Method for preparing modified phenolic resin

A phenolic resin and modification technology, applied in the field of preparation of modified phenolic resin, can solve the problems of easy warping and twisting of molded products, fast curing speed, affecting production efficiency, etc.

Active Publication Date: 2014-03-05
山东圣泉新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the existing production process, the ordinary phenolic resin has a long curing time in the molding process, which affects its production efficiency and causes an increase in production cost, which is difficult to meet the requirements of large-scale industrial production at this stage
The phenolic resin with fast curing characteristics will only maintain fluidity for a short time due to its fast curing speed during the molding process, and the material needs to be injected into the mold under high pressure for a short time. Residual stress, and when released from the mold, the residual stress in the molded product during the cooling process makes the molded product prone to warping and twisting, resulting in a decrease in the pass rate of the molded product and an increase in the reject rate
Moreover, when the resin is injected into the mold under high pressure, spaces are often formed between the molds, and flashes are inevitably generated, which eventually forms waste and pollutes the environment.

Method used

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Examples

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preparation example Construction

[0028] The invention discloses a preparation method of modified phenolic resin, comprising the following steps:

[0029] A) under the action of a catalyst, the phenolic compound, the aldehyde compound and water are heated for the first reaction to obtain a reaction mixture;

[0030] B) under the action of a basic catalyst, the reaction mixture obtained in the above step A), phenol and formaldehyde are mixed for a second reaction to obtain a modified phenolic resin;

[0031] The catalyst is a divalent metal salt or a divalent metal oxide;

[0032] The mass ratio of the total mass of the aldehyde compound and water to the phenolic compound is (0.2-1.2): 1;

[0033] The ratio of the mass of the aldehyde compound to the total mass of the aldehyde compound and the water is (0.3-0.4):1.

[0034] In the present invention, firstly, under the action of a catalyst, the phenolic compound, the aldehyde compound and water are heated for the first reaction to obtain a reaction mixture, an...

Embodiment 1

[0075] First, put 10g of phenol, 7g of formaldehyde solution with a mass concentration of 37% and 0.1g of zinc powder into a 1L reactor, start stirring and heat to 80°C for reaction. After 1 hour of reaction, heat up to 90°C to continue the reaction. After 1 hour, the temperature was raised to 100° C. to continue the reaction. After 3 hours of reaction, a reaction mixture was obtained.

[0076] Then 100g of phenol, 120g of formaldehyde solution with a mass concentration of 37% and 1g of sodium hydroxide were added to the above reactor, stirred with the above reaction mixture until fully mixed, and finally heated to 50°C for reaction. After 4 hours of reaction, modified Phenolic resin, molecular weight Mn is 500.

[0077] The above-mentioned modified phenolic resin, epoxy resin and imidazole are mixed according to the mass ratio of 1:2:0.01 to obtain a mixture. Then above-mentioned mixture is put into long 20cm, wide 10cm, thick 3mm grinding tool, carry out hot pressing with 1...

Embodiment 2

[0082]First put 10g of phenol, 8g of formaldehyde solution with a mass concentration of 37% and 0.1g of zinc powder into a 1L reactor, start stirring and heat to 80°C for reaction. After 1 hour of reaction, heat up to 90°C to continue the reaction. After 1 hour, the temperature was raised to 100° C. to continue the reaction. After 3 hours of reaction, a reaction mixture was obtained.

[0083] Then 100g of phenol, 140g of formaldehyde solution with a mass concentration of 37% and 1g of sodium hydroxide were added to the above reactor, stirred with the above reaction mixture until fully mixed, and finally heated to 50°C for reaction. After 4 hours of reaction, modified Phenolic resin, molecular weight Mn is 480.

[0084] The above-mentioned modified phenolic resin, epoxy resin (E51 type) and imidazole are mixed according to the mass ratio of 1:2:0.01 to obtain a mixture. Then above-mentioned mixture is put into long 20cm, wide 10cm, thick 3mm grinding tool, carry out hot pressi...

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Abstract

The invention provides a method for preparing modified phenolic resin. The method comprises the following steps: heating phenolic compounds, aldehyde compounds and water to carry out a first reaction in the presence of a catalyst to obtain a reaction mixture; mixing the reaction mixture obtained in the abovementioned step with phenol and formaldehyde to carry out a second reaction in the presence of an alkaline catalyst to obtain the modified phenolic resin, wherein the catalyst is a bivalent metal salt or a divalent metal oxide. The method provided by the invention is used for preparing the modified phenolic resin with short curing time and low warpage in two steps of segmented reactions under special reaction conditions according to a special feeding sequence.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a preparation method of a modified phenolic resin. Background technique [0002] Phenolic resin is a general term for resins produced by the reaction of phenols and aldehydes in the presence of catalysts. It is the earliest industrially produced polymer material. The cured phenolic resin has good physical and chemical properties and is widely used in industries, Agriculture, national defense and national economy and other aspects. [0003] Phenolic resins are often used to make molding materials, friction materials, refractory materials, laminated materials, etc. Molding materials made of phenolic resins have excellent heat resistance, insulation and mechanical properties, especially good dimensional stability. It is widely used in aerospace, naval vessels and civil ships, firearms, electronic and electrical components, and power equipment components. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/28
Inventor 江成真李枝芳刘耀张淑娇
Owner 山东圣泉新材料科技有限公司
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