System for adjusting shape and appearance of micro deep hole based on laser dual-wave combined machining

A composite processing and micro-deep hole technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of limited shape of micro-deep holes and limitations of the improvement of micro-deep hole morphology, and achieve morphology improvement, The effect of improving the morphology of micro-deep holes and adjusting the shape of micro-deep holes

Inactive Publication Date: 2014-04-02
XI AN JIAOTONG UNIV
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Problems solved by technology

For target irradiation at a single wavelength, the shape of the micro-deep hole obtained is limited, and at the same time, the improvement of the shape of the micro-deep hole is also limited

Method used

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  • System for adjusting shape and appearance of micro deep hole based on laser dual-wave combined machining

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Embodiment Construction

[0009] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0010] Referring to the accompanying drawings, a system for adjusting the shape and shape of micro-deep holes based on laser dual-wave composite processing includes a laser 1, which emits lasers of two different wavelengths, and an optical path passes through the first attenuator 2 and the first light in turn. Diaphragm 4, dichroic mirror 6, shutter 8, and lens 9 irradiate on the target 10, and another optical path passes through the second attenuator 3, the second diaphragm 5, reflector 7, dichroic mirror 6, and the second optical path in sequence. One light path converges to realize the collinearity of the two paths of light. The target 10 is fixed on the workbench 11 , and the control end of the workbench 11 is connected to the computer 12 .

[0011] The working principle of the present invention is: by adjusting the laser 1 to emit two different wavelengt...

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Abstract

The invention discloses a system for adjusting the shape and appearance of a micro deep hole based on laser dual wave combined machining. The system comprises a laser, wherein the laser emits two kinds of laser light of different wavelengths; one light path irradiates on a target by passing through a first attenuator, a first aperture, a dichroscope, a shutter and a lens in sequence, and the other light path is converged with the first light path after passing through a second attenuator, a second aperture, a reflecting mirror and the dichroscope in sequence, so that collineation of two paths of light is realized; the target is fixed on a workbench; the control end of the workbench is connected with a computer. The laser is adjusted to emit two kinds of laser light of different wavelengths, and two beams of light irradiate on the target according to different sequences and time differences, so that a micro deep hole which is completely different from a micro deep hole formed by single-wavelength laser machining is obtained finally. Meanwhile, the appearance of the micro deep hole is improved, and the system has the advantages of adjusting the shape of the micro deep hole and improving the appearance of the micro deep hole.

Description

technical field [0001] The invention belongs to the technical field of laser micromachining, and in particular relates to a system for adjusting the shape and appearance of micro-deep holes based on laser dual-wave composite processing. Background technique [0002] Since the invention of laser in the 1960s, laser technology has been widely used in various fields, such as micro / nano processing, microelectronics, radio communication, measurement system, medicine and material science, etc. Among them, laser micromachining technology has attracted more and more attention due to its superior performance. Compared with traditional mechanical processing, chemical etching or electroplating corrosion, laser micromachining is a non-contact, high-precision, A processing technology with good repeatability, small boundary influence and wide adaptability, it provides a variety of processing methods, such as etching, welding, drilling, cutting, surface melting, alloying, amorphization and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K15/08
CPCB23K26/384
Inventor 梅雪松赵万芹王文君姜歌东王恪典
Owner XI AN JIAOTONG UNIV
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