华杰
Owner SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
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