Integration method of lead-less ball pin surface mounting type high-density thick-film hybrid integrated circuit

Abstract

The invention discloses an integration method of a lead-less ball pin surface mounting type high-density thick-film hybrid integrated circuit. The method includes the steps that on a ceramic substrate, an external connecting end of the thick-film hybrid integrated circuit is directly manufactured on the bottom face of the ceramic substrate, and the external connecting end is in the type of a metal spherical surface; hybrid integration is performed on the front face of the ceramic substrate, a thick-film conduction band, a thick-film stop band, a thick-film capacitor, a thick-film inductor and the like are sealed and protected in an insulated mode through thick insulating medium films; an unpacked semiconductor chip is sealed in a coated mode and protected in a curing mode through insulating medium paste; integration is performed in a 3D vertical lamination mode, and thus the integration density is improved. The method has the advantages that size is reduced substantially; high frequency interference is weakened; the length of the conduction band is reduced, and the frequency characteristic and the integration level are improved; the integration density is improved; equipment size is shrunken, and the high frequency performance is improved; equipment and system reliability is improved. The integrated circuit produced with the method is extensive in application and suitable for the field of miniaturization, high frequency and high reliability equipment.

Description

technical field [0001] The present invention relates to an integrated circuit, more specifically, to a thick-film hybrid integrated circuit, especially to a surface-mounted thick-film hybrid integrated circuit. Background technique [0002] In the original hybrid circuit integration technology, on the ceramic substrate, the semiconductor chips and chip components are directly mounted on the thick film substrate, and then the bonding wire (gold wire or silicon aluminum wire) is used to bond the chip and the substrate. Wire bonding, the wire bonding of the substrate and the pins, completes the entire electrical connection, and finally seals the tube base and the tube cap in a specific atmosphere. The main problem existing in the integration technology of the original hybrid circuit is that the internal circuit must be packaged with the tube base and the tube cap. Because the tube base and the tube cap are bulky, the pins are long, and the inner leads connecting the pins are ma...

AI Technical Summary

Problems solved by technology

At present, there is no application for leadless ball pin surface mount high-density thick film hybrid integrated circuit

Images