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Novel silicon wafer cutting liquid

A technology of cutting fluid and silicon wafers, which is applied in the petroleum industry, lubricating compositions, etc., can solve problems such as difficult cleaning, rough cutting surface, and low yield of cutting silicon wafers, and achieve easy cleaning, improved abrasive dispersion, and improved Yield Effect

Inactive Publication Date: 2015-06-17
ZHENJIANG GANGNAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the cutting fluid for silicon wafers in the prior art has good lubricating and thermal conductivity properties, it has the problems of low yield of silicon wafers, rough cutting surface and not easy to clean.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Novel cutting fluid for silicon wafers, consisting of 55 parts of polyethylene glycol, 10 parts of tetramethylammonium hydroxide, 31 parts of oleic acid diethanolamine, 7 parts of vulcanized grease, 4 parts of oleic acid amide, and 33 parts of water, in parts by weight According to the meter, the above-mentioned raw materials were stirred for 2 minutes at a temperature of 120 degrees at a speed of 120 r / min.

[0011] Performance index: The cutting fluid is mixed with SiC abrasive at a ratio of 1:1 by weight, and silicon wafers are cut. The number of cut slices is 2000, and the cutting yield is 97.9%. The silicon wafers are easy to clean.

Embodiment 2

[0013] Novel cutting fluid for silicon wafers, composed of 58 parts of polyethylene glycol, 13 parts of tetramethylammonium hydroxide, 31 parts of oleic acid diethanolamine, 9 parts of vulcanized grease, 3 parts of oleic acid amide, and 29 parts of water, in parts by weight According to the meter, the above-mentioned raw materials were stirred for 2 minutes at a temperature of 120 degrees at a speed of 120 r / min.

[0014] Performance index: The cutting fluid is mixed with SiC abrasive at a ratio of 1:1 by weight, and the silicon wafer is cut. The number of cut slices is 2000, and the cutting yield is 98.1%. The silicon wafer is easy to clean.

Embodiment 3

[0016] Novel cutting fluid for silicon wafers consists of 47 parts of polyethylene glycol, 11 parts of tetramethylammonium hydroxide, 28 parts of oleic acid diethanolamine, 8.5 parts of vulcanized grease, 5 parts of oleic acid amide, and 21 parts of water, in parts by weight , Stir the above-mentioned raw materials for 2 minutes at a temperature of 120 degrees at a speed of 120 r / min.

[0017] Performance index: The cutting fluid is mixed with SiC abrasive at a ratio of 1:1 by weight, and the silicon wafer is cut. The number of cut slices is 2000, and the cutting yield is 99.3%. The silicon wafer is easy to clean.

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PUM

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Abstract

The invention discloses a novel silicon wafer cutting liquid which comprises the following components in parts by weight: 40-60 parts of polyethylene glycol, 5-13 parts of tetramethylammonium hydroxide, 25-36 parts of oleic acid diethanolamide, 7-10 parts of vulcanized grease, 3-6 parts of oleamide and 20-47 parts of water. According to the novel silicon wafer cutting liquid, the grinding material dispersity can be effectively improved, and the finished product rate of silicon wafer cutting is increased and reaches 99%; in addition, a protection film can be formed on the surface of a silicon wafer, so that the surface smoothness of the finished silicon wafer is improved, the silicon wafer can be cleaned relatively easily, and the lubricating effect of the cutting liquid is improved.

Description

technical field [0001] The invention relates to a cutting fluid, in particular to a novel silicon chip cutting fluid. Background technique [0002] With the development of society and the increasingly severe energy crisis today, the development and utilization of new energy has received more and more attention from people. Solar energy is more and more popular due to its advantages of no pollution, renewable, and non-regional. The solar industry is also growing. With the maturity of the solar photovoltaic industry, the use of silicon wafers is also increasing. Since silicon wafer is a hard material, its cutting process occupies a very important position in the processing technology. The silicon wafer is supplied with abrasive mortar through the cutting line, and the cutting of the silicon wafer is realized through the principle of abrasive wear between the abrasive, the cutting line and the silicon crystal. This method can realize the cutting of multiple silicon wafers, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10M173/00C10N30/06C10N40/22
Inventor 聂金根
Owner ZHENJIANG GANGNAN ELECTRIC