High-strength bonding room temperature curing organosilicone potting adhesive for LED (light-emitting diode) and preparation method of adhesive

A technology of silicone potting glue and room temperature curing, which is applied in the direction of polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems that the mechanical properties are not up to LED packaging, easy to break, etc., and achieve simple process steps, Effects of improving mechanical properties and reducing costs

Active Publication Date: 2014-02-19
GUANGZHOU JOINTAS CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing silicone potting glue is easy to break, and its mechanical properties cannot meet the requirements of LED packaging.

Method used

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  • High-strength bonding room temperature curing organosilicone potting adhesive for LED (light-emitting diode) and preparation method of adhesive
  • High-strength bonding room temperature curing organosilicone potting adhesive for LED (light-emitting diode) and preparation method of adhesive
  • High-strength bonding room temperature curing organosilicone potting adhesive for LED (light-emitting diode) and preparation method of adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Mix tetramethylcyclotetrasiloxane, allyl glycidyl ether and vinyl trimethoxysilane in a weight ratio of 100:30:40, react at 20°C for 3 hours, and then react at 80°C for 1 hours, and then distilled off the small molecules at a temperature of 60°C and a pressure of -0.1 MPa to obtain a viscous viscous thickener in the form of light yellow oil.

[0029] Preparation of high-strength adhesive room temperature curing silicone potting compound for LED:

[0030] The encapsulant includes components A and B, wherein component A consists of vinyl-terminated silicone oil with a vinyl mass fraction of 0.16%, hydrogen-containing silicone oil with an active hydrogen mass fraction of 0.3%, and vinyl-terminated silicone oil with a vinyl mass fraction of 4%. Methyl vinyl MQ silicone resin is mixed at a weight ratio of 100:25:15 and packaged; component B consists of vinyl-terminated silicone oil with a vinyl mass fraction of 0.16%, methyl vinyl with a vinyl mass fraction of 4% Vinyl MQ s...

Embodiment 2

[0037] Mix tetramethylcyclotetrasiloxane, allyl glycidyl ether, and vinyltrimethoxysilane in a weight ratio of 100:70:80, react at 30°C for 2 hours, and then react at 60°C 2 hours. Then, the small molecules were distilled off at a temperature of 30°C and a pressure of -0.5 MPa to obtain a viscous viscous thickener in the form of light yellow oil.

[0038] Preparation of high-strength adhesive room temperature curing silicone potting compound for LED:

[0039] The encapsulant includes components A and B, wherein component A consists of vinyl-terminated silicone oil with a vinyl mass fraction of 0.23%, hydrogen-containing silicone oil with an active hydrogen mass fraction of 1.6%, and vinyl-terminated silicone oil with a vinyl mass fraction of 3%. Methyl vinyl MQ silicone resin is mixed at a weight ratio of 100:10:20 and packaged; component B consists of vinyl-terminated silicone oil with a vinyl mass fraction of 0.23%, and methyl vinyl with a vinyl mass fraction of 3%. Vinyl ...

Embodiment 3

[0046] Tetramethylcyclotetrasiloxane, allyl glycidyl ether, vinyltrimethoxysilane, and then the above raw materials were mixed uniformly in a weight ratio of 100:30:80, and reacted at 40°C for 1 hour. The reaction was further carried out at 70° C. for 3 hours. Then, the small molecules were distilled off at a temperature of 10°C and a pressure of -0.3 MPa to obtain a viscous viscous thickener in the form of light yellow oil.

[0047] The encapsulant includes components A and B, wherein component A consists of vinyl-terminated silicone oil with a vinyl mass fraction of 0.3%, hydrogen-containing silicone oil with an active hydrogen mass fraction of 0.5%, and vinyl-terminated silicone oil with a vinyl mass fraction of 2.7%. Methyl vinyl MQ silicone resin is mixed at a weight ratio of 100:55:25 and packaged; component B consists of vinyl-terminated silicone oil with a vinyl mass fraction of 0.3%, methyl vinyl with a vinyl mass fraction of 2.7% Vinyl MQ silicone resin, catalyst, a...

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Abstract

The invention discloses a high-strength bonding room temperature curing organosilicone potting adhesive for an LED (light-emitting diode), which comprises a component A and a component B. The component A is prepared by uniformly mixing terminal vinyl silicone oil, hydrogen silicone oil and methyl vinyl MO silicon resin at a weight ratio of 100:(8-100):(15-50). The component B is prepared by uniformly mixing terminal vinyl silicone oil, methyl vinyl MO silicon resin, a catalyst and a tackifier at a weight ratio of 100:(15-50):(0.02-3):(2-24). With the adoption of the methyl vinyl MO silicon resin and the tackifier, namely a hydrogenous cyclosiloxane compound containing epoxy groups and siloxane groups, the mechanical properties, a bonding property and optical properties of the room temperature curing potting adhesive are effectively improved, and a provided preparation technology has concise steps, does not require demanding equipment and therefore, is suitable for industrial production.

Description

technical field [0001] The invention relates to the field of potting glue for electronic packaging, in particular to a high-strength adhesive room-temperature-curing silicone potting glue for LEDs and a preparation method thereof. Background technique [0002] With the vigorous development of the LED lighting industry and the continuous emergence of lighting-level LED devices that require high power, high brightness, and long life, silicone materials have the advantages of good optical properties, no yellowing in high temperature environments, softness, and easy disassembly. , is gradually replacing epoxy resin as a new generation of LED packaging materials. However, the existing silicone potting glue is easy to break, and its mechanical properties cannot meet the requirements of LED packaging. In addition, the adhesiveness cannot meet the bonding requirements of LED substrates. Addition-type silicone rubber generally has no adhesiveness. If the adhesiveness can be improved...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/08C08J3/24H01L33/56
Inventor 陈中华黄志彬林坤华
Owner GUANGZHOU JOINTAS CHEM
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