Integration method of lead-less ball pin surface mounting type high-density thick-film hybrid integrated circuit
A thick-film hybrid and integrated circuit technology, applied in circuits, electrical components, electrical solid devices, etc., to achieve the effects of improving high-frequency performance, reducing volume, improving frequency characteristics and integration
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0022] Examples: The process flow of the method of the present invention is as follows Picture 11 As shown, the following processes are included:
[0023] (1) Preparation of ceramic substrate, gold paste and ruthenium resistor paste;
[0024] (2) Substrate cleaning and drying, tube and shell cleaning and drying;
[0025] (3) For printing thick film conductive tape paste, dry it at 150℃ for 10 minutes; fill in the through-hole metal paste at the same time;
[0026] (4) Printing of resistance paste, drying at 150℃ for 10min;
[0027] (5) Film formation and sintering at 850°C for 10 minutes, and the total film formation time is 35 minutes;
[0028] (6) Laser adjustment resistance;
[0029] (7) Parameter and function test;
[0030] (8) Print the aluminum oxide ceramic insulating medium paste, sinter it at a temperature of 650℃ for 60 minutes, and sinter it to form a film in a nitrogen atmosphere;
[0031] (9) Form gold solder balls by high-pressure gold wire ignition or printing gold paste a...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap