Cutting-up method for plate capacitor

Abstract

The invention discloses a cutting-up method for a plate capacitor. The cutting-up method mainly comprises the steps that electroplating seed layers are formed on the upper surface and the lower surface of a dielectric layer, the electroplating seed layers are thickened to form electrode layers, the surfaces of the electrode layers are coated with photoresist, a mask plate with cutting joint patterns is manufactured according to the size of grinding machine cutting joints, two-face exposure is conducted on a workpiece, developing and photographic fixing are conducted on the exposed workpiece to form photoresist mask patterns of cutting joints, erosion is conducted on the workpiece until the dielectric layer at the cutting joints is exposed outside, a photoresist mask is removed, and the workpiece is cut up along the cutting joint positions to obtain a finished capacitor. The cutting-up method for the plate capacitor effectively reduces burr and mask layer fall-off phenomena existing during capacitor cutting, improves the cutting-up quality and yield of the plate capacitor, reduces requirements for cutting-up devices, enlarges cutting-up process window, and improves controllability of the cutting-up devices for cutting up capacitors.

Description

technical field [0001] The invention relates to a method for cutting flat capacitors. Background technique [0002] Plate capacitor is a component often used in microwave hybrid integrated circuits. The component is generally composed of a dielectric layer and metal electrodes attached to the upper and lower surfaces of the dielectric layer. [0003] The production method of the traditional flat capacitor is: first, sputter gold on the upper and lower surfaces of the processed dielectric material, then use the electroplating gold process to thicken the electrode material on both sides, and finally use a dicing machine to cut according to the relevant size of the capacitor. Deburring operation. The specific cutting method is to first paste the workpiece on the substrate or the blue film with an adhesive, and then use a grinder to cut. Due to the difference between the dielectric layer and the metal electrode material of the flat plate capacitor, the dielectric layer is gene...

AI Technical Summary

Problems solved by technology

However, due to the thermal effect of the laser, it is easy to form a recast layer at the incision of the capacitor, and the quality of the incision is far inferior to that of the grinding wheel, and the thermal effect will also have a certain impact on the physical properties of the electrode.

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