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Phenolic resin molding material, molded product, and electrical/electronic part

A technology of phenolic resin and molding materials, which is applied in the field of phenolic resin molding materials, molded products and electrical and electronic components, and can solve problems such as low thermal conductivity and misoperation of devices

Inactive Publication Date: 2014-03-26
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] On the other hand, with the miniaturization of electrical and electronic devices brought about by the high integration of semiconductor elements in recent years, the possibility of misoperation of devices caused by heat generation of elements and components is regarded as a problem. Generally, phenolic resin molding The thermal conductivity of the material is not high, so if it is used for electronic components that generate heat, for example, the generated heat cannot be efficiently diffused, and there is a possibility of malfunction of the device due to dimensional changes of the component due to thermal expansion.

Method used

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  • Phenolic resin molding material, molded product, and electrical/electronic part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3、 comparative example 1～4）

[0060] The raw material mixture having the composition described in Table 1 was melted and kneaded for 3 minutes with a heating roll at 90°C, taken out, pulverized, and pulverized into pellets to obtain a molding material.

[0061] (Evaluation method)

[0062] (1) Flame resistance

[0063] Using the molding materials obtained in Examples and Comparative Examples, test pieces of 125 mm×12.5 mm×0.16 mm and 125 mm×12.5 mm×5.0 mm were produced by compression molding. The molding conditions were mold temperature of 175° C. and curing time of 2 minutes. The flame resistance test was implemented based on UL94 using these test pieces.

[0064] (2) Mechanical strength (bending strength, flexural modulus and Charpy impact strength)

[0065] Using the molding materials obtained in Examples and Comparative Examples, bending test pieces and Charpy impact test pieces were produced by transfer molding. The molding conditions were mold temperature of 175° C. and curing time of 3 minutes. ...

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Abstract

The invention relates to a phenolic resin molding material, a molded product, and an electrical / electronic part. The phenolic resin molding material of the invention is characterized by comprising (A) phenolic resin, (B) metal hydroxide, (C) unroasted clay, (D) nitrogen compound, and (E) heat-dissipating filler. Preferably, 100 parts by mass of the phenolic resin molding material comprises 20 to 60 parts by mass of (A) phenolic resin, 2 to 20 parts by mass of (B) metal hydroxide, 1 to 20 parts by mass of (C) unroasted clay, 0.1 to 10 parts by mass of (D) nitrogen compound, and 10 to 80 parts by mass of (E) heat-dissipating filler. The molded product of the invention is characterized in that the molded product is formed by molding and curing the phenolic resin molding material.

Description

technical field [0001] The present invention relates to a phenolic resin molding material, a molded product, and an electrical and electronic component. Background technique [0002] Phenolic resin molding materials are widely used in various fields as materials with an excellent balance of mechanical strength, heat resistance, dimensional accuracy, and cost. Among them, since they are excellent in electrical insulation and heat resistance, they are also used in electrical and electronic components such as bobbins. Flame retardancy is required when used in electrical and electronic components. [0003] As a method of obtaining flame retardancy, there is a method of adding a halogen compound such as a chlorine-containing compound and / or a bromine-containing compound, or an antimony compound such as antimony trioxide. However, from the viewpoint of environmental protection, it is pointed out that it is not suitable for use, and a flame-retardant mechanism that does not conta...

Claims

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Application Information

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IPC IPC(8): C08L61/06C08K13/02C08K3/22C08K3/34C08K5/3492C08K3/38C08K3/28C08K13/06C08K9/02C08K3/08
Inventor 杂村史高小林慎一郎
Owner SUMITOMO BAKELITE CO LTD
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